JPS6457737A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6457737A
JPS6457737A JP21433787A JP21433787A JPS6457737A JP S6457737 A JPS6457737 A JP S6457737A JP 21433787 A JP21433787 A JP 21433787A JP 21433787 A JP21433787 A JP 21433787A JP S6457737 A JPS6457737 A JP S6457737A
Authority
JP
Japan
Prior art keywords
solder
bump
conductive layer
semiconductor chip
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21433787A
Other languages
Japanese (ja)
Inventor
Yusuke Watanabe
Hachirou Shigeta
Kazuo Tanaka
Satoshi Rikui
Kichiji Abe
Keiji Mayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP21433787A priority Critical patent/JPS6457737A/en
Publication of JPS6457737A publication Critical patent/JPS6457737A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To avoid the concentration of strain in solder, and to lengthen the lifetime of a solder section by projecting by forming a columnar electrode made of copper and having an arcuate corner section to a surface oppositely facing a substrate in a semiconductor chip and bonding the electrode and a conductive layer shaped to the substrate by solder. CONSTITUTION:A bump 22 is formed to a columnar body having an equal diameter by using a mask pattern, etc., shaped to the surface of a semiconductor chip 21, and the corner section of the end face of the bump 22 is rounded and formed to an arcuate surface 221. A conductive layer 24 is shaped in response to the bump 22 to a surface oppositely facing the semiconductor chip 21 in an alumina substrate 23, and both the bump 22 and the conductive layer 24 are bonded by solder 25. Strain generated in solder 25 is not concentrated to the edge section of the columnar bump 22.
JP21433787A 1987-08-28 1987-08-28 Semiconductor integrated circuit device Pending JPS6457737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21433787A JPS6457737A (en) 1987-08-28 1987-08-28 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21433787A JPS6457737A (en) 1987-08-28 1987-08-28 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6457737A true JPS6457737A (en) 1989-03-06

Family

ID=16654090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21433787A Pending JPS6457737A (en) 1987-08-28 1987-08-28 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6457737A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792850A (en) * 1980-12-01 1982-06-09 Mitsubishi Electric Corp Semiconductor chip
JPS58143554A (en) * 1982-02-22 1983-08-26 Nippon Denso Co Ltd Manufacture of semiconductor device
JPS58197857A (en) * 1982-05-14 1983-11-17 Hitachi Ltd Semiconductor device and manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792850A (en) * 1980-12-01 1982-06-09 Mitsubishi Electric Corp Semiconductor chip
JPS58143554A (en) * 1982-02-22 1983-08-26 Nippon Denso Co Ltd Manufacture of semiconductor device
JPS58197857A (en) * 1982-05-14 1983-11-17 Hitachi Ltd Semiconductor device and manufacture thereof

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