JPH02146471U - - Google Patents
Info
- Publication number
- JPH02146471U JPH02146471U JP5512489U JP5512489U JPH02146471U JP H02146471 U JPH02146471 U JP H02146471U JP 5512489 U JP5512489 U JP 5512489U JP 5512489 U JP5512489 U JP 5512489U JP H02146471 U JPH02146471 U JP H02146471U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- copper foil
- component mounting
- mounting board
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案に係る電子部品搭載基板の試験
端子構造の一実施例を要部で示す平面図、第２図
は第１図の−線に沿う断面図、第３図は同じ
実施例の組立状態を示す断面図、第４図は従来例
の要部を示す平面図、第５図は第４図の−線
に沿う断面図、第６図は従来例の組立状態を示す
断面図である。
１……電子部品搭載基板、２……ベースフイル
ム、２ａ……開口部、２ｂ……ＩＣ取付孔、３…
…銅箔、４……接着剤、５……絶縁被膜、６……
試験端子、１０……ＩＣ、１１……プリント基板
、１２……銅箔。
Fig. 1 is a plan view showing the main parts of an embodiment of the test terminal structure of an electronic component mounting board according to the present invention, Fig. 2 is a sectional view taken along the - line in Fig. 1, and Fig. 3 is the same embodiment. Fig. 4 is a plan view showing the main parts of the conventional example, Fig. 5 is a sectional view taken along the - line in Fig. 4, and Fig. 6 is a sectional view showing the assembled state of the conventional example. It is. 1... Electronic component mounting board, 2... Base film, 2a... Opening, 2b... IC mounting hole, 3...
...Copper foil, 4...Adhesive, 5...Insulating coating, 6...
Test terminal, 10...IC, 11...printed circuit board, 12...copper foil.
Claims (1)
着して成る電子部品搭載基板において、前記ベー
スフイルムの所定位置に予めに孔状の開口部を設
け、該開口部を覆うように前記銅箔を接着して形
成したことを特徴とする電子部品搭載基板の試験
端子構造。 In an electronic component mounting board formed by bonding a copper foil forming an electric circuit to a base film, a hole-shaped opening is provided in advance at a predetermined position in the base film, and the copper foil is bonded so as to cover the opening. A test terminal structure for an electronic component mounting board, characterized in that it is formed by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512489U JPH02146471U (en) | 1989-05-12 | 1989-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512489U JPH02146471U (en) | 1989-05-12 | 1989-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146471U true JPH02146471U (en) | 1990-12-12 |
Family
ID=31577798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5512489U Pending JPH02146471U (en) | 1989-05-12 | 1989-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146471U (en) |
-
1989
- 1989-05-12 JP JP5512489U patent/JPH02146471U/ja active Pending
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