JPS6486553A - Solid-state image sensing device - Google Patents

Solid-state image sensing device

Info

Publication number
JPS6486553A
JPS6486553A JP62244461A JP24446187A JPS6486553A JP S6486553 A JPS6486553 A JP S6486553A JP 62244461 A JP62244461 A JP 62244461A JP 24446187 A JP24446187 A JP 24446187A JP S6486553 A JPS6486553 A JP S6486553A
Authority
JP
Japan
Prior art keywords
well layer
trench section
shaped
transfer means
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62244461A
Other languages
Japanese (ja)
Inventor
Atsushi Honjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62244461A priority Critical patent/JPS6486553A/en
Publication of JPS6486553A publication Critical patent/JPS6486553A/en
Pending legal-status Critical Current

Links

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To prevent an adverse effect based on external light projected from the outside of a light-shielding film by forming a trench section, in which a well layer is not shaped, around an element region. CONSTITUTION:A P-type well layer 6 is formed onto an N-type semiconductor substrate 1, and photo-diodes 2 and transfer means 3 are shaped to the well layer 6. The transfer means 3 form N-type charge transfer paths, and are isolated mutually by element isolation layers 7 composed of P<+> diffusion layers. A trench section 12 to which the well layer 6 is not shaped is formed around an element region in which the photo-diodes 2 and the transfer means 3 are shaped. The well layer 6 and the element isolation layers 7 are isolated into the inside and the outside by the trench section. Consequently, the trench section 12 is filled with the N-type semiconductor substrate 1. According to such structure, electrons generated by external light are discharged to the substrate, to which positive voltage is applied, from the trench section 12 even when they are directed toward the inside, and do not flow into the photo-diodes 2 and the transfer means 3 and have no adverse effect.
JP62244461A 1987-09-29 1987-09-29 Solid-state image sensing device Pending JPS6486553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62244461A JPS6486553A (en) 1987-09-29 1987-09-29 Solid-state image sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62244461A JPS6486553A (en) 1987-09-29 1987-09-29 Solid-state image sensing device

Publications (1)

Publication Number Publication Date
JPS6486553A true JPS6486553A (en) 1989-03-31

Family

ID=17118993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62244461A Pending JPS6486553A (en) 1987-09-29 1987-09-29 Solid-state image sensing device

Country Status (1)

Country Link
JP (1) JPS6486553A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151676A (en) * 2000-03-17 2002-05-24 Nikon Corp Image pickup device, its manufacturing method, alignment device, aligner, abberation measuring instrument, and method of manufacturing the device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151676A (en) * 2000-03-17 2002-05-24 Nikon Corp Image pickup device, its manufacturing method, alignment device, aligner, abberation measuring instrument, and method of manufacturing the device

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