JPS6465859A - Manufacture of circuit substrate - Google Patents

Manufacture of circuit substrate

Info

Publication number
JPS6465859A
JPS6465859A JP62222659A JP22265987A JPS6465859A JP S6465859 A JPS6465859 A JP S6465859A JP 62222659 A JP62222659 A JP 62222659A JP 22265987 A JP22265987 A JP 22265987A JP S6465859 A JPS6465859 A JP S6465859A
Authority
JP
Japan
Prior art keywords
adhesive paste
circuit substrate
substrate
fired
dried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62222659A
Other languages
English (en)
Other versions
JP2571233B2 (ja
Inventor
Takashi Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP62222659A priority Critical patent/JP2571233B2/ja
Publication of JPS6465859A publication Critical patent/JPS6465859A/ja
Application granted granted Critical
Publication of JP2571233B2 publication Critical patent/JP2571233B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Ceramic Products (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62222659A 1987-09-05 1987-09-05 回路基板の製造方法 Expired - Lifetime JP2571233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62222659A JP2571233B2 (ja) 1987-09-05 1987-09-05 回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222659A JP2571233B2 (ja) 1987-09-05 1987-09-05 回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6465859A true JPS6465859A (en) 1989-03-13
JP2571233B2 JP2571233B2 (ja) 1997-01-16

Family

ID=16785915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222659A Expired - Lifetime JP2571233B2 (ja) 1987-09-05 1987-09-05 回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP2571233B2 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101153A (ja) * 1989-09-13 1991-04-25 Denki Kagaku Kogyo Kk 銅回路を有する窒化アルミニウム基板の製法
JPH04225296A (ja) * 1990-12-26 1992-08-14 Tokin Corp 銅回路付きセラミックス基板
JPH05163077A (ja) * 1991-12-16 1993-06-29 Denki Kagaku Kogyo Kk セラミックス回路基板
WO1997004483A1 (fr) * 1995-07-21 1997-02-06 Kabushiki Kaisha Toshiba Plaquette de circuits imprimes de ceramique
JP2013177290A (ja) * 2012-02-01 2013-09-09 Mitsubishi Materials Corp 銅部材接合用ペーストおよび接合体の製造方法
JP2013179263A (ja) * 2012-02-01 2013-09-09 Mitsubishi Materials Corp パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
CN103508758A (zh) * 2013-07-05 2014-01-15 景德镇景光精盛电器有限公司 一种用于电真空金属化陶瓷的烧结镍印刷剂
US9504144B2 (en) 2012-02-01 2016-11-22 Mitsubishi Materials Corporation Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
CN111940733A (zh) * 2020-07-20 2020-11-17 北京科技大学 选区激光熔化过程飞溅氧化物清除及供粉补偿装置和方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538225A (en) * 1978-08-28 1980-03-17 Ishikawajima Harima Heavy Ind Underground storage tank
JPS59137373A (ja) * 1983-01-20 1984-08-07 日本特殊陶業株式会社 セラミツクの接合方法
JPS59232692A (ja) * 1983-06-17 1984-12-27 Ngk Spark Plug Co Ltd セラミツクと金属等との接合用ろう材及びこれを用いたセラミツクと金属等の複合体
JPS6063337A (ja) * 1983-09-14 1985-04-11 Sumitomo Electric Ind Ltd 耐熱性導電材料
JPS60208402A (ja) * 1984-04-02 1985-10-21 Fukuda Kinzoku Hakufun Kogyo Kk 分散強化型銅合金粉末の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538225A (en) * 1978-08-28 1980-03-17 Ishikawajima Harima Heavy Ind Underground storage tank
JPS59137373A (ja) * 1983-01-20 1984-08-07 日本特殊陶業株式会社 セラミツクの接合方法
JPS59232692A (ja) * 1983-06-17 1984-12-27 Ngk Spark Plug Co Ltd セラミツクと金属等との接合用ろう材及びこれを用いたセラミツクと金属等の複合体
JPS6063337A (ja) * 1983-09-14 1985-04-11 Sumitomo Electric Ind Ltd 耐熱性導電材料
JPS60208402A (ja) * 1984-04-02 1985-10-21 Fukuda Kinzoku Hakufun Kogyo Kk 分散強化型銅合金粉末の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101153A (ja) * 1989-09-13 1991-04-25 Denki Kagaku Kogyo Kk 銅回路を有する窒化アルミニウム基板の製法
JPH04225296A (ja) * 1990-12-26 1992-08-14 Tokin Corp 銅回路付きセラミックス基板
JPH05163077A (ja) * 1991-12-16 1993-06-29 Denki Kagaku Kogyo Kk セラミックス回路基板
WO1997004483A1 (fr) * 1995-07-21 1997-02-06 Kabushiki Kaisha Toshiba Plaquette de circuits imprimes de ceramique
JP2013177290A (ja) * 2012-02-01 2013-09-09 Mitsubishi Materials Corp 銅部材接合用ペーストおよび接合体の製造方法
JP2013179263A (ja) * 2012-02-01 2013-09-09 Mitsubishi Materials Corp パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
US9504144B2 (en) 2012-02-01 2016-11-22 Mitsubishi Materials Corporation Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US10375825B2 (en) 2012-02-01 2019-08-06 Mitsubishi Materials Corporation Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
CN103508758A (zh) * 2013-07-05 2014-01-15 景德镇景光精盛电器有限公司 一种用于电真空金属化陶瓷的烧结镍印刷剂
CN111940733A (zh) * 2020-07-20 2020-11-17 北京科技大学 选区激光熔化过程飞溅氧化物清除及供粉补偿装置和方法

Also Published As

Publication number Publication date
JP2571233B2 (ja) 1997-01-16

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