JPWO2007119407A1 - ハニカム構造体及びそれに用いる接合材 - Google Patents
ハニカム構造体及びそれに用いる接合材 Download PDFInfo
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- JPWO2007119407A1 JPWO2007119407A1 JP2008510805A JP2008510805A JPWO2007119407A1 JP WO2007119407 A1 JPWO2007119407 A1 JP WO2007119407A1 JP 2008510805 A JP2008510805 A JP 2008510805A JP 2008510805 A JP2008510805 A JP 2008510805A JP WO2007119407 A1 JPWO2007119407 A1 JP WO2007119407A1
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- honeycomb structure
- bonding material
- structure according
- honeycomb
- bonding
- Prior art date
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Abstract
Description
ハニカムセグメント原料として、SiC粉末及び金属Si粉末を80:20の質量割合で混合し、これに造孔剤として澱粉、発泡樹脂を加え、さらにメチルセルロース及びヒドロキシプロポキシルメチルセルロース、界面活性剤及び水を添加して、可塑性の坏土を作製した。この坏土を押出成形し、マイクロ波及び熱風で乾燥して隔壁の厚さが310μm、セル密度が約46.5セル/cm2(300セル/平方インチ)、断面が一辺35mmの正四角形、長さが152mmのハニカムセグメント成形体を得た。このハニカムセグメント成形体を、端面が市松模様状を呈するように、セルの両端面を目封じした。すなわち、隣接するセルが、互いに反対側の端部で封じられるように目封じを行った。目封じ材としては、ハニカムセグメント原料と同様な材料を用いた。セルの両端面を目封じし、乾燥させた後、大気雰囲気中約400℃で脱脂し、その後、Ar不活性雰囲気で約1450℃で焼成して、SiC結晶粒子をSiで結合させた、多孔質構造を有するハニカムセグメントを得た。
無機粒子として平均径2μmのSiC粉末40質量%、無機バインダーとしてシリカゲル40質量%水溶液を30質量%、粘土を1質量%、生体溶解性ファイバーとして表2に示す特性を有するものを29質量%混合した。得られた混合物に、水を加えてミキサーを用いて30分間混練を行い、表1に示す組成、特性の接合材A〜Fを得た。また、同じ量比にて、生体溶解性ファイバーの代わりに、従来のハニカム構造体の製造に用いられるアルミノシリケート質ファイバーを混合した接合材Gと、アルミナ質ファイバーを混合した接合材Hを得た。これらのファイバーの平均径は5μm、平均長さは50μmであった。
次に、表1に示す接合材(接合材A〜H)を用いてハニカムセグメントを16本接合し、200℃、2時間乾燥した後に、外周部を円筒状に研削し、そこにコーティング材を施し500℃にて2時間熱処理することにより、ハニカム構造体(実施例1〜6、及び比較例1,2)を得た。
これらのハニカム構造体(実施例1〜6、及び比較例1,2)をディーゼルエンジンの排気管に取り付け、スートを8g/L貯め、ハニカム構造体の中心部が1200℃となるようなスート再生を行った。試験後のハニカム構造体に対し、ハニカムセグメントおよび接合層の外観を光学顕微鏡にて観察するとともに、接合層の一部を切り出し、SEMにてファイバーの形状を確認した。また、所定の強度試験用サンプルを10個ずつ切り出し、JIS R 1601に従って3点曲げ接合強度の測定を行った。その評価結果を表2に示す。
実施例1に用いた接合材Aと同一の組成であり、表3及び表4に示すような形状の生体溶解性ファイバーに、表3及び表4に示すような配合となるように、有機バインダー、発砲樹脂、分散剤等を加えて、接合材A−1〜A−18を調製した。表3及び表4に、接合材A−1〜A−18の配合処方を示す。この接合材A−1〜A−18によって形成された接合層から切り出したサンプルを用いて、接合層の気孔率(%)と嵩密度(g/cm3)とを測定した。なお、接合層の気孔率と嵩密度とは、アルキメデス法によって測定した。
次に、表5及び表6に示す接合材(接合材A−1〜A−18)を用いてハニカムセグメントを16本接合し、200℃、2時間乾燥した後に、外周部を円筒状に研削し、そこにコーティング材を施し500℃にて2時間熱処理することにより、ハニカム構造体(実施例7〜27)を得た。
表2から、人体への影響を考慮せずに使用可能な、生体溶解性ファイバーを用いても実使用に耐えうるハニカム構造体が得られることが判明した。加えて、実施例1、2では、従来用いられるセラミックファイバーと同等の特性を有するハニカム構造体を得ることができることも分かった。また、実施例7〜18のハニカム構造体は、B−sp試験、E−sp試験、及びE/G試験の全てにおいて特に良好な結果を示すものであった。
Claims (19)
- 多孔質の隔壁によって区画された流体の流路となる複数のセルを有するセル構造体と、前記セル構造体の外周に配設された多孔質の外壁とを備えたハニカムセグメントの複数個が、これらの前記外壁どうしが接合材で接合されることにより一体化されてなる、セラミックスからなるハニカム構造体において、前記接合材が、生体溶解性ファイバーを含むハニカム構造体。
- 前記生体溶解性ファイバーが1200℃以上の温度において耐熱性を有する請求項1に記載のハニカム構造体。
- 前記生体溶解性ファイバーが、60〜95質量%のSiO2を含むものである請求項1又は2に記載のハニカム構造体。
- 前記生体溶解性ファイバーのアルカリ金属酸化物の含有量が2質量%以下である請求項1〜3のいずれかに記載のハニカム構造体。
- 前記接合材が、無機粒子、及び/又はコロイド状酸化物を更に含むものである請求項1〜4のいずれかに記載のハニカム構造体。
- 前記接合材に含まれる前記無機粒子が炭化珪素である請求項5に記載のハニカム構造体。
- 前記接合材が、無機バインダーを更に含む請求項1〜6のいずれかに記載のハニカム構造体。
- 前記接合材が、有機バインダーを更に含む請求項1〜7のいずれかに記載のハニカム構造体。
- 前記生体溶解性ファイバーの平均長さが10〜600μmであり、且つその平均径が0.1〜10μmである請求項1〜8のいずれかに記載のハニカム構造体。
- 前記接合材として用いられる接合材スラリーのpHが、0.5〜10である請求項1〜9のいずれかに記載のハニカム構造体。
- 前記接合材の4点曲げ強度が100〜3000kPaである請求項1〜10のいずれかに記載のハニカム構造体。
- 前記接合材の圧縮ヤング率が5〜500MPaである請求項1〜11のいずれかに記載のハニカム構造体。
- 前記接合材の熱伝導率が0.1〜10W/mKである請求項1〜12のいずれかに記載のハニカム構造体。
- 前記接合材の熱膨張係数が1×10−6〜8×10−6/Kである請求項1〜13のいずれかに記載のハニカム構造体。
- 前記接合材の熱容量が400〜4500Jm3/Kである請求項1〜14のいずれかに記載のハニカム構造体。
- 前記接合材の気孔率が17〜70%である請求項1〜15のいずれかに記載のハニカム構造体。
- 前記接合材の密度が0.5〜3g/cm3である請求項1〜16のいずれかに記載のハニカム構造体。
- 前記接合材によって形成される層の厚さが0.1〜5mmである請求項1〜17のいずれかに記載のハニカム構造体。
- 耐熱性が1200℃以上であり、SiO2が60〜95質量%含まれる生体溶解性ファイバーを含有するセラミック接合材。
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