JPS6455858A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6455858A
JPS6455858A JP21360787A JP21360787A JPS6455858A JP S6455858 A JPS6455858 A JP S6455858A JP 21360787 A JP21360787 A JP 21360787A JP 21360787 A JP21360787 A JP 21360787A JP S6455858 A JPS6455858 A JP S6455858A
Authority
JP
Japan
Prior art keywords
film
silicon film
single crystal
crystal silicon
element area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21360787A
Other languages
Japanese (ja)
Inventor
Michihiko Hasegawa
Takashi Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21360787A priority Critical patent/JPS6455858A/en
Publication of JPS6455858A publication Critical patent/JPS6455858A/en
Pending legal-status Critical Current

Links

Landscapes

  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

PURPOSE:To improve the dielectric strength by patterning an antioxidant/ antireflection film simultaneously with a single crystal silicon film to form an island-like element area, and generating a thick SiO2 film inside the element area by oxidizing the antioxidant/antireflection film as a mask. CONSTITUTION:On an SiO2 film 2 which is generated on a silicon substrate 1, a polycrystal silicon film 3 is adhered by the CVD method. An Si3N4 film is adhered thereupon having the SiO2 film therebetween. Then the polycrystal silicon film 3 is heated and melted by scanning a continuous argon laser beam from the top thereof to modify the polycrystal silicon film into a single crystal silicon film 3. Then a capped layer 20 and the single crystal silicon film 3 are patterned, while leaving the capped layer 20 as it is, by the photoprocess so that an island-like element area can be separated. Then an SiO2 film 9 is formed at the side surface of the single crystal silicon film 3 (island-like element area) by wet-oxidizing at 900 deg.C. According to the constitution, it is made possible to form a thick SiO2 film on the side surface of the single crystal silicon film, whereby the reduction of the gate dielectric strength can be prevented.
JP21360787A 1987-08-26 1987-08-26 Manufacture of semiconductor device Pending JPS6455858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21360787A JPS6455858A (en) 1987-08-26 1987-08-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21360787A JPS6455858A (en) 1987-08-26 1987-08-26 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6455858A true JPS6455858A (en) 1989-03-02

Family

ID=16641981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21360787A Pending JPS6455858A (en) 1987-08-26 1987-08-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6455858A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100174A (en) * 1990-12-18 1992-03-31 Trw, Inc. Auto ignition package for an air bag inflator
JPH07193245A (en) * 1993-12-27 1995-07-28 Nec Corp Manufacture of thin-film transistor
JP2006295097A (en) * 2004-06-04 2006-10-26 Advanced Lcd Technologies Development Center Co Ltd Crystallizing method, thin-film transistor manufacturing method, crystallized substrate, thin-film transistor, and display device
US7943936B2 (en) 2004-06-04 2011-05-17 Advanced Lcd Technologies Development Center Co., Ltd. Crystallizing method, thin-film transistor manufacturing method, thin-film transistor, and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100174A (en) * 1990-12-18 1992-03-31 Trw, Inc. Auto ignition package for an air bag inflator
JPH07193245A (en) * 1993-12-27 1995-07-28 Nec Corp Manufacture of thin-film transistor
JP2006295097A (en) * 2004-06-04 2006-10-26 Advanced Lcd Technologies Development Center Co Ltd Crystallizing method, thin-film transistor manufacturing method, crystallized substrate, thin-film transistor, and display device
US7943936B2 (en) 2004-06-04 2011-05-17 Advanced Lcd Technologies Development Center Co., Ltd. Crystallizing method, thin-film transistor manufacturing method, thin-film transistor, and display device

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