JPWO2012004876A1 - 接合体およびそれを備えた半導体装置、ならびに、接合方法およびそれを用いた製造方法 - Google Patents
接合体およびそれを備えた半導体装置、ならびに、接合方法およびそれを用いた製造方法 Download PDFInfo
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Abstract
Description
また、本発明は、半導体素子と基板とを金属多孔質体を介して接合する接合方法であって、前記半導体素子と前記基板との間に前記金属多孔質体が挟まれた状態で、金属多孔質体の一方の面に接合材を介して前記半導体素子を接合し、該金属多孔質体の他方の面に接合材を介して前記基板を接合し、前記金属多孔質体が、面内方向における中心部の機械的強度が周辺部よりも高い金属多孔質体であることを特徴とする、接合方法にも関する。
図1は、本実施形態の接合体(Siダイボンドサンプル)の断面概略図を示す。図1を用いて本実施形態の接合体の製造方法を説明する。
本実施形態は、応力緩衝板を備えた本発明の接合体の一形態である。図5は本実施形態の接合体の構造を説明するための、断面概略図である。図5において、Siチップ1、基板2、金属多孔質体3a、3b、はんだ4a、4b、4c、4dは、実施の形態1で用意したものと、同じものを用いることができる。応力緩衝板を備えることにより、電気的な接続信頼性を向上出来るという利点がある。
実施例1および2は、上記実施の形態1に対応する接合体の具体例である。
図3に示されるような、2種類の異なる気孔率を有する金属多孔質体(高気孔率の金属多孔質体301および低気孔率発泡金属板302)が交互に組み合わされてなる金属多孔質体を使用した以外は、実施例1と同様にして接合体を作製した。高気孔率の金属多孔質体301としては、例えば、気孔率95%、気孔径(呼び孔径)300μmの銅発泡金属板(三菱マテリアル社製)を用いることができる。低気孔率の金属多孔質体302としては、例えば、気孔率80%、気孔径50μmの銅発泡金属板(三菱マテリアル社製)を用いることができる。
金属多孔質体として従来の気孔率が一様であるCu発泡金属板(厚さ1mm、9mm□、気孔径300μ、気孔率95%、三菱マテリアル社製)を用いた以外は、実施例1と同様にして、接合体(Siダイボンドサンプル)を試作した。
金属多孔質体を挿入せずに、基板表面に厚さ0.1mmで8mm□のソルダーペーストを印刷し、実施例1と同様の加熱条件で接合体(Siダイボンドサンプル)を試作した。
上記実施例1、実施例2、比較例1、比較例2の接合体を各10個作製し、300μm径のアルミニウムワイヤを9本づつ、図4に示すように半導体素子1の上面に設けた9個のボンディングパッド5(最表面の材質:アルミニウムあるいは金)に接合した。このようにしてワイヤボンドが施された接合体について、事前評価にて最適化された条件下で、ワイヤプルテストによるプル強度の最大値と最小値を測定した。
上記実施例1、実施例2、比較例1、比較例2のSiダイボンドサンプルを各10個試作し、―40℃と175℃との間を往復する温度サイクルを500回繰り返すヒートサイクル処理を施した後に、Siチップ下のはんだ接合部について超音波観察を行い、クラック進展率(%)を測定した結果(最大、最小、平均)を表2に示す。ここでクラック進展率は、以下のように算出した。
金属多孔質体3a,3bとして、実施例1と同様の面内方向における中心部の気孔率が周辺部よりも小さい金属多孔質体を用いて、上記実施の形態2に記載される方法により接合体を作製した。なお、応力緩衝板6としては、厚さ0.3mm、7mm□のモリブデン板(株式会社ニラコ社製)に、厚さ3μmの電解Niめっきを成膜し、さらにその上に厚さ0.08μmの電解Auめっきを成膜したものを使用した。
金属多孔質体3a,3bとして、実施例2と同様の金属多孔質体を用いた以外は実施例3と同様にして接合体を作製した。
金属多孔質体3aとして実施例1と同様の金属多孔質体を用い、金属多孔質体3bとして比較例1で用いたものと同様の金属多孔質体(面内方向に気孔率が変化していない従来の発泡金属板)を用いた以外は、実施例3と同様にして接合体を作製した。
金属多孔質体3a,3bとして、比較例1で用いたものと同様の金属多孔質体(面内方向に気孔率が変化していない従来の発泡金属板)を用いた以外は、実施例3と同様にして接合体を作製した。
発泡金属板3a,3b、はんだ4b,4dを使用せずに実施例3と同様にして接合体を作製した。
上記実施例3、実施例4、比較例3および比較例4のサンプルを各々10個づつ試作し、試験例1と同様にして初期ワイヤプル強度測定を行った結果を表4に示す。また、試験例2と同様にして―40℃と175℃との間を往復する温度サイクルを500回繰り返すヒートサイクル処理を施した後の、ワイヤプル強度の調査結果を表5(チップ下に接合されたワイヤについて)および表6(チップ上面に接合されたワイヤについて)に、クラック進展度の調査結果を表7に示す。
Claims (6)
- 半導体素子(1)と基板(2)とが金属多孔質体(3)を介して接合された接合体であって、
前記半導体素子(1)と前記基板(2)との間に前記金属多孔質体(3)が挟まれた状態で、該金属多孔質体(3)の一方の面が接合材を介して前記半導体素子(1)に接合され、該金属多孔質体(3)の他方の面が接合材を介して前記基板(2)に接合されており、
前記金属多孔質体(3)の面内方向における中心部の機械的強度が周辺部よりも高いことを特徴とする、接合体。 - 前記金属多孔質体(3)の面内方向における中心部の気孔率が周辺部よりも小さい、請求の範囲1に記載の接合体。
- 請求の範囲1に記載の接合体を備えた半導体装置。
- 半導体素子(1)と基板(2)とを金属多孔質体(3)を介して接合する接合方法であって、
前記半導体素子(1)と前記基板(2)との間に前記金属多孔質体(3)が挟まれた状態で、金属多孔質体(3)の一方の面に接合材を介して前記半導体素子(1)を接合し、該金属多孔質体(3)の他方の面に接合材を介して前記基板(2)を接合し、
前記金属多孔質体(3)が、面内方向における中心部の機械的強度が周辺部よりも高い金属多孔質体(3)であることを特徴とする、接合方法。 - 前記金属多孔質体(3)の面内方向における中心部の気孔率が周辺部よりも小さい、請求の範囲4に記載の接合方法。
- 請求の範囲4に記載の接合方法を用いた半導体装置の製造方法。
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JP2009059821A (ja) * | 2007-08-30 | 2009-03-19 | Toyota Motor Corp | 半導体装置 |
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