JPS645467B2 - - Google Patents
Info
- Publication number
- JPS645467B2 JPS645467B2 JP56215647A JP21564781A JPS645467B2 JP S645467 B2 JPS645467 B2 JP S645467B2 JP 56215647 A JP56215647 A JP 56215647A JP 21564781 A JP21564781 A JP 21564781A JP S645467 B2 JPS645467 B2 JP S645467B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- case
- board
- mounting
- vehicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Control Of Voltage And Current In General (AREA)
- Continuous-Control Power Sources That Use Transistors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56215647A JPS58111356A (ja) | 1981-12-24 | 1981-12-24 | 電圧レギユレ−タ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56215647A JPS58111356A (ja) | 1981-12-24 | 1981-12-24 | 電圧レギユレ−タ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58111356A JPS58111356A (ja) | 1983-07-02 |
JPS645467B2 true JPS645467B2 (en, 2012) | 1989-01-30 |
Family
ID=16675863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56215647A Granted JPS58111356A (ja) | 1981-12-24 | 1981-12-24 | 電圧レギユレ−タ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58111356A (en, 2012) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092179A (ja) * | 1983-10-26 | 1985-05-23 | ヤマハ発動機株式会社 | 車両用レクチフアイヤ−レギユレ−タの取付け構造 |
JPS60103083U (ja) * | 1983-12-20 | 1985-07-13 | スズキ株式会社 | オ−トバイの電装部品収容装置 |
JP5278541B2 (ja) * | 2009-04-15 | 2013-09-04 | トヨタ自動車株式会社 | ステータの製造方法 |
JP6958438B2 (ja) | 2018-03-08 | 2021-11-02 | 株式会社デンソー | 電子部品用放熱装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2554747A1 (de) * | 1975-12-05 | 1977-06-16 | Bosch Gmbh Robert | Elektronisches steuergeraet |
-
1981
- 1981-12-24 JP JP56215647A patent/JPS58111356A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58111356A (ja) | 1983-07-02 |
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