JPS649727B2 - - Google Patents
Info
- Publication number
- JPS649727B2 JPS649727B2 JP57100585A JP10058582A JPS649727B2 JP S649727 B2 JPS649727 B2 JP S649727B2 JP 57100585 A JP57100585 A JP 57100585A JP 10058582 A JP10058582 A JP 10058582A JP S649727 B2 JPS649727 B2 JP S649727B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vacuum
- vacuum chamber
- ultraviolet light
- lift
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Physical Vapour Deposition (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57100585A JPS58218126A (ja) | 1982-06-14 | 1982-06-14 | リフトオフ加工用真空蒸着装置およびその使用方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57100585A JPS58218126A (ja) | 1982-06-14 | 1982-06-14 | リフトオフ加工用真空蒸着装置およびその使用方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218126A JPS58218126A (ja) | 1983-12-19 |
| JPS649727B2 true JPS649727B2 (https=) | 1989-02-20 |
Family
ID=14277956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57100585A Granted JPS58218126A (ja) | 1982-06-14 | 1982-06-14 | リフトオフ加工用真空蒸着装置およびその使用方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218126A (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63232332A (ja) * | 1987-03-20 | 1988-09-28 | Ushio Inc | レジスト処理方法 |
| JPS63232331A (ja) * | 1987-03-20 | 1988-09-28 | Ushio Inc | レジスト処理方法 |
| JPS63232330A (ja) * | 1987-03-20 | 1988-09-28 | Ushio Inc | レジスト処理方法 |
| JPS63234527A (ja) * | 1987-03-24 | 1988-09-29 | Ushio Inc | レジスト処理方法 |
| JPS63234529A (ja) * | 1987-03-24 | 1988-09-29 | Ushio Inc | レジスト処理方法 |
| JPH0751746B2 (ja) * | 1988-08-05 | 1995-06-05 | 松下電器産業株式会社 | 酸化物薄膜製造法 |
| JPH02275618A (ja) * | 1989-04-17 | 1990-11-09 | Nec Corp | 半導体装置の製造方法 |
| JP4162756B2 (ja) * | 1998-05-20 | 2008-10-08 | 富士通株式会社 | 膜のパターニング方法 |
-
1982
- 1982-06-14 JP JP57100585A patent/JPS58218126A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58218126A (ja) | 1983-12-19 |
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