JPS6491118A - Liquid crystal display element mounting flip chip - Google Patents

Liquid crystal display element mounting flip chip

Info

Publication number
JPS6491118A
JPS6491118A JP24800787A JP24800787A JPS6491118A JP S6491118 A JPS6491118 A JP S6491118A JP 24800787 A JP24800787 A JP 24800787A JP 24800787 A JP24800787 A JP 24800787A JP S6491118 A JPS6491118 A JP S6491118A
Authority
JP
Japan
Prior art keywords
solder
flip chip
solder bump
glass substrate
preliminary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24800787A
Other languages
English (en)
Inventor
Takao Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP24800787A priority Critical patent/JPS6491118A/ja
Publication of JPS6491118A publication Critical patent/JPS6491118A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
JP24800787A 1987-10-02 1987-10-02 Liquid crystal display element mounting flip chip Pending JPS6491118A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24800787A JPS6491118A (en) 1987-10-02 1987-10-02 Liquid crystal display element mounting flip chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24800787A JPS6491118A (en) 1987-10-02 1987-10-02 Liquid crystal display element mounting flip chip

Publications (1)

Publication Number Publication Date
JPS6491118A true JPS6491118A (en) 1989-04-10

Family

ID=17171806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24800787A Pending JPS6491118A (en) 1987-10-02 1987-10-02 Liquid crystal display element mounting flip chip

Country Status (1)

Country Link
JP (1) JPS6491118A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359440A (ja) * 1991-06-05 1992-12-11 Matsushita Electric Ind Co Ltd 液晶表示装置の駆動電極接続方法
US5747870A (en) * 1994-06-30 1998-05-05 Plessey Semiconductors Limited Multi-chip module inductor structure
US10443647B2 (en) 2014-11-17 2019-10-15 Ntn Corporation Power transmission shaft

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359440A (ja) * 1991-06-05 1992-12-11 Matsushita Electric Ind Co Ltd 液晶表示装置の駆動電極接続方法
US5747870A (en) * 1994-06-30 1998-05-05 Plessey Semiconductors Limited Multi-chip module inductor structure
US10443647B2 (en) 2014-11-17 2019-10-15 Ntn Corporation Power transmission shaft

Similar Documents

Publication Publication Date Title
US3921285A (en) Method for joining microminiature components to a carrying structure
KR940022765A (ko) 반도체 장치의 상호 접속구조 및 상호접속 방법
KR960013143A (ko) 합금 납땜 접속 조립체 및 그 접속 방법
CA2000301A1 (en) Copper doped low melt solder for component assembly and rework
US6600233B2 (en) Integrated circuit package with surface mounted pins on an organic substrate
JPS6491118A (en) Liquid crystal display element mounting flip chip
JPS57106057A (en) Bump structure of ic
JPS5773947A (en) Formation of hybrid ic module
CN206196140U (zh) 具有多级熔点焊锡的光电模块基板
JPS63152136A (ja) 半導体チツプの実装方法
JPS5513985A (en) Ic mounting structure
JPS5588346A (en) Packaging method for semiconductor element
JPS5543811A (en) Semiconductor integrated circuit device
JP2546706B2 (ja) はんだバンプ成形用治具
JP2822496B2 (ja) プリント配線板へのリードピンの半田付け方法
JPS6477991A (en) Printed circuit board
JPS64518A (en) Liquid crystal display element
Saito et al. COG Technique Using Low-Melting-Point Alloy
JPH04268739A (ja) 半導体装置の製造方法
JPS57192042A (en) Fixing method for semiconductor element
JPH05144874A (ja) ハンダバンプ付チツプの接続方法
JPS62188397A (ja) チツプ部品用印刷回路板
JPH07335694A (ja) 電子デバイス
JPS5668579A (en) Connecting method by melting solder
JPS59219988A (ja) はんだ付方法