JPS6477137A - Wiring board having lead for bonding - Google Patents

Wiring board having lead for bonding

Info

Publication number
JPS6477137A
JPS6477137A JP62232641A JP23264187A JPS6477137A JP S6477137 A JPS6477137 A JP S6477137A JP 62232641 A JP62232641 A JP 62232641A JP 23264187 A JP23264187 A JP 23264187A JP S6477137 A JPS6477137 A JP S6477137A
Authority
JP
Japan
Prior art keywords
bonding
leads
copper
film
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62232641A
Other languages
Japanese (ja)
Inventor
Yuji Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP62232641A priority Critical patent/JPS6477137A/en
Publication of JPS6477137A publication Critical patent/JPS6477137A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the mechanical strength of leads for bonding and to obtain a wiring board having the leads for bonding, in which a crack and so on are not generated, by a method wherein an Al alloy containing a prescribed ratio of copper is used as a metal foil constituting the leads for bonding. CONSTITUTION:An aperture 2 is formed in the center of a film 1 consisting of a polyimide and so on and an electrode wiring pattern 3 is formed in the upper surface of the film 1. The pattern 3 is laminated on the upper surface of the film 1. A foil consisting of an Al-copper alloy containing 6% or less of copper is formed by photoetching. A plurality of leads 5 and 5' for bonding, which are constituted of the foil, are made to protrude inwards of the aperture 2 and a tin plating 6 is applied to the surfaces thereof. The copper-containing Al alloy is superior in an etching resistance and a plating treatmentability to tin and so on like those of copper, and the mechanical strength of the leads for bonding is improved and no crack is generated at the time of bonding.
JP62232641A 1987-09-18 1987-09-18 Wiring board having lead for bonding Pending JPS6477137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62232641A JPS6477137A (en) 1987-09-18 1987-09-18 Wiring board having lead for bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62232641A JPS6477137A (en) 1987-09-18 1987-09-18 Wiring board having lead for bonding

Publications (1)

Publication Number Publication Date
JPS6477137A true JPS6477137A (en) 1989-03-23

Family

ID=16942482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62232641A Pending JPS6477137A (en) 1987-09-18 1987-09-18 Wiring board having lead for bonding

Country Status (1)

Country Link
JP (1) JPS6477137A (en)

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