JPS6455832A - Mounting method for semiconductor element - Google Patents
Mounting method for semiconductor elementInfo
- Publication number
- JPS6455832A JPS6455832A JP21358987A JP21358987A JPS6455832A JP S6455832 A JPS6455832 A JP S6455832A JP 21358987 A JP21358987 A JP 21358987A JP 21358987 A JP21358987 A JP 21358987A JP S6455832 A JPS6455832 A JP S6455832A
- Authority
- JP
- Japan
- Prior art keywords
- sealer
- sealers
- face
- reflow
- dispenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To largely improve moisture resistance by coating with first sealer, then covering with second sealer, and simultaneously curing the first and second sealers. CONSTITUTION:An IC3 is mounted in a face-down manner on a glass substrate 6 of a liquid crystal panel in which liquid crystal is poured and sealed, heated to allow a solder 4 to reflow, thereby bonding it to a laminated conductor 5. After the reflow of the solder 4, it is cleaned, sealer 1 is poured by a dispenser from laterally of the IC3, and the face of the IC3, the substrate 6 and the IC3 are laterally coated with the sealer 1. Then, the rear face of the IC3, the front surface of the sealer 1, and the laminated conductor 5, are coated by a dispenser with the sealer 2, the sealers 1, 2 are then heated at 80-100 deg.C to be simultaneously cured. In this case, since a silicone oil film is formed on a boundary between the sealers 1 and 2, the moisture absorption of the sealer 1 due to moisture penetrating through the sealer 2 is suppressed under high temperature and high humidity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21358987A JPS6455832A (en) | 1987-08-27 | 1987-08-27 | Mounting method for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21358987A JPS6455832A (en) | 1987-08-27 | 1987-08-27 | Mounting method for semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6455832A true JPS6455832A (en) | 1989-03-02 |
Family
ID=16641701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21358987A Pending JPS6455832A (en) | 1987-08-27 | 1987-08-27 | Mounting method for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6455832A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
WO2000052739A3 (en) * | 1999-03-03 | 2001-01-11 | Intel Corp | A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
-
1987
- 1987-08-27 JP JP21358987A patent/JPS6455832A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5274913A (en) * | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
WO2000052739A3 (en) * | 1999-03-03 | 2001-01-11 | Intel Corp | A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
US6238948B1 (en) | 1999-03-03 | 2001-05-29 | Intel Corporation | Controlled collapse chip connection (C4) integrated circuit package that has a fillet which seals an underfill material |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5762539A (en) | Mounting method for semiconductor element | |
US3570115A (en) | Method for mounting electronic chips | |
JPS5873126A (en) | Mounting method of semiconductor device | |
JPS6455832A (en) | Mounting method for semiconductor element | |
JPS5670655A (en) | Manufacture of electronic circuit mounting device | |
JPS55138241A (en) | Sealing structure for semiconductor device | |
JPS6442183A (en) | Method of packaging semiconductor device | |
JPS55138240A (en) | Manufacture of semiconductor device | |
JPS5831539A (en) | Manufacture of hybrid integrated circuit | |
JPS5713426A (en) | Liquid crystal display element | |
JPS5742022A (en) | Liquid crystal display device | |
JPS629728Y2 (en) | ||
JPS6436055A (en) | Method of sealing electronic component | |
JPS55124250A (en) | Resin sealed semiconductor device | |
JPS62104044A (en) | Passivating method | |
JPS57188851A (en) | Method of sealing semiconductor element | |
JPS5760860A (en) | Semiconductor | |
JPH03290983A (en) | Manufacture of led display element | |
JPS5571043A (en) | Semiconductor device | |
JPS6455850A (en) | Mounting of semiconductor element | |
JPS5799749A (en) | Semiconductor device | |
JPS5789229A (en) | Semiconductor device | |
JPS59130448A (en) | Device for sealing circuit element | |
JPS5739545A (en) | Semiconductor device | |
JPH01225141A (en) | Resin-sealed semiconductor device |