JPS64843B2 - - Google Patents
Info
- Publication number
- JPS64843B2 JPS64843B2 JP3786486A JP3786486A JPS64843B2 JP S64843 B2 JPS64843 B2 JP S64843B2 JP 3786486 A JP3786486 A JP 3786486A JP 3786486 A JP3786486 A JP 3786486A JP S64843 B2 JPS64843 B2 JP S64843B2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- ground conductor
- substrate
- microwave integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 12
- 239000003989 dielectric material Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000003321 amplification Effects 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3786486A JPS61228701A (ja) | 1986-02-21 | 1986-02-21 | マイクロ波集積回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3786486A JPS61228701A (ja) | 1986-02-21 | 1986-02-21 | マイクロ波集積回路の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55099144A Division JPS6014521B2 (ja) | 1980-07-18 | 1980-07-18 | マイクロ波集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61228701A JPS61228701A (ja) | 1986-10-11 |
| JPS64843B2 true JPS64843B2 (enrdf_load_stackoverflow) | 1989-01-09 |
Family
ID=12509404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3786486A Granted JPS61228701A (ja) | 1986-02-21 | 1986-02-21 | マイクロ波集積回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61228701A (enrdf_load_stackoverflow) |
-
1986
- 1986-02-21 JP JP3786486A patent/JPS61228701A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61228701A (ja) | 1986-10-11 |