JPS6450526A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6450526A
JPS6450526A JP20859687A JP20859687A JPS6450526A JP S6450526 A JPS6450526 A JP S6450526A JP 20859687 A JP20859687 A JP 20859687A JP 20859687 A JP20859687 A JP 20859687A JP S6450526 A JPS6450526 A JP S6450526A
Authority
JP
Japan
Prior art keywords
film
active layer
polymer film
gate
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20859687A
Other languages
Japanese (ja)
Inventor
Hirohisa Yamamoto
Shintaro Matsuda
Masanao Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20859687A priority Critical patent/JPS6450526A/en
Publication of JPS6450526A publication Critical patent/JPS6450526A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent breakage of a gate oxide film, by forming a polymer film to cover the surface of an active film and at least a part of a gate region so that dopant ions are implanted into the upper parts of the active layer through the polymer film for forming drain and source regions. CONSTITUTION:Dopant ions are implanted from over, a semiconductor active layer 1 on which a gate region is deposited through a gate insulating film 3, so that drain and source regions 2 are formed in the upper parts of the active layer 1. In order to produce a semiconductor device in this manner, a polymer film 6 is formed to cover the surface of the active layer 1 and at least a part of the gate region 4, and the dopant ions are implanted through the polymer film 6 into the upper parts of the active layer 1. According to an embodiment, after a gate oxide film 3, a gate region 4 and a field oxide film 5 are formed on a semiconductor substrate 1, a polymer film 6 with a thickness of about 10Angstrom or more is formed by plasma treatment or the like to cover the regions 2 in the semiconductor substrate 1, the gate oxide film 3, the gate region 4 and the field oxide film 5, and then ion implantation is performed through the polymer film 6.
JP20859687A 1987-08-21 1987-08-21 Manufacture of semiconductor device Pending JPS6450526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20859687A JPS6450526A (en) 1987-08-21 1987-08-21 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20859687A JPS6450526A (en) 1987-08-21 1987-08-21 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6450526A true JPS6450526A (en) 1989-02-27

Family

ID=16558821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20859687A Pending JPS6450526A (en) 1987-08-21 1987-08-21 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6450526A (en)

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