JPS644904B2 - - Google Patents
Info
- Publication number
- JPS644904B2 JPS644904B2 JP4535283A JP4535283A JPS644904B2 JP S644904 B2 JPS644904 B2 JP S644904B2 JP 4535283 A JP4535283 A JP 4535283A JP 4535283 A JP4535283 A JP 4535283A JP S644904 B2 JPS644904 B2 JP S644904B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- film
- strip
- article
- peeled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002313 adhesive film Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/08—Label feeding
- B65C9/18—Label feeding from strips, e.g. from rolls
- B65C9/1865—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip
- B65C9/1876—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip and being transferred by suction means
- B65C9/1884—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip and being transferred by suction means the suction means being a movable vacuum arm or pad
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C1/00—Labelling flat essentially-rigid surfaces
- B65C1/02—Affixing labels to one flat surface of articles, e.g. of packages, of flat bands
- B65C1/021—Affixing labels to one flat surface of articles, e.g. of packages, of flat bands the label being applied by movement of the labelling head towards the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/02—Devices for moving articles, e.g. containers, past labelling station
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4535283A JPS59169811A (ja) | 1983-03-16 | 1983-03-16 | 粘着フイルム貼付方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4535283A JPS59169811A (ja) | 1983-03-16 | 1983-03-16 | 粘着フイルム貼付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59169811A JPS59169811A (ja) | 1984-09-25 |
| JPS644904B2 true JPS644904B2 (en:Method) | 1989-01-27 |
Family
ID=12716880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4535283A Granted JPS59169811A (ja) | 1983-03-16 | 1983-03-16 | 粘着フイルム貼付方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59169811A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0240110U (en:Method) * | 1988-09-12 | 1990-03-19 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691057B2 (ja) * | 1985-09-07 | 1994-11-14 | 日東電工株式会社 | 半導体ウエハの保護部材 |
| JPH07105433B2 (ja) * | 1986-05-20 | 1995-11-13 | 三井東圧化学株式会社 | ウエハ加工用フイルムの貼付け方法 |
| JP2589678B2 (ja) * | 1986-09-03 | 1997-03-12 | 松下電子工業株式会社 | 半導体基板の裏面処理方法 |
| JPH0690503B2 (ja) * | 1989-11-20 | 1994-11-14 | 株式会社条北製版センター | 製版・版下作製における貼付方法 |
| JPH05234972A (ja) * | 1992-02-24 | 1993-09-10 | Nec Corp | 半導体装置の製造方法 |
| DE4217654A1 (de) * | 1992-05-27 | 1993-12-02 | Etifix Etikettiersysteme Gmbh | Verfahren und Vorrichtung zum Aufbringen von Selbstklebeetiketten auf Behälter |
| DE10339067B4 (de) * | 2003-08-26 | 2005-08-18 | Daimlerchrysler Ag | Verfahren und Vorrichtung zum automatisierten Applizieren von Lackfolie auf Karosserieteile |
| JP4637057B2 (ja) * | 2006-05-25 | 2011-02-23 | リンテック株式会社 | シート貼付装置及び貼付方法 |
| JP6053132B2 (ja) * | 2012-12-07 | 2016-12-27 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
| ES2548192B1 (es) * | 2015-05-18 | 2016-07-26 | Mecanizados Castro Galicia, S.L. | Procedimiento para aplicar un film protector sobre una superficie de una pieza |
| CN105730754B (zh) * | 2016-03-24 | 2018-08-24 | 宁波敏实汽车零部件技术研发有限公司 | 条状工件自动贴膜装置 |
| WO2018079441A1 (ja) * | 2016-10-26 | 2018-05-03 | 日東電工株式会社 | フィルム積層体の製造方法 |
| CN106586162B (zh) * | 2016-12-27 | 2018-12-11 | 绍兴明煌科技有限公司 | 一种无离型纸透明标签卷筒用切割贴标机构 |
| CN111891452B (zh) * | 2020-08-24 | 2022-04-29 | 深圳市深蓝智联科技有限公司 | 一种手机自动化生产用贴膜设备及其工作方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5318400A (en) * | 1976-08-04 | 1978-02-20 | Hiroshi Ise | Signal lamp for indicating road configuration and regulation |
| JPS5324319A (en) * | 1976-08-19 | 1978-03-07 | Sumitomo Metal Ind | Method of granulation of blast furnace slag |
| JPS5333480A (en) * | 1976-09-10 | 1978-03-29 | Hitachi Ltd | Parts indicating device in semiautomatic parts incorporating machine |
| JPS5512147A (en) * | 1978-07-11 | 1980-01-28 | Nitto Electric Ind Co Ltd | Bonding of plate |
-
1983
- 1983-03-16 JP JP4535283A patent/JPS59169811A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0240110U (en:Method) * | 1988-09-12 | 1990-03-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59169811A (ja) | 1984-09-25 |
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