JPS64737A - Applicator for resist - Google Patents

Applicator for resist

Info

Publication number
JPS64737A
JPS64737A JP62227599A JP22759987A JPS64737A JP S64737 A JPS64737 A JP S64737A JP 62227599 A JP62227599 A JP 62227599A JP 22759987 A JP22759987 A JP 22759987A JP S64737 A JPS64737 A JP S64737A
Authority
JP
Japan
Prior art keywords
substrate
resist
rotary chuck
solvent atmosphere
regulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62227599A
Other languages
Japanese (ja)
Other versions
JPH01737A (en
Inventor
Noboru Yamamoto
Yasuo Matsuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62227599A priority Critical patent/JPS64737A/en
Publication of JPH01737A publication Critical patent/JPH01737A/en
Publication of JPS64737A publication Critical patent/JPS64737A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE: To form a uniform resist film in a solvent atmosphere by reducing the vortex flow of the solvent atmosphere generated by revolution at high speed of a rotary chuck by a regulating plate.
CONSTITUTION: A regulating plate 10 has a function in which the vortex flow of a solvent atmosphere generated by revolution at high speed of a rotary chuck 5 holding a substrate 4 is reduced. The substrate 4 is placed and fixed onto the rotary chuck 5, and a resist 11 is dropped from a dropping nozzle 7 while turning the substrate 4 and the resist 11 is applied onto the surface of the substrate 4, but the vortex flow of the solvent atmosphere generated by the rotation of the rotary chuck 5 is diminished because the regulating plate 10 is mounted, thus keeping vapor pressure in an applying vessel 1 constant, then uniformly applying the resist. Accordingly, pattern size formed to the substrate is equalized, thus remarkably improving the quality and yield of the substrate.
COPYRIGHT: (C)1989,JPO&Japio
JP62227599A 1987-03-27 1987-09-11 Applicator for resist Pending JPS64737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227599A JPS64737A (en) 1987-03-27 1987-09-11 Applicator for resist

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-73465 1987-03-27
JP7346587 1987-03-27
JP62227599A JPS64737A (en) 1987-03-27 1987-09-11 Applicator for resist

Publications (2)

Publication Number Publication Date
JPH01737A JPH01737A (en) 1989-01-05
JPS64737A true JPS64737A (en) 1989-01-05

Family

ID=26414613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227599A Pending JPS64737A (en) 1987-03-27 1987-09-11 Applicator for resist

Country Status (1)

Country Link
JP (1) JPS64737A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4564788A (en) * 1982-07-30 1986-01-14 Siemens Aktiengesellschaft Delay line for high-performance traveling-wave tubes, in the form of a two part-tungsten and molybdenum-ring ribbon conductor

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5139737A (en) * 1974-10-01 1976-04-02 Canon Kk HAKUSOTOFUYO SUPINNAA
JPS58100425A (en) * 1981-12-11 1983-06-15 Hitachi Ltd Apparatus for uniformly applying resist film on wafer surfaces
JPS59216655A (en) * 1983-05-26 1984-12-06 Victor Co Of Japan Ltd Coating apparatus for forming film with uniform thickness on rotary substrate
JPS60132676A (en) * 1983-12-20 1985-07-15 Victor Co Of Japan Ltd Coating apparatus
JPS61235833A (en) * 1985-04-12 1986-10-21 Hitachi Ltd Coating apparatus
JPS62136265A (en) * 1985-12-10 1987-06-19 Matsushita Electric Ind Co Ltd Apparatus for applying treatment liquid
JPS62140674A (en) * 1985-12-12 1987-06-24 Matsushita Electric Ind Co Ltd Resist coater
JPS63141314A (en) * 1986-12-03 1988-06-13 Hitachi Electronics Eng Co Ltd Resist coating device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5139737A (en) * 1974-10-01 1976-04-02 Canon Kk HAKUSOTOFUYO SUPINNAA
JPS58100425A (en) * 1981-12-11 1983-06-15 Hitachi Ltd Apparatus for uniformly applying resist film on wafer surfaces
JPS59216655A (en) * 1983-05-26 1984-12-06 Victor Co Of Japan Ltd Coating apparatus for forming film with uniform thickness on rotary substrate
JPS60132676A (en) * 1983-12-20 1985-07-15 Victor Co Of Japan Ltd Coating apparatus
JPS61235833A (en) * 1985-04-12 1986-10-21 Hitachi Ltd Coating apparatus
JPS62136265A (en) * 1985-12-10 1987-06-19 Matsushita Electric Ind Co Ltd Apparatus for applying treatment liquid
JPS62140674A (en) * 1985-12-12 1987-06-24 Matsushita Electric Ind Co Ltd Resist coater
JPS63141314A (en) * 1986-12-03 1988-06-13 Hitachi Electronics Eng Co Ltd Resist coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4564788A (en) * 1982-07-30 1986-01-14 Siemens Aktiengesellschaft Delay line for high-performance traveling-wave tubes, in the form of a two part-tungsten and molybdenum-ring ribbon conductor

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