GB1408056A - Radial flow reactor - Google Patents
Radial flow reactorInfo
- Publication number
- GB1408056A GB1408056A GB4527772A GB4527772A GB1408056A GB 1408056 A GB1408056 A GB 1408056A GB 4527772 A GB4527772 A GB 4527772A GB 4527772 A GB4527772 A GB 4527772A GB 1408056 A GB1408056 A GB 1408056A
- Authority
- GB
- United Kingdom
- Prior art keywords
- chamber
- support
- coating
- aperture
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45504—Laminar flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45508—Radial flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Plasma & Fusion (AREA)
- Fluid Mechanics (AREA)
- Chemical Vapour Deposition (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
Abstract
1408056 Inorganic coatings TEXAS INSTRUMENTS Inc 2 Oct 1972 [27 Oct 1971] 45277/72 Heading C1A Apparatus for coating a substrate, e.g. for coating Si slices with Si, silicon dioxide or silicon nitride comprises an evacuable chamber 18, a horizontally disposed support 24 located within chamber 18 upon which at least one substrate 26, e.g. a semi-conductor slice, may be held, the support 24 having a central region defining an aperture 36 therethrough and coating vapour feed means including a vapour feed inlet 42 communicating with the chamber 18 for introducing reactant gases into the chamber in a manner establishing radial flow of the reactant gases from the outer peripheral portion of the support towards the aperture for forming the coating and chamber 18 having an exhaust outlet 34 in communication with aperture 36. Preferably a radio frequency discharge generator is operably associated with chamber 18 for producing a radio frequency discharge therein adjacent support 24 so as to form a glow discharge plasma from reactant gases within the chamber. There may also be a heater for heating support 24 and thereby substrate slices 26.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19295771A | 1971-10-27 | 1971-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1408056A true GB1408056A (en) | 1975-10-01 |
Family
ID=22711718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4527772A Expired GB1408056A (en) | 1971-10-27 | 1972-10-02 | Radial flow reactor |
Country Status (4)
Country | Link |
---|---|
US (1) | US3757733A (en) |
JP (1) | JPS5324915B2 (en) |
DE (1) | DE2251571C3 (en) |
GB (1) | GB1408056A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2219311A (en) * | 1988-05-06 | 1989-12-06 | Elektromat Veb | Gas inlet and discharge attachment for the gas-phase processing of workpieces |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4066037A (en) * | 1975-12-17 | 1978-01-03 | Lfe Corportion | Apparatus for depositing dielectric films using a glow discharge |
USRE30244E (en) * | 1976-01-22 | 1980-04-01 | Bell Telephone Laboratories, Incorporated | Radial flow reactor including glow discharge limitting shield |
US4142004A (en) * | 1976-01-22 | 1979-02-27 | Bell Telephone Laboratories, Incorporated | Method of coating semiconductor substrates |
US4033287A (en) * | 1976-01-22 | 1977-07-05 | Bell Telephone Laboratories, Incorporated | Radial flow reactor including glow discharge limiting shield |
GB1544172A (en) * | 1976-03-03 | 1979-04-11 | Int Plasma Corp | Gas plasma reactor and process |
AU507748B2 (en) * | 1976-06-10 | 1980-02-28 | University Of Sydney, The | Reactive sputtering |
US4132818A (en) * | 1976-06-29 | 1979-01-02 | International Business Machines Corporation | Method of forming deposits from reactive gases |
CA1059882A (en) * | 1976-08-16 | 1979-08-07 | Northern Telecom Limited | Gaseous plasma etching of aluminum and aluminum oxide |
US4230515A (en) * | 1978-07-27 | 1980-10-28 | Davis & Wilder, Inc. | Plasma etching apparatus |
US4182646A (en) * | 1978-07-27 | 1980-01-08 | John Zajac | Process of etching with plasma etch gas |
US4207137A (en) * | 1979-04-13 | 1980-06-10 | Bell Telephone Laboratories, Incorporated | Method of controlling a plasma etching process by monitoring the impedance changes of the RF power |
US4262631A (en) * | 1979-10-01 | 1981-04-21 | Kubacki Ronald M | Thin film deposition apparatus using an RF glow discharge |
US4289797A (en) * | 1979-10-11 | 1981-09-15 | Western Electric Co., Incorporated | Method of depositing uniform films of Six Ny or Six Oy in a plasma reactor |
JPS5673539A (en) * | 1979-11-22 | 1981-06-18 | Toshiba Corp | Surface treating apparatus of microwave plasma |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
JPS56105483A (en) * | 1980-01-25 | 1981-08-21 | Mitsubishi Electric Corp | Dry etching device |
US4361749A (en) * | 1980-02-04 | 1982-11-30 | Western Electric Co., Inc. | Uniformly cooled plasma etching electrode |
US4275289A (en) * | 1980-02-04 | 1981-06-23 | Western Electric Company, Inc. | Uniformly cooled plasma etching electrode |
DD153497A3 (en) * | 1980-02-08 | 1982-01-13 | Georg Rudakoff | METHOD AND DEVICE FOR PLASMA OR PLASMA CVD |
DE3175576D1 (en) * | 1980-12-11 | 1986-12-11 | Toshiba Kk | Dry etching device and method |
US4421786A (en) * | 1981-01-23 | 1983-12-20 | Western Electric Co. | Chemical vapor deposition reactor for silicon epitaxial processes |
EP0089382B1 (en) * | 1982-03-18 | 1986-08-20 | Ibm Deutschland Gmbh | Plasma-reactor and its use in etching and coating substrates |
US4686111A (en) * | 1982-05-27 | 1987-08-11 | Motorola, Inc. | Passivated and low scatter acoustic wave devices and method thereof |
JPS591671A (en) * | 1982-05-28 | 1984-01-07 | Fujitsu Ltd | Plasma cvd device |
US4483883A (en) * | 1982-12-22 | 1984-11-20 | Energy Conversion Devices, Inc. | Upstream cathode assembly |
US4585668A (en) * | 1983-02-28 | 1986-04-29 | Michigan State University | Method for treating a surface with a microwave or UHF plasma and improved apparatus |
US4534826A (en) * | 1983-12-29 | 1985-08-13 | Ibm Corporation | Trench etch process for dielectric isolation |
JPS60191269A (en) * | 1984-03-13 | 1985-09-28 | Sharp Corp | Manufacturing device for electrophotographic sensitive body |
US4630566A (en) * | 1984-08-16 | 1986-12-23 | Board Of Trustees Operating Michigan State University | Microwave or UHF plasma improved apparatus |
US4661196A (en) * | 1984-10-22 | 1987-04-28 | Texas Instruments Incorporated | Plasma etch movable substrate |
US4657620A (en) * | 1984-10-22 | 1987-04-14 | Texas Instruments Incorporated | Automated single slice powered load lock plasma reactor |
US4657617A (en) * | 1984-10-22 | 1987-04-14 | Texas Instruments Incorporated | Anodized aluminum substrate for plasma etch reactor |
US4657621A (en) * | 1984-10-22 | 1987-04-14 | Texas Instruments Incorporated | Low particulate vacuum chamber input/output valve |
US4654106A (en) * | 1984-10-22 | 1987-03-31 | Texas Instruments Incorporated | Automated plasma reactor |
US4657618A (en) * | 1984-10-22 | 1987-04-14 | Texas Instruments Incorporated | Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate |
US4659413A (en) * | 1984-10-24 | 1987-04-21 | Texas Instruments Incorporated | Automated single slice cassette load lock plasma reactor |
US4603056A (en) * | 1985-04-25 | 1986-07-29 | International Business Machines Corporation | Surface treatment of a molybdenum screening mask |
US4834022A (en) * | 1985-11-08 | 1989-05-30 | Focus Semiconductor Systems, Inc. | CVD reactor and gas injection system |
US4708766A (en) * | 1986-11-07 | 1987-11-24 | Texas Instruments Incorporated | Hydrogen iodide etch of tin oxide |
US4807004A (en) * | 1986-11-26 | 1989-02-21 | Texas Instruments Incorporated | Tin oxide CCD imager |
US4976996A (en) * | 1987-02-17 | 1990-12-11 | Lam Research Corporation | Chemical vapor deposition reactor and method of use thereof |
US4885074A (en) * | 1987-02-24 | 1989-12-05 | International Business Machines Corporation | Plasma reactor having segmented electrodes |
US5200158A (en) * | 1987-02-25 | 1993-04-06 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US4931261A (en) * | 1987-02-25 | 1990-06-05 | Adir Jacob | Apparatus for dry sterilization of medical devices and materials |
US4917586A (en) * | 1987-02-25 | 1990-04-17 | Adir Jacob | Process for dry sterilization of medical devices and materials |
US5171525A (en) * | 1987-02-25 | 1992-12-15 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US4976920A (en) * | 1987-07-14 | 1990-12-11 | Adir Jacob | Process for dry sterilization of medical devices and materials |
US4943417A (en) * | 1987-02-25 | 1990-07-24 | Adir Jacob | Apparatus for dry sterilization of medical devices and materials |
US4818488A (en) * | 1987-02-25 | 1989-04-04 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US4801427A (en) * | 1987-02-25 | 1989-01-31 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US5087418A (en) * | 1987-02-25 | 1992-02-11 | Adir Jacob | Process for dry sterilization of medical devices and materials |
US5198034A (en) * | 1987-03-31 | 1993-03-30 | Epsilon Technology, Inc. | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
US4993358A (en) * | 1989-07-28 | 1991-02-19 | Watkins-Johnson Company | Chemical vapor deposition reactor and method of operation |
DE4140158A1 (en) * | 1991-12-05 | 1993-06-09 | Krupp Widia Gmbh, 4300 Essen, De | METHOD AND DEVICE FOR COATING HARD MATERIAL IN SUBSTRATE BODIES |
JPH05243160A (en) * | 1992-02-28 | 1993-09-21 | Nec Yamagata Ltd | Plasma cvd device for manufacturing semiconductor device |
US6002109A (en) * | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
KR100268432B1 (en) * | 1998-09-05 | 2000-11-01 | 윤종용 | Device for Plasma Etching |
WO2002024985A1 (en) * | 2000-09-22 | 2002-03-28 | Aixtron Ag | Gas inlet mechanism for cvd-method and device |
DE10153463A1 (en) * | 2001-10-30 | 2003-05-15 | Aixtron Ag | Method and device for depositing, in particular, crystalline layers on, in particular, crystalline substrates |
DE10157946A1 (en) * | 2001-11-27 | 2003-06-05 | Osram Opto Semiconductors Gmbh | Device and method for growing layers on a substrate |
JP3791432B2 (en) * | 2002-02-27 | 2006-06-28 | 住友電気工業株式会社 | Heating device for semiconductor manufacturing |
TWI220786B (en) * | 2002-09-11 | 2004-09-01 | Au Optronics Corp | Supporting structure |
DE10320597A1 (en) * | 2003-04-30 | 2004-12-02 | Aixtron Ag | Method and device for depositing semiconductor layers with two process gases, one of which is preconditioned |
US20050178336A1 (en) * | 2003-07-15 | 2005-08-18 | Heng Liu | Chemical vapor deposition reactor having multiple inlets |
US20050011459A1 (en) * | 2003-07-15 | 2005-01-20 | Heng Liu | Chemical vapor deposition reactor |
KR100534209B1 (en) * | 2003-07-29 | 2005-12-08 | 삼성전자주식회사 | chemical vapor deposition fabricating equipment for manufacturing of semiconductor device |
US6995545B2 (en) * | 2003-08-18 | 2006-02-07 | Mks Instruments, Inc. | Control system for a sputtering system |
KR100782380B1 (en) * | 2005-01-24 | 2007-12-07 | 삼성전자주식회사 | Device for making semiconductor |
US7897495B2 (en) * | 2006-12-12 | 2011-03-01 | Applied Materials, Inc. | Formation of epitaxial layer containing silicon and carbon |
US9064960B2 (en) * | 2007-01-31 | 2015-06-23 | Applied Materials, Inc. | Selective epitaxy process control |
US20100288625A1 (en) * | 2007-02-28 | 2010-11-18 | Ulvac, Inc. | Film deposition apparatus and film deposition method |
US8216419B2 (en) * | 2008-03-28 | 2012-07-10 | Bridgelux, Inc. | Drilled CVD shower head |
US20090096349A1 (en) * | 2007-04-26 | 2009-04-16 | Moshtagh Vahid S | Cross flow cvd reactor |
US8668775B2 (en) * | 2007-10-31 | 2014-03-11 | Toshiba Techno Center Inc. | Machine CVD shower head |
US8298338B2 (en) * | 2007-12-26 | 2012-10-30 | Samsung Electronics Co., Ltd. | Chemical vapor deposition apparatus |
KR100982987B1 (en) * | 2008-04-18 | 2010-09-17 | 삼성엘이디 주식회사 | Apparatus for chemical vapor deposition |
KR101004822B1 (en) * | 2008-04-18 | 2010-12-28 | 삼성엘이디 주식회사 | Apparatus for chemical vapor deposition |
JP6925548B1 (en) * | 2020-07-08 | 2021-08-25 | 信越化学工業株式会社 | Manufacturing method and film forming equipment for gallium oxide semiconductor film |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2580131A (en) * | 1947-02-25 | 1951-12-25 | Chandler & Price Co | Method and apparatus for coating a lithographic plate |
DE1150366B (en) * | 1958-12-09 | 1963-06-20 | Siemens Ag | Process for the production of hyperpure silicon |
CH409694A (en) * | 1962-11-06 | 1966-03-15 | Berghaus Elektrophysik Anst | Process for treating parts of a ballpoint pen |
US3309221A (en) * | 1963-03-25 | 1967-03-14 | Minnesota Mining & Mfg | Surface activation of passive polymers and articles produced thereby |
GB1136218A (en) * | 1965-12-14 | 1968-12-11 | Standard Telephones Cables Ltd | Improvements in or relating to the manufacture of semiconductor optical devices |
GB1104935A (en) * | 1964-05-08 | 1968-03-06 | Standard Telephones Cables Ltd | Improvements in or relating to a method of forming a layer of an inorganic compound |
US3329601A (en) * | 1964-09-15 | 1967-07-04 | Donald M Mattox | Apparatus for coating a cathodically biased substrate from plasma of ionized coatingmaterial |
US3364833A (en) * | 1965-02-03 | 1968-01-23 | Ibm | Wash ammonia development device |
US3323436A (en) * | 1965-03-17 | 1967-06-06 | Ibm | Method and apparatus for development of film |
US3424629A (en) * | 1965-12-13 | 1969-01-28 | Ibm | High capacity epitaxial apparatus and method |
US3408982A (en) * | 1966-08-25 | 1968-11-05 | Emil R. Capita | Vapor plating apparatus including rotatable substrate support |
DE1621358A1 (en) * | 1966-11-08 | 1971-04-29 | Texas Instruments Inc | Process for applying thin films of dielectric material to a substrate |
US3594227A (en) * | 1968-07-12 | 1971-07-20 | Bell Telephone Labor Inc | Method for treating semiconductor slices with gases |
JPS4930319B1 (en) * | 1969-08-29 | 1974-08-12 | ||
US3696779A (en) * | 1969-12-29 | 1972-10-10 | Kokusai Electric Co Ltd | Vapor growth device |
-
1971
- 1971-10-27 US US00192957A patent/US3757733A/en not_active Expired - Lifetime
-
1972
- 1972-10-02 GB GB4527772A patent/GB1408056A/en not_active Expired
- 1972-10-20 DE DE2251571A patent/DE2251571C3/en not_active Expired
- 1972-10-26 JP JP10756672A patent/JPS5324915B2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2219311A (en) * | 1988-05-06 | 1989-12-06 | Elektromat Veb | Gas inlet and discharge attachment for the gas-phase processing of workpieces |
GB2219311B (en) * | 1988-05-06 | 1992-04-08 | Elektromat Veb | Apparatus for use in introducing gas into a reaction chamber and discharging gas from the chamber for the gas-phase processing of workpieces |
Also Published As
Publication number | Publication date |
---|---|
US3757733A (en) | 1973-09-11 |
JPS4851874A (en) | 1973-07-20 |
DE2251571A1 (en) | 1973-05-03 |
DE2251571B2 (en) | 1979-10-31 |
DE2251571C3 (en) | 1985-05-15 |
JPS5324915B2 (en) | 1978-07-24 |
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