JPS6450051U - - Google Patents
Info
- Publication number
- JPS6450051U JPS6450051U JP1987143711U JP14371187U JPS6450051U JP S6450051 U JPS6450051 U JP S6450051U JP 1987143711 U JP1987143711 U JP 1987143711U JP 14371187 U JP14371187 U JP 14371187U JP S6450051 U JPS6450051 U JP S6450051U
- Authority
- JP
- Japan
- Prior art keywords
- dressing
- truing
- whetstone
- drive device
- sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987143711U JPH0333417Y2 (US20030220297A1-20031127-C00009.png) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987143711U JPH0333417Y2 (US20030220297A1-20031127-C00009.png) | 1987-09-18 | 1987-09-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6450051U true JPS6450051U (US20030220297A1-20031127-C00009.png) | 1989-03-28 |
JPH0333417Y2 JPH0333417Y2 (US20030220297A1-20031127-C00009.png) | 1991-07-16 |
Family
ID=31410776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987143711U Expired JPH0333417Y2 (US20030220297A1-20031127-C00009.png) | 1987-09-18 | 1987-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0333417Y2 (US20030220297A1-20031127-C00009.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10296616A (ja) * | 1997-04-08 | 1998-11-10 | Lsi Logic Corp | 化学・機械研磨用研磨パッドの前調整 |
JP2001079739A (ja) * | 1999-09-10 | 2001-03-27 | Daito Seiki Kk | H形鋼用面研削装置 |
CN102284910A (zh) * | 2010-06-21 | 2011-12-21 | 不二越机械工业株式会社 | 研磨垫的修整方法和修整装置 |
-
1987
- 1987-09-18 JP JP1987143711U patent/JPH0333417Y2/ja not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10296616A (ja) * | 1997-04-08 | 1998-11-10 | Lsi Logic Corp | 化学・機械研磨用研磨パッドの前調整 |
JP4565674B2 (ja) * | 1997-04-08 | 2010-10-20 | エルエスアイ コーポレーション | 化学・機械研磨用研磨パッドの前調整 |
JP2001079739A (ja) * | 1999-09-10 | 2001-03-27 | Daito Seiki Kk | H形鋼用面研削装置 |
CN102284910A (zh) * | 2010-06-21 | 2011-12-21 | 不二越机械工业株式会社 | 研磨垫的修整方法和修整装置 |
JP2012000741A (ja) * | 2010-06-21 | 2012-01-05 | Fujikoshi Mach Corp | 研磨布のドレッシング方法およびドレッシング装置 |
TWI503203B (zh) * | 2010-06-21 | 2015-10-11 | Fujikoshi Machinery Corp | 研磨布之修整方法以及修整裝置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0333417Y2 (US20030220297A1-20031127-C00009.png) | 1991-07-16 |