JPWO2011083502A1 - アンテナ及び無線装置 - Google Patents
アンテナ及び無線装置 Download PDFInfo
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- JPWO2011083502A1 JPWO2011083502A1 JP2011548852A JP2011548852A JPWO2011083502A1 JP WO2011083502 A1 JPWO2011083502 A1 JP WO2011083502A1 JP 2011548852 A JP2011548852 A JP 2011548852A JP 2011548852 A JP2011548852 A JP 2011548852A JP WO2011083502 A1 JPWO2011083502 A1 JP WO2011083502A1
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- metal
- antenna
- metal part
- antenna device
- wavelength mode
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
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Abstract
Description
本発明の第1実施形態に係る無線装置1を説明する。図1は、無線装置1の構成を示す図である。無線装置1は、アンテナ装置10と、該アンテナ装置11を介して無線通信を行う無線チップ20とを備えている。また、無線装置1は、誘電体基板30を有している。無線チップ20は誘電体基板30の一面に配置される。
図8に、第1実施形態の変形例に係る無線装置3を示す。無線装置3は、給電部32、第1,2金属部33,34、第5金属部37を有している点、地板18を有していない点を除き、図1の無線装置1と同じ構成である。なお、図8には図示していないが、無線チップ20と誘電体基板30との間に地板を設けてもよい。
図9に本発明の第2実施形態に係る無線装置4を示す。無線装置4は、アンテナ装置40の第5金属部47を除き、図1の無線装置1と同じ構成である。
図10に本発明の第3実施形態に係る無線装置5を示す。無線装置5は、アンテナ装置50の第5金属部57及びインダクタ58を除き、図1の無線装置1と同じ構成である。
図11に本発明の第4実施形態に係る無線装置6を示す。無線装置6は、アンテナ装置60の第5金属部67を除き、図1の無線装置1と同じ構成である。
図12に本発明の第5実施形態に係る無線装置7を示す。無線装置7は、誘電体78を備えている点、アンテナ装置70の第5金属部77の形状を除き、図1の無線装置1と同じ構成である。
図13に本発明の第6実施形態に係る無線装置8を示す。無線装置8は、誘電体78の代わりに金属部88を備えている点を除き図12に示す無線装置7と同じ構成である。
図14に本発明の第7実施形態に係る半導体パッケージ100を示す。半導体パッケージ100は、図14に示す無線装置8と、誘電体基板30上に設けられた金属パッチ110と、金属パッチ110と無線チップ20とを接続するボンディングワイヤ120と、誘電体基板30の裏面に設けられた半田ボール130と、を有する。誘電体基板30の表面に設けられた素子(無線チップ20、アンテナ装置80、金属パッチ110、ボンディングワイヤ120)は封止材140によって封止されている。
図15に、本発明の第8実施形態に係る通信装置200,300を示す。通信装置200,300は、例えばノートPC、携帯電話、PDFなど、近距離通信を行う装置である。図15では、ノートPC200と携帯端末300とが通信する場合の例を示している。本実施形態に係る無線装置200,300は、図14に示す半導体パッケージ100を有している。
Claims (5)
- 給電部と、
一端が前記給電部に接続される線状の第1,2金属部と、
前記第1及び第2金属部の他端にそれぞれ接続、互いに所定の距離だけ隔てて配置される板状の第3及び第4金属部と、
前記第3金属部と前記第4金属部とを接続する第5金属部と、を有し、
前記第1乃至第5金属部を合わせた素子長が使用周波数の2分の3波長である
ことを特徴とするアンテナ装置。 - 前記第3乃至第5金属部を合わせた第1の長さが、前記素子長の4分の1以上、4分の3以下であることを特徴とする請求項1記載のアンテナ装置。
- 前記第5金属部は、
直線状の第1素子と、
一端が前記第3金属部に接続され他端が前記第1素子の一端に接続された線状の第2素子と、
一端が前記第4金属部に接続され他端が前記第1素子の他端に接続された線状の第3素子と、を有し、
前記第1素子の素子長は、前記第3金属部と前記第4金属部との間の前記距離よりも長い
ことを特徴とする請求項2記載のアンテナ装置。 - 誘電体基板と、
前記誘電体基板の一面に設置された無線チップと、
前記無線チップ上に設けられた給電部と、一端が前記給電部に接続され、前記一面に形成された線状の第1及び第2金属部と、前記第1及び第2金属部の他端にそれぞれ接続され、前記一面に形成された板状の第3及び第4金属部と、一端が前記第3金属部に、他端が前記第4金属部に接続され、前記一面に形成された第5金属部と、を有し、前記第1乃至第5金属部を合わせた素子長が使用周波数の2分の3波長であるアンテナ装置と、
を備えることを特徴とする無線装置。 - 前記誘電体基板の内部又は前記誘電体基板の前記一面に対向する第2面であって、前記一面を中心に前記第5金属部と対向するように設けられた第6金属部をさらに有することを特徴とする請求項4の無線装置。
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PCT/JP2010/000007 WO2011083502A1 (ja) | 2010-01-05 | 2010-01-05 | アンテナ及び無線装置 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5172925B2 (ja) | 2010-09-24 | 2013-03-27 | 株式会社東芝 | 無線装置 |
JP5417389B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
JP5414749B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
JP5930917B2 (ja) * | 2012-09-05 | 2016-06-08 | 日精株式会社 | 基板型アンテナ |
JP6121705B2 (ja) | 2012-12-12 | 2017-04-26 | 株式会社東芝 | 無線装置 |
KR102032907B1 (ko) * | 2013-04-22 | 2019-10-16 | 삼성전자주식회사 | 반도체 소자, 반도체 패키지 및 전자 시스템 |
JPWO2014196143A1 (ja) * | 2013-06-04 | 2017-02-23 | パナソニックIpマネジメント株式会社 | 無線モジュール |
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EP0584882A1 (en) * | 1992-08-28 | 1994-03-02 | Philips Electronics Uk Limited | Loop antenna |
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2010
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- 2010-01-05 JP JP2011548852A patent/JP5480299B2/ja active Active
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WO2011083502A1 (ja) | 2011-07-14 |
US9245866B2 (en) | 2016-01-26 |
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US20120319913A1 (en) | 2012-12-20 |
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