JPS6467321A - Control method and device for mold temperature - Google Patents
Control method and device for mold temperatureInfo
- Publication number
- JPS6467321A JPS6467321A JP22293587A JP22293587A JPS6467321A JP S6467321 A JPS6467321 A JP S6467321A JP 22293587 A JP22293587 A JP 22293587A JP 22293587 A JP22293587 A JP 22293587A JP S6467321 A JPS6467321 A JP S6467321A
- Authority
- JP
- Japan
- Prior art keywords
- heat amount
- mold
- computed
- heating medium
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To control precisely and accurately the mold temperature by means of a heating medium by switching the heating medium fed from a pump in the direction of returning the same to a tank when the heat amount computed by a second operator reaches a required heat amount computed by a first operator. CONSTITUTION:Temperature T1 of a heating medium flowing into a mold 1 and temperature T2 of a heating medium flowing out of the mold 1 are measured by temperature measuring devices 20 and 21 and heat amount (u) applied to the mold 1 is computed by a second operator consisting of a multiplier 30 and an integrator 31. Said heat amount (u) is compared with the required heat amount U computed by a first operator 26, and while difference is in said comparison, a flip-flop circuit 33 is actuated to retain first-third electromagnetic valves 5, 6 and 14 as they are. Signals from a comparison device 32 are zero when the computed heat amount (u) reaches the required heat amount U to reset the circuit 33 and demagnetize the first-third electromagnetic valves 5, 6 and 14. Accordingly, a pump 7 and the mold 1 are shut off, and a high temperature heating medium discharged out of the pump 7 is returned to a tank 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22293587A JPH0725114B2 (en) | 1987-09-08 | 1987-09-08 | Method and apparatus for controlling mold temperature |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22293587A JPH0725114B2 (en) | 1987-09-08 | 1987-09-08 | Method and apparatus for controlling mold temperature |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6467321A true JPS6467321A (en) | 1989-03-14 |
JPH0725114B2 JPH0725114B2 (en) | 1995-03-22 |
Family
ID=16790173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22293587A Expired - Lifetime JPH0725114B2 (en) | 1987-09-08 | 1987-09-08 | Method and apparatus for controlling mold temperature |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0725114B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752161A (en) * | 1993-08-20 | 1995-02-28 | Denson Kk | Mold cooling method and apparatus |
EP0904911A1 (en) * | 1997-09-30 | 1999-03-31 | Regloplas AG | Process and apparatus for regulating temperature of a load with a tempering medium |
JP2011025577A (en) * | 2009-07-28 | 2011-02-10 | Meiki Co Ltd | Molding apparatus and temperature control method for molding apparatus |
CN103052487A (en) * | 2010-09-17 | 2013-04-17 | 克劳斯玛菲科技有限公司 | Method for producing a molded plastics part |
WO2020183929A1 (en) * | 2019-03-14 | 2020-09-17 | テルモ株式会社 | Application device and application method |
-
1987
- 1987-09-08 JP JP22293587A patent/JPH0725114B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752161A (en) * | 1993-08-20 | 1995-02-28 | Denson Kk | Mold cooling method and apparatus |
EP0904911A1 (en) * | 1997-09-30 | 1999-03-31 | Regloplas AG | Process and apparatus for regulating temperature of a load with a tempering medium |
JP2011025577A (en) * | 2009-07-28 | 2011-02-10 | Meiki Co Ltd | Molding apparatus and temperature control method for molding apparatus |
CN103052487A (en) * | 2010-09-17 | 2013-04-17 | 克劳斯玛菲科技有限公司 | Method for producing a molded plastics part |
WO2020183929A1 (en) * | 2019-03-14 | 2020-09-17 | テルモ株式会社 | Application device and application method |
JPWO2020183929A1 (en) * | 2019-03-14 | 2020-09-17 |
Also Published As
Publication number | Publication date |
---|---|
JPH0725114B2 (en) | 1995-03-22 |
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