JPS648742U - - Google Patents
Info
- Publication number
- JPS648742U JPS648742U JP10162687U JP10162687U JPS648742U JP S648742 U JPS648742 U JP S648742U JP 10162687 U JP10162687 U JP 10162687U JP 10162687 U JP10162687 U JP 10162687U JP S648742 U JPS648742 U JP S648742U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- external
- soldering
- notches
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は基板へのはんだ付け接合状態を示す本
考案実施例による外部引出しリードの外形斜視図
、第２図は第１図における外部引出しリードの平
面図、第３図、第４図はそれぞれ第１図、第２図
に対応した従来における外部引出しリードの構成
図である。各図において、
１：基板、２：導体パターン、３：外部引出し
リード、３１：はんだ付け片部、３３：切込み部
、Ｗ：はんだ付け接合部。
Fig. 1 is a perspective view of an external lead according to an embodiment of the present invention showing the state of soldering to a board, Fig. 2 is a plan view of the external lead in Fig. 1, and Figs. 3 and 4 respectively. FIG. 2 is a configuration diagram of a conventional external drawer lead corresponding to FIGS. 1 and 2; In each figure, 1: board, 2: conductor pattern, 3: external lead, 31: soldering piece, 33: notch, W: soldering joint.
Claims (1)
搭載してはんだ付け接合された板状の外部引出し
リードであつて、外部引出しリードのはんだ付け
片部に熱応力吸収用の切込み部を随所に形成した
ことを特徴とする半導体装置の外部引出しリード
。 (2) 実用新案登録請求の範囲第１項記載の外部
引出しリードにおいて、切込み部がはんだ付け片
部の長手方向に沿い千鳥状に分散して板材の側縁
より幅方向に切込み形成されていることを特徴と
する半導体装置の外部引出しリード。[Scope of Claim for Utility Model Registration] (1) A plate-shaped external lead lead in which a soldering piece is mounted on a conductor pattern of a board and is joined by soldering, and the soldering piece of the external lead lead is heated. An external lead for a semiconductor device characterized by having notches for stress absorption formed at various locations. (2) In the external drawer lead described in claim 1 of the utility model registration claim, the notches are distributed in a staggered manner along the longitudinal direction of the soldering piece and are cut in the width direction from the side edge of the plate material. An external drawer lead for a semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162687U JPS648742U (en) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10162687U JPS648742U (en) | 1987-07-01 | 1987-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648742U true JPS648742U (en) | 1989-01-18 |
Family
ID=31330790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10162687U Pending JPS648742U (en) | 1987-07-01 | 1987-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648742U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012044208A (en) * | 2011-10-21 | 2012-03-01 | Mitsubishi Electric Corp | Power semiconductor module |
-
1987
- 1987-07-01 JP JP10162687U patent/JPS648742U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012044208A (en) * | 2011-10-21 | 2012-03-01 | Mitsubishi Electric Corp | Power semiconductor module |