JPS6472560A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6472560A
JPS6472560A JP22891687A JP22891687A JPS6472560A JP S6472560 A JPS6472560 A JP S6472560A JP 22891687 A JP22891687 A JP 22891687A JP 22891687 A JP22891687 A JP 22891687A JP S6472560 A JPS6472560 A JP S6472560A
Authority
JP
Japan
Prior art keywords
substrate
film
base
region
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22891687A
Other languages
Japanese (ja)
Inventor
Katsunobu Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22891687A priority Critical patent/JPS6472560A/en
Publication of JPS6472560A publication Critical patent/JPS6472560A/en
Pending legal-status Critical Current

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  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To form small intrinsic base and emitter regions to miniaturize the title device in a self-alignment manner by forming an outer base whose upper and side faces are covered with insulating films and which protrudes on a substrate, and then diffusing an impurity in the substrate surrounded by the outer base to form the intrinsic base and emitter regions. CONSTITUTION:The upper face of one conductivity type silicon substrate 1 is covered with an antioxidation film 7a, the part of the film 7a is removed to form a window 7c for exposing the substrate on the periphery of a region to be an emitter region, the window 7c is filled with the opposite conductivity type silicon 3b, and with the film 7a as a mask the surface of the filled silicon 3b is thermally oxidized at 8a, and the remaining film 7a is removed. Then, an oxide film 8b is formed on the side face of the filled region 3b remaining on the substrate 1, the upper and side faces ar covered with the insulating films 8a, 8b to form an outer base 3b made of the silicon region protruding on the substrate 1. Thereafter, an impurity is diffused in the substrate 1 surrounded by the base 3b to form intrinsic base and emitter regions 3a and 4, thereby forming a bipolar transistor.
JP22891687A 1987-09-11 1987-09-11 Manufacture of semiconductor device Pending JPS6472560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22891687A JPS6472560A (en) 1987-09-11 1987-09-11 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22891687A JPS6472560A (en) 1987-09-11 1987-09-11 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6472560A true JPS6472560A (en) 1989-03-17

Family

ID=16883865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22891687A Pending JPS6472560A (en) 1987-09-11 1987-09-11 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6472560A (en)

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