JPWO2004105141A1 - 電極線材およびその線材によって形成された接続用リード線を備えた太陽電池 - Google Patents
電極線材およびその線材によって形成された接続用リード線を備えた太陽電池 Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 93
- 239000011162 core material Substances 0.000 claims abstract description 62
- 238000007747 plating Methods 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 229910000640 Fe alloy Inorganic materials 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 43
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 16
- 230000008018 melting Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 5
- 229910017709 Ni Co Inorganic materials 0.000 claims description 4
- 229910003267 Ni-Co Inorganic materials 0.000 claims description 4
- 229910003262 Ni‐Co Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 8
- 229910001374 Invar Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 229910001152 Bi alloy Inorganic materials 0.000 description 3
- 229910000846 In alloy Inorganic materials 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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Abstract
Description
この電極線材によれば、電極線材の芯材には、溶融はんだ収容用凹部が形成されるので、前記凹部に供給された溶融はんだが凝固する際、溶融はんだに表面張力が働いても溶融はんだの中央部は膨らみ難く、前記溶融はんだめっき層は平坦状になりやすい。このため、半導体基板のはんだ帯などの被はんだ付け部に前記溶融はんだめっき層が当接するように電極線材を被はんだ付け部の表面に載置すれば、被はんだ付け部と溶融はんだめっき層との接触領域は従来の山形の溶融はんだめっき層に比して広くなり、熱電導性が向上する。このため、電極線材のはんだ付け性が向上し、優れた接合性が得られる。
この太陽電池によれば、溶融はんだ収容用凹部により平坦化された溶融はんだめっき層によって前記電極線材を半導体基板の表面電極にはんだ付けし、その電極線材によって接続用リード線を構成したものであるから、半導体基板に対し接続用リード線が強固に接合し、半導体基板から外れにくく、耐久性に優れる。
また、本発明の太陽電池によれば、前記電極線材を用いて溶融はんだ収容用凹部に充填形成した溶融はんだめっき層を半導体基板の複数の表面電極にはんだ付けすることによって接続用リード線を構成したので、接続用リード線は半導体基板に強固にはんだ接合され、半導体基板から外れ難いため、取り扱い性、耐久性が向上する。
[図2]本発明の他の実施形態にかかる電極線材の横断面図である。
[図3]本発明の他の実施形態にかかる電極線材の横断面図である。
[図4]本発明の実施形態にかかる太陽電池の概略斜視図である。
[図5]従来の電極線材の横断面図である。
このため、前記凹部6をほぼ満たすように溶融はんだを充填供給することによって、前記芯材2の幅全体に渡って前記凹部6に収容された溶融はんだの表面、引いては凝固後の溶融はんだめっき層5Aの表面を容易に平坦化することができる。
前記凹部6をほぼ満たすように溶融はんだを充填供給するには、溶融はんだめっきを行う際に溶融はんだ浴温、めっき速度を適宜制御することにより、あるいは芯材2を溶融はんだ浴に浸漬して引き上げた後に、凹部6の開口部から盛り上がった余分な溶融はんだを熱風の吹き付けによって除去したり、適宜のかき取り部材によってかき取り除去することによって行うことができる。
Claims (8)
- 帯板状の導電材で形成された芯材と、前記芯材の表面に積層形成された溶融はんだめっき層を備えた電極線材であって、
前記芯材は長さ方向に沿って溶融はんだ収容用凹部が形成され、前記溶融はんだめっき層は前記凹部に充填形成された電極線材。 - 前記溶融はんだ収容用凹部は、その芯材幅方向の開口幅が前記芯材の幅の90%以上である請求項1に記載した電極線材。
- 前記溶融はんだ収容用凹部は、長さ方向に対して垂直方向の断面形状が皿状ないし湾曲状に形成された前記芯材の凹み側に形成された請求項2に記載した電極線材。
- 前記芯材は、Fe−Ni合金あるいはFe−Ni−Co合金からなる低熱膨張Fe合金で形成された中間層の両面に銅層が積層形成されたクラッド材で形成された請求項1から3のいずれか1項に記載した電極線材。
- 前記溶融はんだめっき層は、融点が130℃以上、300℃以下で、鉛を含まないはんだ材によって形成された請求項1から3のいずれか1項に記載した電極線材。
- PN接合を有する半導体で形成された半導体基板と、前記半導体基板の表面に設けられた複数の表面電極にはんだ付けされた接続用リード線を備えた太陽電池であって、
前記接続用リード線は、溶融はんだめっき層によって前記半導体基板に設けられた複数の表面電極にはんだ付けされた請求項1から3のいずれか1項に記載された電極線材によって構成された太陽電池。 - 前記電極線材の芯材は、Fe−Ni合金あるいはFe−Ni−Co合金からなる低熱膨張Fe合金で形成された中間層の両面に銅層が積層形成されたクラッド材で形成された請求項6に記載した太陽電池。
- 前記電極線材の溶融はんだめっき層は、融点が130℃以上、300℃以下で、鉛を含まないはんだ材によって形成された請求項6に記載した太陽電池。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003144205 | 2003-05-22 | ||
JP2003144205 | 2003-05-22 | ||
PCT/JP2004/006725 WO2004105141A1 (ja) | 2003-05-22 | 2004-05-19 | 電極線材およびその線材によって形成された接続用リード線を備えた太陽電池 |
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JPWO2004105141A1 true JPWO2004105141A1 (ja) | 2006-07-20 |
JP4565650B2 JP4565650B2 (ja) | 2010-10-20 |
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JP2005506335A Expired - Fee Related JP4565650B2 (ja) | 2003-05-22 | 2004-05-19 | 電極線材およびその製造方法並びに前記電極線材によって形成された接続用リード線を備えた太陽電池 |
Country Status (6)
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US (2) | US20070062574A1 (ja) |
EP (1) | EP1626443B1 (ja) |
JP (1) | JP4565650B2 (ja) |
KR (1) | KR101072127B1 (ja) |
CN (1) | CN100474636C (ja) |
WO (1) | WO2004105141A1 (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602005022299D1 (de) * | 2004-03-31 | 2010-08-26 | Sanyo Electric Co | Verfahren zur herstellung einer solarzelle |
JP4617884B2 (ja) * | 2005-01-06 | 2011-01-26 | 日立電線株式会社 | 接続用リード線およびその製造方法 |
JP4683466B2 (ja) * | 2005-03-02 | 2011-05-18 | 株式会社Neomaxマテリアル | 太陽電池用電極接続線材及びその線材によって接続された太陽電池 |
AT502005B1 (de) * | 2005-06-01 | 2007-03-15 | Outokumpu Copper Neumayer Gmbh | Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement |
JP5036545B2 (ja) * | 2005-09-28 | 2012-09-26 | 株式会社Neomaxマテリアル | 太陽電池用電極線材の製造方法 |
JP4993916B2 (ja) * | 2006-01-31 | 2012-08-08 | 昭和シェル石油株式会社 | Inハンダ被覆銅箔リボン導線及びその接続方法 |
US20090272577A1 (en) * | 2006-04-27 | 2009-11-05 | Neomax Materials Co., Ltd. | Clad material for wiring connection and wiring connection member processed from the clad material |
JP5073386B2 (ja) * | 2007-07-05 | 2012-11-14 | 株式会社Neomaxマテリアル | 太陽電池用電極線材、その基材および基材の製造方法 |
JP5161734B2 (ja) * | 2008-02-13 | 2013-03-13 | 日立電線株式会社 | 太陽電池用リード線及びその製造方法並びに太陽電池 |
JP2010016320A (ja) | 2008-04-15 | 2010-01-21 | Hitachi Cable Ltd | 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池 |
JP5407061B2 (ja) * | 2008-04-15 | 2014-02-05 | 日立金属株式会社 | 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池 |
JP4838827B2 (ja) * | 2008-07-02 | 2011-12-14 | シャープ株式会社 | 太陽電池モジュールおよびその製造方法 |
JP5221231B2 (ja) * | 2008-07-18 | 2013-06-26 | 日立電線株式会社 | 太陽電池用リード線の製造方法 |
CN101740642B (zh) * | 2008-11-11 | 2013-03-06 | 日立电线株式会社 | 太阳电池用引线及其制造方法以及太阳电池 |
JP5824214B2 (ja) * | 2008-11-27 | 2015-11-25 | 日立金属株式会社 | 太陽電池用リード線の保管方法 |
DE102008044354B4 (de) * | 2008-12-04 | 2012-05-24 | Q-Cells Se | Solarzellensystem, Solarzellenmodul und Verfahren zur Herstellung eines Solarzellensystems |
JP5362379B2 (ja) * | 2009-02-06 | 2013-12-11 | 三洋電機株式会社 | 太陽電池のi−v特性の測定方法 |
JP2010205792A (ja) * | 2009-02-27 | 2010-09-16 | Hitachi Cable Ltd | 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池 |
TWI483403B (zh) * | 2010-04-02 | 2015-05-01 | Gintech Energy Corp | 形成光伏面板導電通道的方法 |
CN101934406A (zh) * | 2010-09-08 | 2011-01-05 | 浙江达峰科技有限公司 | 太阳能水温水位传感器中不锈钢电极与导线的焊接方法 |
DE102011009006A1 (de) * | 2011-01-20 | 2012-07-26 | Schlenk Metallfolien Gmbh & Co. Kg | Verfahren zum Herstellen von vorverzinnten Verbindern für PV-Zellen |
US8829360B2 (en) | 2010-11-26 | 2014-09-09 | Schlenk Metallfolien Gmbh & Co. Kg | Connector for PV cells and method for its production |
JP5777979B2 (ja) * | 2011-08-30 | 2015-09-16 | 日本アルミット株式会社 | はんだ合金 |
WO2013122927A1 (en) * | 2012-02-14 | 2013-08-22 | Tosoh Smd, Inc. | Low deflection sputtering target assembly and methods of making same |
US20140116500A1 (en) * | 2012-10-31 | 2014-05-01 | Emcore Solar Power, Inc. | Inverted metamorphic multijunction solar cells mounted on flexible support with bifacial contacts |
CN105200311A (zh) * | 2014-06-11 | 2015-12-30 | 丹阳市凯鑫合金材料有限公司 | 一种放电管电极用4j42合金丝及其生产方法 |
JP6444268B2 (ja) * | 2015-06-08 | 2018-12-26 | 三菱電機株式会社 | 太陽電池および太陽電池の製造方法 |
CN106356125B (zh) * | 2016-11-07 | 2018-01-05 | 南昌专腾科技有限公司 | 一种扁平双合金漆包线及其制造工艺 |
CN111055041B (zh) * | 2020-01-09 | 2022-07-12 | 郑州机械研究所有限公司 | 复合钎料及其制备方法和应用、焊接件 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799331A (ja) * | 1993-05-21 | 1995-04-11 | Canon Inc | 光電変換素子及びその形成方法 |
JPH07243014A (ja) * | 1994-03-07 | 1995-09-19 | Hitachi Cable Ltd | 帯板状材料への溶融めっき方法、その装置、およびクラッド材の製造方法 |
JP2001339089A (ja) * | 2000-05-29 | 2001-12-07 | Kyocera Corp | 太陽電池モジュール |
JP2002263880A (ja) * | 2001-03-06 | 2002-09-17 | Hitachi Cable Ltd | Pbフリー半田、およびこれを使用した接続用リード線ならびに電気部品 |
JP2004204256A (ja) * | 2002-12-24 | 2004-07-22 | Hitachi Cable Ltd | 低熱膨張平角導体 |
JP2005050780A (ja) * | 2003-07-15 | 2005-02-24 | Hitachi Cable Ltd | 平角導体及びその製造方法並びにリード線 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2414463A (en) * | 1943-09-10 | 1947-01-21 | Metals & Controls Corp | Electrical contact |
US4127424A (en) * | 1976-12-06 | 1978-11-28 | Ses, Incorporated | Photovoltaic cell array |
US4542258A (en) * | 1982-05-28 | 1985-09-17 | Solarex Corporation | Bus bar interconnect for a solar cell |
JPS6015937A (ja) * | 1983-07-07 | 1985-01-26 | Hitachi Cable Ltd | 半導体支持電極用クラツド材 |
JPH036867A (ja) * | 1989-06-05 | 1991-01-14 | Mitsubishi Electric Corp | 光発電素子の電極構造、形成方法、及びその製造装置 |
AU651486B2 (en) * | 1991-08-30 | 1994-07-21 | Canon Kabushiki Kaisha | Photoelectric conversion element and fabrication method thereof |
US5385848A (en) * | 1993-09-20 | 1995-01-31 | Iowa Thin Film Technologies, Inc | Method for fabricating an interconnected array of semiconductor devices |
JPH1121660A (ja) * | 1997-07-03 | 1999-01-26 | Hitachi Cable Ltd | 太陽電池用接続線 |
US6395972B1 (en) * | 2000-11-09 | 2002-05-28 | Trw Inc. | Method of solar cell external interconnection and solar cell panel made thereby |
US20030120197A1 (en) * | 2001-05-28 | 2003-06-26 | Takashi Kaneko | Composite material for medical applications, tube for medical applications and medical instrument |
-
2004
- 2004-05-19 KR KR1020057021732A patent/KR101072127B1/ko active IP Right Grant
- 2004-05-19 EP EP04733911.4A patent/EP1626443B1/en not_active Expired - Lifetime
- 2004-05-19 CN CNB2004800141432A patent/CN100474636C/zh not_active Expired - Fee Related
- 2004-05-19 JP JP2005506335A patent/JP4565650B2/ja not_active Expired - Fee Related
- 2004-05-19 WO PCT/JP2004/006725 patent/WO2004105141A1/ja active Application Filing
- 2004-05-19 US US10/558,214 patent/US20070062574A1/en not_active Abandoned
-
2009
- 2009-07-24 US US12/508,688 patent/US20090283573A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799331A (ja) * | 1993-05-21 | 1995-04-11 | Canon Inc | 光電変換素子及びその形成方法 |
JPH07243014A (ja) * | 1994-03-07 | 1995-09-19 | Hitachi Cable Ltd | 帯板状材料への溶融めっき方法、その装置、およびクラッド材の製造方法 |
JP2001339089A (ja) * | 2000-05-29 | 2001-12-07 | Kyocera Corp | 太陽電池モジュール |
JP2002263880A (ja) * | 2001-03-06 | 2002-09-17 | Hitachi Cable Ltd | Pbフリー半田、およびこれを使用した接続用リード線ならびに電気部品 |
JP2004204256A (ja) * | 2002-12-24 | 2004-07-22 | Hitachi Cable Ltd | 低熱膨張平角導体 |
JP2005050780A (ja) * | 2003-07-15 | 2005-02-24 | Hitachi Cable Ltd | 平角導体及びその製造方法並びにリード線 |
Also Published As
Publication number | Publication date |
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KR101072127B1 (ko) | 2011-10-10 |
EP1626443A1 (en) | 2006-02-15 |
US20070062574A1 (en) | 2007-03-22 |
CN1795565A (zh) | 2006-06-28 |
EP1626443A4 (en) | 2010-02-24 |
WO2004105141A1 (ja) | 2004-12-02 |
JP4565650B2 (ja) | 2010-10-20 |
KR20060035600A (ko) | 2006-04-26 |
EP1626443B1 (en) | 2013-12-18 |
US20090283573A1 (en) | 2009-11-19 |
CN100474636C (zh) | 2009-04-01 |
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