JPS6486590A - Manufacture of insulating substrate with electric path - Google Patents

Manufacture of insulating substrate with electric path

Info

Publication number
JPS6486590A
JPS6486590A JP19707287A JP19707287A JPS6486590A JP S6486590 A JPS6486590 A JP S6486590A JP 19707287 A JP19707287 A JP 19707287A JP 19707287 A JP19707287 A JP 19707287A JP S6486590 A JPS6486590 A JP S6486590A
Authority
JP
Japan
Prior art keywords
electric path
insulating substrate
die
temporary base
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19707287A
Other languages
English (en)
Inventor
Masami Takagi
Koichi Koga
Mitsuru Kayukawa
Shokichi Kuribayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of JPS6486590A publication Critical patent/JPS6486590A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP19707287A 1987-06-25 1987-08-05 Manufacture of insulating substrate with electric path Pending JPS6486590A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15825487 1987-06-25

Publications (1)

Publication Number Publication Date
JPS6486590A true JPS6486590A (en) 1989-03-31

Family

ID=15667608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19707287A Pending JPS6486590A (en) 1987-06-25 1987-08-05 Manufacture of insulating substrate with electric path

Country Status (1)

Country Link
JP (1) JPS6486590A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253228A (ja) * 2005-03-08 2006-09-21 Ricoh Co Ltd 電気構造体及び電気構造体の製造方法
JP2006253512A (ja) * 2005-03-11 2006-09-21 Ricoh Co Ltd 配線基板、製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922551A (ja) * 1972-06-24 1974-02-28
JPS5250570A (en) * 1975-10-20 1977-04-22 Seiko Instr & Electronics Method of producing circuit substrate
JPS56138983A (en) * 1980-04-01 1981-10-29 Kanto Seiki Co Electric circuit unit and method of producing same
JPS6039891A (ja) * 1983-08-12 1985-03-01 セイコーインスツルメンツ株式会社 プリント回路用導体回路の製造方法
JPS60119791A (ja) * 1983-12-01 1985-06-27 日本電産コパル株式会社 平滑回路板の製造方法
JPS61102093A (ja) * 1984-10-25 1986-05-20 シャープ株式会社 プリント基板の製造方法
JPS61170091A (ja) * 1985-01-23 1986-07-31 住友電気工業株式会社 印刷配線板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4922551A (ja) * 1972-06-24 1974-02-28
JPS5250570A (en) * 1975-10-20 1977-04-22 Seiko Instr & Electronics Method of producing circuit substrate
JPS56138983A (en) * 1980-04-01 1981-10-29 Kanto Seiki Co Electric circuit unit and method of producing same
JPS6039891A (ja) * 1983-08-12 1985-03-01 セイコーインスツルメンツ株式会社 プリント回路用導体回路の製造方法
JPS60119791A (ja) * 1983-12-01 1985-06-27 日本電産コパル株式会社 平滑回路板の製造方法
JPS61102093A (ja) * 1984-10-25 1986-05-20 シャープ株式会社 プリント基板の製造方法
JPS61170091A (ja) * 1985-01-23 1986-07-31 住友電気工業株式会社 印刷配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253228A (ja) * 2005-03-08 2006-09-21 Ricoh Co Ltd 電気構造体及び電気構造体の製造方法
JP2006253512A (ja) * 2005-03-11 2006-09-21 Ricoh Co Ltd 配線基板、製造方法

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