JPS6448085U - - Google Patents
Info
- Publication number
- JPS6448085U JPS6448085U JP14323987U JP14323987U JPS6448085U JP S6448085 U JPS6448085 U JP S6448085U JP 14323987 U JP14323987 U JP 14323987U JP 14323987 U JP14323987 U JP 14323987U JP S6448085 U JPS6448085 U JP S6448085U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wall portion
- thin wall
- metal case
- insulating bushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Description
第１図は本考案の一実施例を示す図、第２図は
第１図中絶縁ブツシユの部分を拡大して示す図、
第３図は絶縁ブツシユをリードの先端部と対応さ
せて示す断面図、第４図は第１図のパツケージユ
ニツトの製造工程を示す図、第５図は従来の１例
を示す図、第６図は従来の別の例を示す図、第７
図は第６図のパツケージユニツトの製造工程を示
す図である。
図において、３０はパツケージユニツト、３１
は回路モジユール、３２は金属製ケース、３３は
基板、３４はチツプ部品、３５は底板、３５ａは
円形孔、３６はカバー、３７はリード、３７ｂは
尖状下端、３８はリード固定用絶縁ブツシユ、３
８ａは円筒部、３８ｂはフランジ部、３８ｃは薄
肉部、３８ｄは迫り出し部、３９はプリント回路
基板、を示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is an enlarged view of the insulating bushing part in Fig. 1,
Figure 3 is a sectional view showing the insulating bushing in correspondence with the tip of the lead, Figure 4 is a diagram showing the manufacturing process of the package unit of Figure 1, Figure 5 is a diagram showing one conventional example, and Figure 6 is a diagram showing the manufacturing process of the package unit of Figure 1. Figure 7 shows another conventional example.
The figure shows the manufacturing process of the package unit of FIG. 6. In the figure, 30 is a package unit, 31
is a circuit module, 32 is a metal case, 33 is a substrate, 34 is a chip component, 35 is a bottom plate, 35a is a circular hole, 36 is a cover, 37 is a lead, 37b is a pointed lower end, 38 is an insulating bush for fixing the lead, 3
8a is a cylindrical portion, 38b is a flange portion, 38c is a thin wall portion, 38d is a protruding portion, and 39 is a printed circuit board.
Claims (1)
ジユール３１が金属製ケース３２内に収められ、
一端が上記基板に接続されたリード３７が上記金
属製ケースより下方に突出した構造であり、該リ
ードをプリント回路基板３９に半田付けされて実
装されるパツケージユニツトにおいて、 上記金属製ケース３２のうち上記リードが突出
する個所に、絶縁性を有し且つ上記リードが刺し
通される薄肉部３８ｃを有する絶縁ブツシユ３８
が圧入固定され、 上記リード３７が上記絶縁ブツシユ３８の薄肉
部３８ｃを刺し通されて上記金属製ケース３２よ
り突出して上記絶縁ブツシユ３８により固定され
る構成のパツケージユニツト。[Claims for Utility Model Registration] A circuit module 31 in which a chip component 34 is mounted on a board 33 is housed in a metal case 32,
In the package unit, which has a structure in which a lead 37 whose one end is connected to the board protrudes downward from the metal case, and is mounted by soldering the lead to the printed circuit board 39, An insulating bushing 38 having a thin wall portion 38c, which is insulating and has a thin wall portion 38c through which the lead is pierced, at the location where the lead protrudes.
is press-fitted and fixed, and the lead 37 is pierced through the thin wall portion 38c of the insulating bushing 38, protrudes from the metal case 32, and is fixed by the insulating bushing 38.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14323987U JPS6448085U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14323987U JPS6448085U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448085U true JPS6448085U (en) | 1989-03-24 |
Family
ID=31409879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14323987U Pending JPS6448085U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448085U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0383947U (en) * | 1989-12-16 | 1991-08-26 |
-
1987
- 1987-09-18 JP JP14323987U patent/JPS6448085U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0383947U (en) * | 1989-12-16 | 1991-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6448085U (en) | ||
| JPH0533068Y2 (en) | ||
| JPS63172187U (en) | ||
| JPS61136576U (en) | ||
| JPH0741177Y2 (en) | Electronic circuit device | |
| JPH0379475U (en) | ||
| JPH0316662U (en) | ||
| JPS61102032U (en) | ||
| JPS6228472U (en) | ||
| JPH0420246U (en) | ||
| JPH0456374U (en) | ||
| JPS6389279U (en) | ||
| JPH01104064U (en) | ||
| JPH0231178U (en) | ||
| JPH0336167U (en) | ||
| JPS61156265U (en) | ||
| JPH01121971U (en) | ||
| JPH02146471U (en) | ||
| JPS59149662U (en) | Electrical component mounting device | |
| JPS639153U (en) | ||
| JPH02146420U (en) | ||
| JPH0379474U (en) | ||
| JPS62174366U (en) | ||
| JPS6217176U (en) | ||
| JPS6280385U (en) |