JPS6446958A - Resin seal type semiconductor device - Google Patents

Resin seal type semiconductor device

Info

Publication number
JPS6446958A
JPS6446958A JP63158578A JP15857888A JPS6446958A JP S6446958 A JPS6446958 A JP S6446958A JP 63158578 A JP63158578 A JP 63158578A JP 15857888 A JP15857888 A JP 15857888A JP S6446958 A JPS6446958 A JP S6446958A
Authority
JP
Japan
Prior art keywords
substrate retainer
mounting
thin
plate
workability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63158578A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0512857B2 (enrdf_load_stackoverflow
Inventor
Hiroyuki Fujii
Kenichi Tateno
Mikio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP63158578A priority Critical patent/JPS6446958A/ja
Publication of JPS6446958A publication Critical patent/JPS6446958A/ja
Publication of JPH0512857B2 publication Critical patent/JPH0512857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP63158578A 1988-06-27 1988-06-27 Resin seal type semiconductor device Granted JPS6446958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63158578A JPS6446958A (en) 1988-06-27 1988-06-27 Resin seal type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63158578A JPS6446958A (en) 1988-06-27 1988-06-27 Resin seal type semiconductor device

Publications (2)

Publication Number Publication Date
JPS6446958A true JPS6446958A (en) 1989-02-21
JPH0512857B2 JPH0512857B2 (enrdf_load_stackoverflow) 1993-02-19

Family

ID=15674751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63158578A Granted JPS6446958A (en) 1988-06-27 1988-06-27 Resin seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6446958A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008232902A (ja) * 2007-03-22 2008-10-02 Honda Motor Co Ltd 回転センサ及びその製造方法
WO2014148019A1 (ja) * 2013-03-20 2014-09-25 株式会社デンソー 半導体装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558053U (enrdf_load_stackoverflow) * 1978-10-11 1980-04-19
JPS5713802U (enrdf_load_stackoverflow) * 1980-06-30 1982-01-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558053U (enrdf_load_stackoverflow) * 1978-10-11 1980-04-19
JPS5713802U (enrdf_load_stackoverflow) * 1980-06-30 1982-01-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008232902A (ja) * 2007-03-22 2008-10-02 Honda Motor Co Ltd 回転センサ及びその製造方法
WO2014148019A1 (ja) * 2013-03-20 2014-09-25 株式会社デンソー 半導体装置およびその製造方法
JP2014183242A (ja) * 2013-03-20 2014-09-29 Denso Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPH0512857B2 (enrdf_load_stackoverflow) 1993-02-19

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