JPS6461938A - Pin head diode - Google Patents

Pin head diode

Info

Publication number
JPS6461938A
JPS6461938A JP21985587A JP21985587A JPS6461938A JP S6461938 A JPS6461938 A JP S6461938A JP 21985587 A JP21985587 A JP 21985587A JP 21985587 A JP21985587 A JP 21985587A JP S6461938 A JPS6461938 A JP S6461938A
Authority
JP
Japan
Prior art keywords
lead wire
core
heat
well
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21985587A
Other languages
Japanese (ja)
Inventor
Yoshinobu Morita
Seizan Yoshifusa
Noboru Funaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOKURIKU FUJI KK
Fuji Electric Co Ltd
Original Assignee
HOKURIKU FUJI KK
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOKURIKU FUJI KK, Fuji Electric Co Ltd filed Critical HOKURIKU FUJI KK
Priority to JP21985587A priority Critical patent/JPS6461938A/en
Publication of JPS6461938A publication Critical patent/JPS6461938A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Magnetic Heads (AREA)

Abstract

PURPOSE:To lessen the generation of heat in a lead wire, by forming the core of the lead wire with copper materials and further, by forming the surroundings of its core with steel materials. CONSTITUTION:A lead wire has the housing 4 of steel around its copper core 1 and is further coated with a plating layer 2 of Ni or Ag. This structure facilitates to evolute heat generated by steel materials having large resistance without affecting electric characteristics and hinders fluctuations of forward voltage as well as the deterioration of heat and then strengthens sucking force with respect to magnetic attraction as well.
JP21985587A 1987-09-02 1987-09-02 Pin head diode Pending JPS6461938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21985587A JPS6461938A (en) 1987-09-02 1987-09-02 Pin head diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21985587A JPS6461938A (en) 1987-09-02 1987-09-02 Pin head diode

Publications (1)

Publication Number Publication Date
JPS6461938A true JPS6461938A (en) 1989-03-08

Family

ID=16742113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21985587A Pending JPS6461938A (en) 1987-09-02 1987-09-02 Pin head diode

Country Status (1)

Country Link
JP (1) JPS6461938A (en)

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