JPS5718210A - Resin molding method for semiconductor device - Google Patents
Resin molding method for semiconductor deviceInfo
- Publication number
- JPS5718210A JPS5718210A JP9310680A JP9310680A JPS5718210A JP S5718210 A JPS5718210 A JP S5718210A JP 9310680 A JP9310680 A JP 9310680A JP 9310680 A JP9310680 A JP 9310680A JP S5718210 A JPS5718210 A JP S5718210A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin tablet
- semiconductor
- tablet
- surface temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To keep the heating temperature of a resin tablet at a fixed level, by preheating the resin tablet with a high frequency heater, while measuring the surface temperature of the resin tablet, before inserting the resin tablet into a potting part.
CONSTITUTION: In a resin molding method for a semiconductor in which a resin tablet is inserted into a potting part and pressed with a plunger to pack the resin into the cavity of a metal mold where the semiconductor is arranged, the resin tablet 51 is heated with a magnetron 41 before inserted into the potting part. In this case, the surface temperature of the resin tablet 51 is measured with an infrared thermometer 55 by operation of a control circuit 50. When the surface temperature reaches a fixed level, the operation of the magnetron 41 is stopped. Consequently, the resin tablet can be preheated at the fixed temperature with high accuracy. As a result, it is possible to inhibit molding defects such as unpackings, voids, etc. in the resin surrounding the semiconductor.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9310680A JPS5718210A (en) | 1980-07-07 | 1980-07-07 | Resin molding method for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9310680A JPS5718210A (en) | 1980-07-07 | 1980-07-07 | Resin molding method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5718210A true JPS5718210A (en) | 1982-01-30 |
Family
ID=14073267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9310680A Pending JPS5718210A (en) | 1980-07-07 | 1980-07-07 | Resin molding method for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5718210A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5316463A (en) * | 1992-11-24 | 1994-05-31 | Neu Dynamics Corporation | Encapsulating molding equipment |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
-
1980
- 1980-07-07 JP JP9310680A patent/JPS5718210A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5316463A (en) * | 1992-11-24 | 1994-05-31 | Neu Dynamics Corporation | Encapsulating molding equipment |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
US5429488A (en) * | 1992-11-24 | 1995-07-04 | Neu Dynamics Corporation | Encapsulating molding equipment and method |
US5484274A (en) * | 1992-11-24 | 1996-01-16 | Neu Dynamics Corp. | Encapsulation molding equipment |
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