JPS6484753A - Optical connection circuit - Google Patents

Abstract

PURPOSE:To make a package small-sized and to reduce an amount of leakage to an optical detector to be used to receive other optical data signals by a method wherein two or more semiconductor photo-electronic integrated circuits where electronic circuits, light-emitting devices and photodetectors are integrated on each semiconductor substrate are put into one package in such a way that surfaces of the individual semiconductor photoelectronic integrated circuits are faced with each other. CONSTITUTION:Two semiconductor photoelectronic integrated circuits 100, 200 are arranged in such a way that the surface of a silicon semiconductor substrate 11 is faced with the surface of a silicon semiconductor substrate 14. Semiconductor lasers 12 and optical detectors 13 on the semiconductor photoelectronic integrated circuit 100 are faced individually with optical detectors 16 and semiconductor lasers 15 on the semiconductor photoelectronic integrated circuit 200. With this arrangement, the two semiconductor photoelectronic integrated circuits 100, 200 are put into one package. The two semiconductor integrated circuits 100, 200 can be arranged close to each other with a gap of less than 1 mm; the package of an LSI can be made small; because a distance between the semiconductor lasers and the optical detectors which are faced with each other is short, they can be coupled efficiently and an amount of leakage to an optical detector used to receive other optical data can be reduced.