JPWO2009063703A1 - 沸騰冷却装置 - Google Patents
沸騰冷却装置 Download PDFInfo
- Publication number
- JPWO2009063703A1 JPWO2009063703A1 JP2009541074A JP2009541074A JPWO2009063703A1 JP WO2009063703 A1 JPWO2009063703 A1 JP WO2009063703A1 JP 2009541074 A JP2009541074 A JP 2009541074A JP 2009541074 A JP2009541074 A JP 2009541074A JP WO2009063703 A1 JPWO2009063703 A1 JP WO2009063703A1
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- Japan
- Prior art keywords
- heat
- boiling
- refrigerant
- porous body
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
ここで、多孔質体内部の液の浸透速度uは、以下のように表される。
次に、本発明にかかる実施の形態について、具体的な冷媒と、図1、図2を参照して詳細に説明する。図1は、本実施形態にかかる沸騰冷却器に基づく多孔質ブロック断面積と気孔径の関係を示す図である。図2は、本実施形態にかかる沸騰冷却器の構成の一例を示す図である。
図3を用いて、本発明にかかる第2の実施の形態について説明する。図3は、横向き動作が可能な構造の概略図が示されている。
図5を用いて本発明にかかる第3の実施の形態について説明する。
2 放熱部
3 発熱体
4 多孔質ブロック
5 冷媒循環経路
6 冷却ファン
7 放熱フィン
8 蒸気排気口
Claims (5)
- 吸熱部と放熱部が一体形成され、内蔵された冷媒が気化/凝縮を繰り返して熱を伝える沸騰冷却装置であって、
前記吸熱部には、発熱体が設置された吸熱面から垂直方向に多孔質体が設置されていることを特徴とする沸騰冷却装置。 - 前記吸熱面に沿って多孔質体が設置されていることを特徴とする請求項1に記載の沸騰冷却装置。
- 前記多孔質体は、前記多孔質体の気孔径以上の大きさの穴が開いていることを特徴とする請求項1に記載の沸騰冷却装置。
- 前記多孔質体は、発泡体構造であることを特徴とする請求項1から3のいずれか1項に記載の沸騰冷却装置。
- 前記多孔質体の材料として胴またはアルミニウムを用いることを特徴とする請求項4に記載の沸騰冷却装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007296679 | 2007-11-15 | ||
JP2007296679 | 2007-11-15 | ||
PCT/JP2008/067862 WO2009063703A1 (ja) | 2007-11-15 | 2008-10-01 | 沸騰冷却装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2009063703A1 true JPWO2009063703A1 (ja) | 2011-03-31 |
Family
ID=40638556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009541074A Pending JPWO2009063703A1 (ja) | 2007-11-15 | 2008-10-01 | 沸騰冷却装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2009063703A1 (ja) |
WO (1) | WO2009063703A1 (ja) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5144358A (ja) * | 1974-10-15 | 1976-04-15 | Tokico Ltd | |
JP2001091172A (ja) * | 1999-09-21 | 2001-04-06 | Fujikura Ltd | 平板状ヒートパイプ |
JP2001339026A (ja) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | 平板状ヒートパイプ |
JP2002022379A (ja) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | ヒートパイプ |
JP2002062067A (ja) * | 2000-08-21 | 2002-02-28 | Fujikura Ltd | 平板型ヒートパイプ |
JP2002141449A (ja) * | 2000-10-31 | 2002-05-17 | Denso Corp | 沸騰冷却器 |
JP2003155503A (ja) * | 2001-11-15 | 2003-05-30 | Mitsubishi Materials Corp | 多孔質金属体の製造方法 |
JP2006177613A (ja) * | 2004-12-22 | 2006-07-06 | Denso Corp | 沸騰冷却装置 |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
-
2008
- 2008-10-01 WO PCT/JP2008/067862 patent/WO2009063703A1/ja active Application Filing
- 2008-10-01 JP JP2009541074A patent/JPWO2009063703A1/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5144358A (ja) * | 1974-10-15 | 1976-04-15 | Tokico Ltd | |
JP2001091172A (ja) * | 1999-09-21 | 2001-04-06 | Fujikura Ltd | 平板状ヒートパイプ |
JP2001339026A (ja) * | 2000-05-29 | 2001-12-07 | Fujikura Ltd | 平板状ヒートパイプ |
JP2002022379A (ja) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | ヒートパイプ |
JP2002062067A (ja) * | 2000-08-21 | 2002-02-28 | Fujikura Ltd | 平板型ヒートパイプ |
JP2002141449A (ja) * | 2000-10-31 | 2002-05-17 | Denso Corp | 沸騰冷却器 |
JP2003155503A (ja) * | 2001-11-15 | 2003-05-30 | Mitsubishi Materials Corp | 多孔質金属体の製造方法 |
US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
JP2006177613A (ja) * | 2004-12-22 | 2006-07-06 | Denso Corp | 沸騰冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2009063703A1 (ja) | 2009-05-22 |
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