JPS5718210A - Resin molding method for semiconductor device - Google Patents

Resin molding method for semiconductor device

Info

Publication number
JPS5718210A
JPS5718210A JP9310680A JP9310680A JPS5718210A JP S5718210 A JPS5718210 A JP S5718210A JP 9310680 A JP9310680 A JP 9310680A JP 9310680 A JP9310680 A JP 9310680A JP S5718210 A JPS5718210 A JP S5718210A
Authority
JP
Japan
Prior art keywords
resin
resin tablet
semiconductor
tablet
surface temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9310680A
Other languages
Japanese (ja)
Inventor
Masashi Tarui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP9310680A priority Critical patent/JPS5718210A/en
Publication of JPS5718210A publication Critical patent/JPS5718210A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To keep the heating temperature of a resin tablet at a fixed level, by preheating the resin tablet with a high frequency heater, while measuring the surface temperature of the resin tablet, before inserting the resin tablet into a potting part.
CONSTITUTION: In a resin molding method for a semiconductor in which a resin tablet is inserted into a potting part and pressed with a plunger to pack the resin into the cavity of a metal mold where the semiconductor is arranged, the resin tablet 51 is heated with a magnetron 41 before inserted into the potting part. In this case, the surface temperature of the resin tablet 51 is measured with an infrared thermometer 55 by operation of a control circuit 50. When the surface temperature reaches a fixed level, the operation of the magnetron 41 is stopped. Consequently, the resin tablet can be preheated at the fixed temperature with high accuracy. As a result, it is possible to inhibit molding defects such as unpackings, voids, etc. in the resin surrounding the semiconductor.
COPYRIGHT: (C)1982,JPO&Japio
JP9310680A 1980-07-07 1980-07-07 Resin molding method for semiconductor device Pending JPS5718210A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9310680A JPS5718210A (en) 1980-07-07 1980-07-07 Resin molding method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9310680A JPS5718210A (en) 1980-07-07 1980-07-07 Resin molding method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5718210A true JPS5718210A (en) 1982-01-30

Family

ID=14073267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9310680A Pending JPS5718210A (en) 1980-07-07 1980-07-07 Resin molding method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5718210A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5484274A (en) * 1992-11-24 1996-01-16 Neu Dynamics Corp. Encapsulation molding equipment

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