JPS6453492A - Substrate for printed wiring - Google Patents
Substrate for printed wiringInfo
- Publication number
- JPS6453492A JPS6453492A JP20936987A JP20936987A JPS6453492A JP S6453492 A JPS6453492 A JP S6453492A JP 20936987 A JP20936987 A JP 20936987A JP 20936987 A JP20936987 A JP 20936987A JP S6453492 A JPS6453492 A JP S6453492A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- substrate
- produced
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62209369A JP2567357B2 (ja) | 1987-08-25 | 1987-08-25 | プリント配線用基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62209369A JP2567357B2 (ja) | 1987-08-25 | 1987-08-25 | プリント配線用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6453492A true JPS6453492A (en) | 1989-03-01 |
JP2567357B2 JP2567357B2 (ja) | 1996-12-25 |
Family
ID=16571792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62209369A Expired - Fee Related JP2567357B2 (ja) | 1987-08-25 | 1987-08-25 | プリント配線用基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2567357B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164093A (ja) * | 1999-12-06 | 2001-06-19 | Fujitsu Ltd | 樹脂組成物およびそれを用いたビルドアップ配線基板 |
US20110033711A1 (en) * | 2007-12-14 | 2011-02-10 | Denso Corporation | Resin-metal bonded article and method for producing the same |
-
1987
- 1987-08-25 JP JP62209369A patent/JP2567357B2/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001164093A (ja) * | 1999-12-06 | 2001-06-19 | Fujitsu Ltd | 樹脂組成物およびそれを用いたビルドアップ配線基板 |
US20110033711A1 (en) * | 2007-12-14 | 2011-02-10 | Denso Corporation | Resin-metal bonded article and method for producing the same |
US8394503B2 (en) * | 2007-12-14 | 2013-03-12 | Toadenka Corporation | Resin-metal bonded article and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2567357B2 (ja) | 1996-12-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |