JPH0171472U - - Google Patents

Info

Publication number
JPH0171472U
JPH0171472U JP1987167298U JP16729887U JPH0171472U JP H0171472 U JPH0171472 U JP H0171472U JP 1987167298 U JP1987167298 U JP 1987167298U JP 16729887 U JP16729887 U JP 16729887U JP H0171472 U JPH0171472 U JP H0171472U
Authority
JP
Japan
Prior art keywords
patterns
printed board
mentioned
electronic component
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987167298U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987167298U priority Critical patent/JPH0171472U/ja
Publication of JPH0171472U publication Critical patent/JPH0171472U/ja
Pending legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本考案の一実施例を示す
もので、第1図はパターン形状を示す平面図、第
2図は半田付け状態を示す縦断面図、第3図〜第
5図は従来例を示すもので、第3図はパターン形
状を示す平面図、第4図は半田付け状態を示す縦
断面図、第5図は半田ブリツジの発生状態を示す
斜視図である。 11……FPIC(電子部品)、12,13…
…リード、14,15……パターン、16……プ
リント板。
1 and 2 show an embodiment of the present invention, in which FIG. 1 is a plan view showing the pattern shape, FIG. 2 is a longitudinal sectional view showing the soldering state, and FIGS. 3 to 5. 3 is a plan view showing the pattern shape, FIG. 4 is a longitudinal sectional view showing the soldering state, and FIG. 5 is a perspective view showing the state in which solder bridging occurs. 11...FPIC (electronic parts), 12, 13...
...Lead, 14,15...Pattern, 16...Printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 並設された複数個の半田付けパターンを有し、
上記パターンには電子部品に設けられた複数個の
リードをそれぞれ対応させて半田付けするプリン
ト板において、上記パターンのうち両端のパター
ンに挟まれた1つまたは複数のパターンは上記電
子部品側に位置する端部を切欠して、上記両端の
パターンよりパターン長が短くなるようにしたこ
とを特徴とするプリント板。
It has multiple soldering patterns arranged in parallel,
In a printed board to which a plurality of leads provided on an electronic component are soldered in correspondence with the above-mentioned patterns, one or more of the above-mentioned patterns sandwiched between the patterns at both ends are located on the side of the above-mentioned electronic component. 1. A printed board characterized in that the edges of the printed board are cut out so that the pattern length is shorter than that of the pattern at both ends.
JP1987167298U 1987-10-31 1987-10-31 Pending JPH0171472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987167298U JPH0171472U (en) 1987-10-31 1987-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987167298U JPH0171472U (en) 1987-10-31 1987-10-31

Publications (1)

Publication Number Publication Date
JPH0171472U true JPH0171472U (en) 1989-05-12

Family

ID=31455461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987167298U Pending JPH0171472U (en) 1987-10-31 1987-10-31

Country Status (1)

Country Link
JP (1) JPH0171472U (en)

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