JPS6477942A - Formation of protective film - Google Patents

Formation of protective film

Info

Publication number
JPS6477942A
JPS6477942A JP23586987A JP23586987A JPS6477942A JP S6477942 A JPS6477942 A JP S6477942A JP 23586987 A JP23586987 A JP 23586987A JP 23586987 A JP23586987 A JP 23586987A JP S6477942 A JPS6477942 A JP S6477942A
Authority
JP
Japan
Prior art keywords
sample
raw material
material gases
heated
reaction chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23586987A
Other languages
Japanese (ja)
Inventor
Shigeo Osaka
Yumiko Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Fujitsu Quantum Devices Ltd
Original Assignee
Fujitsu Ltd
Fujitsu Quantum Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fujitsu Quantum Devices Ltd filed Critical Fujitsu Ltd
Priority to JP23586987A priority Critical patent/JPS6477942A/en
Publication of JPS6477942A publication Critical patent/JPS6477942A/en
Pending legal-status Critical Current

Links

Landscapes

  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To reduce interface level density, and to improve the C-V characteristics of a semiconductor device by forming an silicon nitride film onto the surface of an indium phosphide semiconductor through chemical vapor growth and thermally treating the whole at a temperature higher than the temperature of chemical vapor growth. CONSTITUTION:A sample base 22 is heated by a heater 21. An InP semiconductor sample 23 is placed onto the sample base 22. The inside of a reaction chamber 26 is evacuated, and the sample 23 is heated. The inside of the reaction chamber 26 is supplied with SiH4 and NH3 as raw material gases and N2 as a carrier gas from an introducing port 28, and a high frequency power 25 is turned ON and discharge is started. Consequently, the raw material gases are decomposed, and a passivation film composed of SiN is shaped and deposited onto the surface of the sample 23. When the film thickness of the passivation film reaches a desired value, the supply of the raw material gases is stopped, and the sample 23 is further heated while feeding only the carrier gas.
JP23586987A 1987-09-18 1987-09-18 Formation of protective film Pending JPS6477942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23586987A JPS6477942A (en) 1987-09-18 1987-09-18 Formation of protective film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23586987A JPS6477942A (en) 1987-09-18 1987-09-18 Formation of protective film

Publications (1)

Publication Number Publication Date
JPS6477942A true JPS6477942A (en) 1989-03-23

Family

ID=16992453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23586987A Pending JPS6477942A (en) 1987-09-18 1987-09-18 Formation of protective film

Country Status (1)

Country Link
JP (1) JPS6477942A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609180A (en) * 1983-06-13 1985-01-18 アメリカン・テレフオン・アンド・テレグラフ・カムパニ− Method of producing semiconductor photodetector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609180A (en) * 1983-06-13 1985-01-18 アメリカン・テレフオン・アンド・テレグラフ・カムパニ− Method of producing semiconductor photodetector

Similar Documents

Publication Publication Date Title
KR100215376B1 (en) Method for depositing silicon oxide films of reduced surface sensitivity
US5151296A (en) Method for forming polycrystalline film by chemical vapor deposition process
US7377977B2 (en) High-purity crystal growth
GB1408056A (en) Radial flow reactor
AU2086699A (en) Growth of very uniform silicon carbide epitaxial layers
JPS6347141B2 (en)
JPS6451618A (en) Microcrystalline silicon carbide semiconductor film and manufacture thereof
JPS55110032A (en) Method for high-frequency heated epitaxial growth
EP1179621A4 (en) N-type semiconductor diamond and its fabrication method
JPS6477942A (en) Formation of protective film
JPS54104770A (en) Heat treatment method for 3-5 group compound semiconductor
JPS592374B2 (en) Plasma vapor phase growth equipment
US3170825A (en) Delaying the introduction of impurities when vapor depositing an epitaxial layer on a highly doped substrate
US3386857A (en) Method of manufacturing semiconductor devices such as transistors and diodes and semiconductor devices manufactured by such methods
JPS6437028A (en) Manufacture of semiconductor element
JPS54144868A (en) Heat treatment unit
JPS5571695A (en) Production of epitaxial-grown wafer
JPS56149306A (en) Formation of silicon nitride film
JPS57134553A (en) Chemical vapor phase growing method
JPS5471577A (en) Production of semiconductor device
JPS54106081A (en) Growth method in vapor phase
JPS54137973A (en) Formation method of plasma nitride
KR0160543B1 (en) Method for depositing high quality silicon nitride films
JPS5589467A (en) Growth of aluminum in gaseous phase
JPS6414926A (en) Manufacture of semiconductor device