JPS56108241A - Inspecting apparatus for semiconductor wafer - Google Patents

Inspecting apparatus for semiconductor wafer

Info

Publication number
JPS56108241A
JPS56108241A JP1125280A JP1125280A JPS56108241A JP S56108241 A JPS56108241 A JP S56108241A JP 1125280 A JP1125280 A JP 1125280A JP 1125280 A JP1125280 A JP 1125280A JP S56108241 A JPS56108241 A JP S56108241A
Authority
JP
Japan
Prior art keywords
wafer
heating plate
detected
inspection
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1125280A
Other languages
Japanese (ja)
Inventor
Sadao Matai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1125280A priority Critical patent/JPS56108241A/en
Publication of JPS56108241A publication Critical patent/JPS56108241A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To reduce the time needed for inspection of semiconductor wafers by heating the following wafer and detecting its position in order to make preparations during inspection. CONSTITUTION:A semiconductor wafer 16 is moved onto a heating plates 6 by a loader 10, and according to the stored content in a control unit 15 the wafer 16 is secured to the heating plate 6. While the temperature is detected 14 and controlled 3, the wafer 16 is heated by the heating plate 6 and infrared rays 8 and at the same time, the position of a wafer mounting table 4 is detected 11 by the control unit 15. Then, the wafer 16 is moved to a given inspecting position, the temperature of the heating plate 6 is detected 13 to control, the position is detected 12 and an inspecting apparatus 1 is controlled to perform test. During the inspection, a heating plate 7 moves to a given position and the wafer moved by the loader 10 is carried onto the heating plate. Thus making preparations reduces the cost needed for the inspection process.
JP1125280A 1980-02-01 1980-02-01 Inspecting apparatus for semiconductor wafer Pending JPS56108241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1125280A JPS56108241A (en) 1980-02-01 1980-02-01 Inspecting apparatus for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1125280A JPS56108241A (en) 1980-02-01 1980-02-01 Inspecting apparatus for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS56108241A true JPS56108241A (en) 1981-08-27

Family

ID=11772741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1125280A Pending JPS56108241A (en) 1980-02-01 1980-02-01 Inspecting apparatus for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS56108241A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559589A1 (en) * 1984-02-10 1985-08-16 Dassault Electronique Method and device for carrying out climatic tests on electronic circuit cards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559589A1 (en) * 1984-02-10 1985-08-16 Dassault Electronique Method and device for carrying out climatic tests on electronic circuit cards

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