JPS6457648U - - Google Patents
Info
- Publication number
- JPS6457648U JPS6457648U JP15172787U JP15172787U JPS6457648U JP S6457648 U JPS6457648 U JP S6457648U JP 15172787 U JP15172787 U JP 15172787U JP 15172787 U JP15172787 U JP 15172787U JP S6457648 U JPS6457648 U JP S6457648U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- finished product
- chip
- electric wires
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011265 semifinished product Substances 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15172787U JPS6457648U (zh) | 1987-10-05 | 1987-10-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15172787U JPS6457648U (zh) | 1987-10-05 | 1987-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457648U true JPS6457648U (zh) | 1989-04-10 |
Family
ID=31426029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15172787U Pending JPS6457648U (zh) | 1987-10-05 | 1987-10-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457648U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7485478B2 (en) | 2001-02-19 | 2009-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
-
1987
- 1987-10-05 JP JP15172787U patent/JPS6457648U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7485478B2 (en) | 2001-02-19 | 2009-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
US7825419B2 (en) | 2001-02-19 | 2010-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7247931B2 (en) | Semiconductor package and leadframe therefor having angled corners | |
US5277356A (en) | Wire bonding method | |
JPS6457648U (zh) | ||
US5696029A (en) | Process for manufacturing a lead frame | |
JP2837064B2 (ja) | ボンディングパッド面の圧印加工方法 | |
CN109037172B (zh) | 晶片的封装装置及其散热件与散热件的制造方法 | |
JPH10116846A (ja) | 樹脂封止型半導体装置の製造方法およびモールド金型 | |
JPS62193162A (ja) | リードフレームの製造方法 | |
JP2960698B2 (ja) | ヒートシンクを備えた樹脂封止型半導体装置及びその製造方法 | |
JPH0621271U (ja) | 金属芯配線基板 | |
JPS6050346B2 (ja) | 半導体装置の製造方法 | |
JP3854208B2 (ja) | リードフレームおよびリードフレームの製造方法 | |
JP2969591B2 (ja) | ヒートシンクを備えた樹脂封止型半導体装置の製造方法 | |
JP2661152B2 (ja) | Icカード用モジュールの製造方法 | |
JPH0966334A (ja) | 半導体パッケージ用放熱板の製造方法 | |
JP2513796Y2 (ja) | 半導体装置用リ―ドフレ―ム及びプレス金型 | |
JPH0524552Y2 (zh) | ||
JP2527503B2 (ja) | リ―ドフレ―ムおよびその製造方法 | |
JP2001144390A (ja) | 立体回路基板およびその製造方法 | |
JPH0296744U (zh) | ||
JP2800243B2 (ja) | プレス加工装置 | |
JPH04324668A (ja) | リードフレーム | |
JPS63308359A (ja) | リ−ドフレ−ムの製造方法 | |
JPS5843233Y2 (ja) | 半導体装置 | |
JPH0434974Y2 (zh) |