JPWO2004090963A1 - 研磨パッド、その製造方法およびそれを用いた研磨方法 - Google Patents
研磨パッド、その製造方法およびそれを用いた研磨方法 Download PDFInfo
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- JPWO2004090963A1 JPWO2004090963A1 JP2005505261A JP2005505261A JPWO2004090963A1 JP WO2004090963 A1 JPWO2004090963 A1 JP WO2004090963A1 JP 2005505261 A JP2005505261 A JP 2005505261A JP 2005505261 A JP2005505261 A JP 2005505261A JP WO2004090963 A1 JPWO2004090963 A1 JP WO2004090963A1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003100376 | 2003-04-03 | ||
| JP2003100376 | 2003-04-03 | ||
| JP2003103477 | 2003-04-07 | ||
| JP2003103477 | 2003-04-07 | ||
| JP2003103624 | 2003-04-08 | ||
| JP2003103624 | 2003-04-08 | ||
| PCT/JP2004/004820 WO2004090963A1 (ja) | 2003-04-03 | 2004-04-02 | 研磨パッド、その製造方法およびそれを用いた研磨方法 |
Publications (1)
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|---|---|
| JPWO2004090963A1 true JPWO2004090963A1 (ja) | 2006-07-06 |
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Family Applications (1)
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| JP2005505261A Pending JPWO2004090963A1 (ja) | 2003-04-03 | 2004-04-02 | 研磨パッド、その製造方法およびそれを用いた研磨方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060199473A1 (ko) |
| JP (1) | JPWO2004090963A1 (ko) |
| KR (1) | KR100771738B1 (ko) |
| WO (1) | WO2004090963A1 (ko) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070161720A1 (en) * | 2005-11-30 | 2007-07-12 | Applied Materials, Inc. | Polishing Pad with Surface Roughness |
| JP5431736B2 (ja) * | 2006-02-14 | 2014-03-05 | キャボット マイクロエレクトロニクス コーポレイション | インジウム錫酸化物表面をｃｍｐする方法 |
| KR101146966B1 (ko) * | 2007-02-01 | 2012-05-23 | 가부시키가이샤 구라레 | 연마 패드 및 연마 패드의 제조 방법 |
| US20080287047A1 (en) * | 2007-05-18 | 2008-11-20 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad, use thereof and method for making the same |
| US7815491B2 (en) * | 2007-05-29 | 2010-10-19 | San Feng Chemical Industry Co., Ltd. | Polishing pad, the use thereof and the method for manufacturing the same |
| FR2924362B1 (fr) * | 2007-11-30 | 2012-07-13 | Centre Nat Rech Scient | Reacteur chimique avec superstructure nanometrique |
| JP2010064153A (ja) * | 2008-09-08 | 2010-03-25 | Kuraray Co Ltd | 研磨パッド |
| WO2010075091A2 (en) * | 2008-12-15 | 2010-07-01 | Saint-Gobain Abrasives, Inc. | Bonded abrasive article and method of use |
| US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
| US9120200B2 (en) * | 2010-12-28 | 2015-09-01 | Saint-Gobain Ceramics & Plastics, Inc. | Polishing slurry including zirconia particles and a method of using the polishing slurry |
| KR20140076566A (ko) * | 2011-10-07 | 2014-06-20 | 아사히 가라스 가부시키가이샤 | 탄화규소 단결정 기판 및 연마액 |
| JP6222171B2 (ja) * | 2015-06-22 | 2017-11-01 | 信越半導体株式会社 | 定寸装置、研磨装置、及び研磨方法 |
| US20180281076A1 (en) * | 2017-03-31 | 2018-10-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Gelling reduction tool for grooving chemical mechanical planarization polishing pads |
| KR101945874B1 (ko) * | 2017-08-07 | 2019-02-11 | 에스케이씨 주식회사 | 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드 |
| CN112259454B (zh) * | 2019-07-22 | 2024-04-12 | 华邦电子股份有限公司 | 化学机械研磨制程 |
| US11014215B2 (en) * | 2019-09-28 | 2021-05-25 | Winbond Electronics Corp. | Chemical mechanical polishing process |
| CN116141214A (zh) * | 2022-08-04 | 2023-05-23 | 华侨大学 | 一种可循环利用的混合磨料抛光膜的制备方法 |
| CN117107369B (zh) * | 2023-10-18 | 2023-12-22 | 山东森荣新材料股份有限公司 | 短纤生产装置及工艺 |
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| US4021209A (en) * | 1975-07-23 | 1977-05-03 | Federal-Mogul Corporation | Aramid fiber reinforced abrasive wheel |
| US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
| US5030496A (en) * | 1989-05-10 | 1991-07-09 | Minnesota Mining And Manufacturing Company | Low density nonwoven fibrous surface treating article |
| US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| US5458962A (en) * | 1993-08-11 | 1995-10-17 | Minnesota Mining And Manufacturing Company | Nonwoven surface treating articles and methods of making and using same |
| US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| US6156651A (en) * | 1996-12-13 | 2000-12-05 | Texas Instruments Incorporated | Metallization method for porous dielectrics |
| JPH10225864A (ja) * | 1997-02-17 | 1998-08-25 | Sony Corp | 研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法 |
| US6022268A (en) * | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| KR200295255Y1 (ko) * | 1997-05-12 | 2003-04-26 | 삼성중공업 주식회사 | 엔진 탑 브레이싱 |
| US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
| US6428388B2 (en) * | 1998-11-06 | 2002-08-06 | Beaver Creek Concepts Inc. | Finishing element with finishing aids |
| US6739947B1 (en) * | 1998-11-06 | 2004-05-25 | Beaver Creek Concepts Inc | In situ friction detector method and apparatus |
| US6179887B1 (en) * | 1999-02-17 | 2001-01-30 | 3M Innovative Properties Company | Method for making an abrasive article and abrasive articles thereof |
| DE10084915C2 (de) * | 1999-08-27 | 2003-12-24 | Asahi Chemical Ind | Polierkissen und Poliervorrichtung |
| US6793561B2 (en) * | 1999-10-14 | 2004-09-21 | International Business Machines Corporation | Removable/disposable platen top |
| WO2001045899A1 (fr) * | 1999-12-22 | 2001-06-28 | Toray Industries, Inc. | Tampon a polir, procede et appareil de polissage |
| US6713413B2 (en) * | 2000-01-03 | 2004-03-30 | Freudenberg Nonwovens Limited Partnership | Nonwoven buffing or polishing material having increased strength and dimensional stability |
| US6533645B2 (en) * | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
| WO2002030617A1 (en) * | 2000-10-06 | 2002-04-18 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
| US7377836B1 (en) * | 2000-10-10 | 2008-05-27 | Beaver Creek Concepts Inc | Versatile wafer refining |
| JP2002166352A (ja) * | 2000-11-29 | 2002-06-11 | Nitsusen:Kk | 湿式研磨用研磨材 |
| JP2003080450A (ja) * | 2001-09-06 | 2003-03-18 | Mitsui Chemicals Inc | Ｃｍｐ研磨パッド用組成物、ｃｍｐ研磨パッドおよびその製造方法 |
| TW561541B (en) * | 2001-10-09 | 2003-11-11 | Hitachi Chemical Co Ltd | Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP |
| JP2003124163A (ja) * | 2001-10-09 | 2003-04-25 | Hitachi Chem Co Ltd | 研磨用パッド及び被研磨物の製造法 |
-
2004
- 2004-04-02 WO PCT/JP2004/004820 patent/WO2004090963A1/ja active Application Filing
- 2004-04-02 US US10/551,457 patent/US20060199473A1/en not_active Abandoned
- 2004-04-02 JP JP2005505261A patent/JPWO2004090963A1/ja active Pending
- 2004-04-02 KR KR1020057018833A patent/KR100771738B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004090963A1 (ja) | 2004-10-21 |
| KR20050114716A (ko) | 2005-12-06 |
| KR100771738B1 (ko) | 2007-10-30 |
| US20060199473A1 (en) | 2006-09-07 |
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