JPS6466977A - Manufacture of optical semiconductor device - Google Patents

Manufacture of optical semiconductor device

Info

Publication number
JPS6466977A
JPS6466977A JP22303087A JP22303087A JPS6466977A JP S6466977 A JPS6466977 A JP S6466977A JP 22303087 A JP22303087 A JP 22303087A JP 22303087 A JP22303087 A JP 22303087A JP S6466977 A JPS6466977 A JP S6466977A
Authority
JP
Japan
Prior art keywords
light
emitting diode
submount
substrate
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22303087A
Other languages
Japanese (ja)
Inventor
Takashi Tsubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP22303087A priority Critical patent/JPS6466977A/en
Publication of JPS6466977A publication Critical patent/JPS6466977A/en
Pending legal-status Critical Current

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  • Led Devices (AREA)

Abstract

PURPOSE:To enable continuous and automatic measurement and to prevent waste of header by bonding non-conforming articles, by bonding a large number of photosemiconductor elements on a substrate which becomes a submount and by measuring the elements in that status. CONSTITUTION:A light-emitting diode 11 is laid out on a silicon substrate 12 in submount-size pitch. Then, a substrate 12 is placed on a prober stage 13 and a prober 14 is placed against an electrode 15 of the light-emitting diode 11 for performing measurement. Then, the silicon substrate 12 is cut by a dicing saw and a silicon submount 17 is bonded to the header along with the light- emitting diode 11 on it to complete a light-emitting diode device.
JP22303087A 1987-09-08 1987-09-08 Manufacture of optical semiconductor device Pending JPS6466977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22303087A JPS6466977A (en) 1987-09-08 1987-09-08 Manufacture of optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22303087A JPS6466977A (en) 1987-09-08 1987-09-08 Manufacture of optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS6466977A true JPS6466977A (en) 1989-03-13

Family

ID=16791743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22303087A Pending JPS6466977A (en) 1987-09-08 1987-09-08 Manufacture of optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS6466977A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002335032A (en) * 2001-05-08 2002-11-22 Sony Corp Optical device and its manufacturing method
JP2012212929A (en) * 2005-05-27 2012-11-01 Lattice Power (Jiangxi) Corp InGaAlN LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002335032A (en) * 2001-05-08 2002-11-22 Sony Corp Optical device and its manufacturing method
JP2012212929A (en) * 2005-05-27 2012-11-01 Lattice Power (Jiangxi) Corp InGaAlN LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

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