WO2009063703A1 - 沸騰冷却装置 - Google Patents

沸騰冷却装置 Download PDF

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Publication number
WO2009063703A1
WO2009063703A1 PCT/JP2008/067862 JP2008067862W WO2009063703A1 WO 2009063703 A1 WO2009063703 A1 WO 2009063703A1 JP 2008067862 W JP2008067862 W JP 2008067862W WO 2009063703 A1 WO2009063703 A1 WO 2009063703A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling apparatus
vapor cooling
heat absorbing
heat
vapor
Prior art date
Application number
PCT/JP2008/067862
Other languages
English (en)
French (fr)
Inventor
Hitoshi Sakamoto
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009541074A priority Critical patent/JPWO2009063703A1/ja
Publication of WO2009063703A1 publication Critical patent/WO2009063703A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　重力方向依存性を上下左右において排除した構造を有する沸騰冷却器を提供する。 　吸熱部と放熱部が一体形成され、内蔵された冷媒が気化／凝縮を繰り返して熱を伝える沸騰冷却装置であって、前記吸熱部には、発熱体が設置された吸熱面から垂直方向に多孔質体が設置されている。
PCT/JP2008/067862 2007-11-15 2008-10-01 沸騰冷却装置 WO2009063703A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009541074A JPWO2009063703A1 (ja) 2007-11-15 2008-10-01 沸騰冷却装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007296679 2007-11-15
JP2007-296679 2007-11-15

Publications (1)

Publication Number Publication Date
WO2009063703A1 true WO2009063703A1 (ja) 2009-05-22

Family

ID=40638556

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067862 WO2009063703A1 (ja) 2007-11-15 2008-10-01 沸騰冷却装置

Country Status (2)

Country Link
JP (1) JPWO2009063703A1 (ja)
WO (1) WO2009063703A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144358A (ja) * 1974-10-15 1976-04-15 Tokico Ltd
JP2001091172A (ja) * 1999-09-21 2001-04-06 Fujikura Ltd 平板状ヒートパイプ
JP2001339026A (ja) * 2000-05-29 2001-12-07 Fujikura Ltd 平板状ヒートパイプ
JP2002022379A (ja) * 2000-07-06 2002-01-23 Showa Denko Kk ヒートパイプ
JP2002062067A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP2002141449A (ja) * 2000-10-31 2002-05-17 Denso Corp 沸騰冷却器
JP2003155503A (ja) * 2001-11-15 2003-05-30 Mitsubishi Materials Corp 多孔質金属体の製造方法
JP2006177613A (ja) * 2004-12-22 2006-07-06 Denso Corp 沸騰冷却装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144358A (ja) * 1974-10-15 1976-04-15 Tokico Ltd
JP2001091172A (ja) * 1999-09-21 2001-04-06 Fujikura Ltd 平板状ヒートパイプ
JP2001339026A (ja) * 2000-05-29 2001-12-07 Fujikura Ltd 平板状ヒートパイプ
JP2002022379A (ja) * 2000-07-06 2002-01-23 Showa Denko Kk ヒートパイプ
JP2002062067A (ja) * 2000-08-21 2002-02-28 Fujikura Ltd 平板型ヒートパイプ
JP2002141449A (ja) * 2000-10-31 2002-05-17 Denso Corp 沸騰冷却器
JP2003155503A (ja) * 2001-11-15 2003-05-30 Mitsubishi Materials Corp 多孔質金属体の製造方法
JP2006177613A (ja) * 2004-12-22 2006-07-06 Denso Corp 沸騰冷却装置

Also Published As

Publication number Publication date
JPWO2009063703A1 (ja) 2011-03-31

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