JPS6460636A - Etching wiping - Google Patents

Etching wiping

Info

Publication number
JPS6460636A
JPS6460636A JP21550587A JP21550587A JPS6460636A JP S6460636 A JPS6460636 A JP S6460636A JP 21550587 A JP21550587 A JP 21550587A JP 21550587 A JP21550587 A JP 21550587A JP S6460636 A JPS6460636 A JP S6460636A
Authority
JP
Japan
Prior art keywords
etching
recesses
layer
molding
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21550587A
Other languages
Japanese (ja)
Other versions
JP2521772B2 (en
Inventor
Hideharu Yamagishi
Yukihisa Taguchi
Masaharu Ihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP62215505A priority Critical patent/JP2521772B2/en
Publication of JPS6460636A publication Critical patent/JPS6460636A/en
Application granted granted Critical
Publication of JP2521772B2 publication Critical patent/JP2521772B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Printing Methods (AREA)
  • Duplication Or Marking (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To form a character or a pattern exactly on the surface of a polyacetal resin molding, by covering an etching plate applied to the molding with a masking layer, heat-treating the covering layer to form recesses on the surface of the molding by etching and forming a secondary ink layer on the surface including these recesses and peeling the masking layer from it. CONSTITUTION:An etching print is applied to a polyacetal resin molding 1 with an etching ink and a masking layer 3 is formed on it. This layer is heat- treated to etch the surface of the molding and recesses 4 are formed by removing etching residues. An ink layer 5 is formed with a secondary ink for forming a pattern on the molding surface including these recesses 4, and the masking layer 3 is peeled from it, whereupon the secondary ink is left only on the recesses 4 to form a character or a pattern on it.
JP62215505A 1987-08-31 1987-08-31 Engraving wiping method Expired - Lifetime JP2521772B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62215505A JP2521772B2 (en) 1987-08-31 1987-08-31 Engraving wiping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62215505A JP2521772B2 (en) 1987-08-31 1987-08-31 Engraving wiping method

Publications (2)

Publication Number Publication Date
JPS6460636A true JPS6460636A (en) 1989-03-07
JP2521772B2 JP2521772B2 (en) 1996-08-07

Family

ID=16673510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62215505A Expired - Lifetime JP2521772B2 (en) 1987-08-31 1987-08-31 Engraving wiping method

Country Status (1)

Country Link
JP (1) JP2521772B2 (en)

Also Published As

Publication number Publication date
JP2521772B2 (en) 1996-08-07

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