JPS6467321A - Control method and device for mold temperature - Google Patents

Control method and device for mold temperature

Info

Publication number
JPS6467321A
JPS6467321A JP22293587A JP22293587A JPS6467321A JP S6467321 A JPS6467321 A JP S6467321A JP 22293587 A JP22293587 A JP 22293587A JP 22293587 A JP22293587 A JP 22293587A JP S6467321 A JPS6467321 A JP S6467321A
Authority
JP
Japan
Prior art keywords
heat amount
mold
computed
heating medium
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22293587A
Other languages
Japanese (ja)
Other versions
JPH0725114B2 (en
Inventor
Toshio Inami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP22293587A priority Critical patent/JPH0725114B2/en
Publication of JPS6467321A publication Critical patent/JPS6467321A/en
Publication of JPH0725114B2 publication Critical patent/JPH0725114B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/78Measuring, controlling or regulating of temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To control precisely and accurately the mold temperature by means of a heating medium by switching the heating medium fed from a pump in the direction of returning the same to a tank when the heat amount computed by a second operator reaches a required heat amount computed by a first operator. CONSTITUTION:Temperature T1 of a heating medium flowing into a mold 1 and temperature T2 of a heating medium flowing out of the mold 1 are measured by temperature measuring devices 20 and 21 and heat amount (u) applied to the mold 1 is computed by a second operator consisting of a multiplier 30 and an integrator 31. Said heat amount (u) is compared with the required heat amount U computed by a first operator 26, and while difference is in said comparison, a flip-flop circuit 33 is actuated to retain first-third electromagnetic valves 5, 6 and 14 as they are. Signals from a comparison device 32 are zero when the computed heat amount (u) reaches the required heat amount U to reset the circuit 33 and demagnetize the first-third electromagnetic valves 5, 6 and 14. Accordingly, a pump 7 and the mold 1 are shut off, and a high temperature heating medium discharged out of the pump 7 is returned to a tank 9.
JP22293587A 1987-09-08 1987-09-08 Method and apparatus for controlling mold temperature Expired - Lifetime JPH0725114B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22293587A JPH0725114B2 (en) 1987-09-08 1987-09-08 Method and apparatus for controlling mold temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22293587A JPH0725114B2 (en) 1987-09-08 1987-09-08 Method and apparatus for controlling mold temperature

Publications (2)

Publication Number Publication Date
JPS6467321A true JPS6467321A (en) 1989-03-14
JPH0725114B2 JPH0725114B2 (en) 1995-03-22

Family

ID=16790173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22293587A Expired - Lifetime JPH0725114B2 (en) 1987-09-08 1987-09-08 Method and apparatus for controlling mold temperature

Country Status (1)

Country Link
JP (1) JPH0725114B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752161A (en) * 1993-08-20 1995-02-28 Denson Kk Mold cooling method and apparatus
EP0904911A1 (en) * 1997-09-30 1999-03-31 Regloplas AG Process and apparatus for regulating temperature of a load with a tempering medium
JP2011025577A (en) * 2009-07-28 2011-02-10 Meiki Co Ltd Molding apparatus and temperature control method for molding apparatus
CN103052487A (en) * 2010-09-17 2013-04-17 克劳斯玛菲科技有限公司 Method for producing a molded plastics part
WO2020183929A1 (en) * 2019-03-14 2020-09-17 テルモ株式会社 Application device and application method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752161A (en) * 1993-08-20 1995-02-28 Denson Kk Mold cooling method and apparatus
EP0904911A1 (en) * 1997-09-30 1999-03-31 Regloplas AG Process and apparatus for regulating temperature of a load with a tempering medium
JP2011025577A (en) * 2009-07-28 2011-02-10 Meiki Co Ltd Molding apparatus and temperature control method for molding apparatus
CN103052487A (en) * 2010-09-17 2013-04-17 克劳斯玛菲科技有限公司 Method for producing a molded plastics part
WO2020183929A1 (en) * 2019-03-14 2020-09-17 テルモ株式会社 Application device and application method
JPWO2020183929A1 (en) * 2019-03-14 2020-09-17

Also Published As

Publication number Publication date
JPH0725114B2 (en) 1995-03-22

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