JPS6489433A - Resist-pattern forming method - Google Patents

Resist-pattern forming method

Info

Publication number
JPS6489433A
JPS6489433A JP62244050A JP24405087A JPS6489433A JP S6489433 A JPS6489433 A JP S6489433A JP 62244050 A JP62244050 A JP 62244050A JP 24405087 A JP24405087 A JP 24405087A JP S6489433 A JPS6489433 A JP S6489433A
Authority
JP
Japan
Prior art keywords
resist
pattern
length
sizes
difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62244050A
Other languages
Japanese (ja)
Inventor
Eiji Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62244050A priority Critical patent/JPS6489433A/en
Publication of JPS6489433A publication Critical patent/JPS6489433A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make the difference between sizes in X-Y directions of a resist pattern very small and to improve the machining accuracy of the pattern, in a resist-pattern forming method, by making the beam width in the beam scanning direction narrower than a specified size, and performing exposure. CONSTITUTION:When resist is exposed, a beam width in the beam scanning direction is made narrower than 0.5mum at the least. With respect to the total energy, which is received with the resist, the amount in the direction Y is smaller than the amount in the direction X. When the level in the direction X is made to be 1, the level in the direction Y is about 0.8. Meanwhile, the beam distribution becomes steep since the beam width is made narrow. The length X1 of a blanking pattern is about the same as a conventional length X0. Meanwhile, the length Y1 of a blanking pattern in the direction Y is made longer than a conventional length Y0 slightly by Y. Therefore the difference in sizes in the X-Y directions becomes smaller than the difference in conventional sizes. Thus, pattern machining accuracy can be improved.
JP62244050A 1987-09-30 1987-09-30 Resist-pattern forming method Pending JPS6489433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62244050A JPS6489433A (en) 1987-09-30 1987-09-30 Resist-pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62244050A JPS6489433A (en) 1987-09-30 1987-09-30 Resist-pattern forming method

Publications (1)

Publication Number Publication Date
JPS6489433A true JPS6489433A (en) 1989-04-03

Family

ID=17112979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62244050A Pending JPS6489433A (en) 1987-09-30 1987-09-30 Resist-pattern forming method

Country Status (1)

Country Link
JP (1) JPS6489433A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002534794A (en) * 1999-01-06 2002-10-15 エテック システムズ インコーポレイテッド Raster formation and electron beam exposure method using two-dimensional multi-pixel flash field
JP2005032838A (en) * 2003-07-08 2005-02-03 Canon Inc Method and device for charged particle beam lithography and method of manufacturing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002534794A (en) * 1999-01-06 2002-10-15 エテック システムズ インコーポレイテッド Raster formation and electron beam exposure method using two-dimensional multi-pixel flash field
JP2005032838A (en) * 2003-07-08 2005-02-03 Canon Inc Method and device for charged particle beam lithography and method of manufacturing device

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