JPS6469096A - Mounting method of electronic parts on printed board - Google Patents

Mounting method of electronic parts on printed board

Info

Publication number
JPS6469096A
JPS6469096A JP22684287A JP22684287A JPS6469096A JP S6469096 A JPS6469096 A JP S6469096A JP 22684287 A JP22684287 A JP 22684287A JP 22684287 A JP22684287 A JP 22684287A JP S6469096 A JPS6469096 A JP S6469096A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
resin film
electronic parts
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22684287A
Other languages
Japanese (ja)
Inventor
Yuki Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP22684287A priority Critical patent/JPS6469096A/en
Publication of JPS6469096A publication Critical patent/JPS6469096A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To avoid the generation of thermal stress, and prevent the generation of resin crack, plastic crack, etc., by a method wherein an electrically insulating film is previously bonded and fixed to the end-portion upper surface of an external lead, before adjacent external leads of electronic parts are mounted on a printed circuit board, and a part of a film positioned between the adjacent end-portions of external leads and the printed circuit board surface are subjected to thermocompression bonding. CONSTITUTION:A surface mount type semiconductor device 1 is previously bonded and fixed at the end-portion upper surface 8 of an external lead 7, with an electrically insulative resin film 9, before the device is surface-mounted on a printed circuit board. Then a part 10 of the resin film positioned between adjacent end-portions 13 of external leads, and the printed circuit board surface 11 are subjected to thermocompression bonding at a temperature of about 100 deg.C. Thereby, enabling the rigid mounting on the printed circuit board. Electrical connection between a printed circuit board side electrode 12 and the external lead end-portion 13 can be easily attained, by the effect of the bonding force between the resin film layer 9 and the printed circuit board 2, without using bonding method such as soldering.
JP22684287A 1987-09-10 1987-09-10 Mounting method of electronic parts on printed board Pending JPS6469096A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22684287A JPS6469096A (en) 1987-09-10 1987-09-10 Mounting method of electronic parts on printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22684287A JPS6469096A (en) 1987-09-10 1987-09-10 Mounting method of electronic parts on printed board

Publications (1)

Publication Number Publication Date
JPS6469096A true JPS6469096A (en) 1989-03-15

Family

ID=16851423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22684287A Pending JPS6469096A (en) 1987-09-10 1987-09-10 Mounting method of electronic parts on printed board

Country Status (1)

Country Link
JP (1) JPS6469096A (en)

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