JPS6465859A - Manufacture of circuit substrate - Google Patents
Manufacture of circuit substrateInfo
- Publication number
- JPS6465859A JPS6465859A JP62222659A JP22265987A JPS6465859A JP S6465859 A JPS6465859 A JP S6465859A JP 62222659 A JP62222659 A JP 62222659A JP 22265987 A JP22265987 A JP 22265987A JP S6465859 A JPS6465859 A JP S6465859A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive paste
- circuit substrate
- substrate
- fired
- dried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 4
- 230000001070 adhesive effect Effects 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000000919 ceramic Substances 0.000 abstract 2
- 239000002131 composite material Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- 230000035939 shock Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052758 niobium Inorganic materials 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Ceramic Products (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222659A JP2571233B2 (ja) | 1987-09-05 | 1987-09-05 | 回路基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222659A JP2571233B2 (ja) | 1987-09-05 | 1987-09-05 | 回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6465859A true JPS6465859A (en) | 1989-03-13 |
JP2571233B2 JP2571233B2 (ja) | 1997-01-16 |
Family
ID=16785915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62222659A Expired - Lifetime JP2571233B2 (ja) | 1987-09-05 | 1987-09-05 | 回路基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2571233B2 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03101153A (ja) * | 1989-09-13 | 1991-04-25 | Denki Kagaku Kogyo Kk | 銅回路を有する窒化アルミニウム基板の製法 |
JPH04225296A (ja) * | 1990-12-26 | 1992-08-14 | Tokin Corp | 銅回路付きセラミックス基板 |
JPH05163077A (ja) * | 1991-12-16 | 1993-06-29 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
WO1997004483A1 (fr) * | 1995-07-21 | 1997-02-06 | Kabushiki Kaisha Toshiba | Plaquette de circuits imprimes de ceramique |
JP2013177290A (ja) * | 2012-02-01 | 2013-09-09 | Mitsubishi Materials Corp | 銅部材接合用ペーストおよび接合体の製造方法 |
JP2013179263A (ja) * | 2012-02-01 | 2013-09-09 | Mitsubishi Materials Corp | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法 |
CN103508758A (zh) * | 2013-07-05 | 2014-01-15 | 景德镇景光精盛电器有限公司 | 一种用于电真空金属化陶瓷的烧结镍印刷剂 |
US9504144B2 (en) | 2012-02-01 | 2016-11-22 | Mitsubishi Materials Corporation | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste |
CN111940733A (zh) * | 2020-07-20 | 2020-11-17 | 北京科技大学 | 选区激光熔化过程飞溅氧化物清除及供粉补偿装置和方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5538225A (en) * | 1978-08-28 | 1980-03-17 | Ishikawajima Harima Heavy Ind | Underground storage tank |
JPS59137373A (ja) * | 1983-01-20 | 1984-08-07 | 日本特殊陶業株式会社 | セラミツクの接合方法 |
JPS59232692A (ja) * | 1983-06-17 | 1984-12-27 | Ngk Spark Plug Co Ltd | セラミツクと金属等との接合用ろう材及びこれを用いたセラミツクと金属等の複合体 |
JPS6063337A (ja) * | 1983-09-14 | 1985-04-11 | Sumitomo Electric Ind Ltd | 耐熱性導電材料 |
JPS60208402A (ja) * | 1984-04-02 | 1985-10-21 | Fukuda Kinzoku Hakufun Kogyo Kk | 分散強化型銅合金粉末の製造方法 |
-
1987
- 1987-09-05 JP JP62222659A patent/JP2571233B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5538225A (en) * | 1978-08-28 | 1980-03-17 | Ishikawajima Harima Heavy Ind | Underground storage tank |
JPS59137373A (ja) * | 1983-01-20 | 1984-08-07 | 日本特殊陶業株式会社 | セラミツクの接合方法 |
JPS59232692A (ja) * | 1983-06-17 | 1984-12-27 | Ngk Spark Plug Co Ltd | セラミツクと金属等との接合用ろう材及びこれを用いたセラミツクと金属等の複合体 |
JPS6063337A (ja) * | 1983-09-14 | 1985-04-11 | Sumitomo Electric Ind Ltd | 耐熱性導電材料 |
JPS60208402A (ja) * | 1984-04-02 | 1985-10-21 | Fukuda Kinzoku Hakufun Kogyo Kk | 分散強化型銅合金粉末の製造方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03101153A (ja) * | 1989-09-13 | 1991-04-25 | Denki Kagaku Kogyo Kk | 銅回路を有する窒化アルミニウム基板の製法 |
JPH04225296A (ja) * | 1990-12-26 | 1992-08-14 | Tokin Corp | 銅回路付きセラミックス基板 |
JPH05163077A (ja) * | 1991-12-16 | 1993-06-29 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
WO1997004483A1 (fr) * | 1995-07-21 | 1997-02-06 | Kabushiki Kaisha Toshiba | Plaquette de circuits imprimes de ceramique |
JP2013177290A (ja) * | 2012-02-01 | 2013-09-09 | Mitsubishi Materials Corp | 銅部材接合用ペーストおよび接合体の製造方法 |
JP2013179263A (ja) * | 2012-02-01 | 2013-09-09 | Mitsubishi Materials Corp | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法 |
US9504144B2 (en) | 2012-02-01 | 2016-11-22 | Mitsubishi Materials Corporation | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste |
US10375825B2 (en) | 2012-02-01 | 2019-08-06 | Mitsubishi Materials Corporation | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste |
CN103508758A (zh) * | 2013-07-05 | 2014-01-15 | 景德镇景光精盛电器有限公司 | 一种用于电真空金属化陶瓷的烧结镍印刷剂 |
CN111940733A (zh) * | 2020-07-20 | 2020-11-17 | 北京科技大学 | 选区激光熔化过程飞溅氧化物清除及供粉补偿装置和方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2571233B2 (ja) | 1997-01-16 |
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