JPS644584B2 - - Google Patents

Info

Publication number
JPS644584B2
JPS644584B2 JP19889684A JP19889684A JPS644584B2 JP S644584 B2 JPS644584 B2 JP S644584B2 JP 19889684 A JP19889684 A JP 19889684A JP 19889684 A JP19889684 A JP 19889684A JP S644584 B2 JPS644584 B2 JP S644584B2
Authority
JP
Japan
Prior art keywords
plate
mask
substrate
substrate holder
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19889684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6176661A (ja
Inventor
Toshiro Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP19889684A priority Critical patent/JPS6176661A/ja
Publication of JPS6176661A publication Critical patent/JPS6176661A/ja
Publication of JPS644584B2 publication Critical patent/JPS644584B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP19889684A 1984-09-22 1984-09-22 薄膜形成におけるマスキング方法 Granted JPS6176661A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19889684A JPS6176661A (ja) 1984-09-22 1984-09-22 薄膜形成におけるマスキング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19889684A JPS6176661A (ja) 1984-09-22 1984-09-22 薄膜形成におけるマスキング方法

Publications (2)

Publication Number Publication Date
JPS6176661A JPS6176661A (ja) 1986-04-19
JPS644584B2 true JPS644584B2 (enrdf_load_stackoverflow) 1989-01-26

Family

ID=16398738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19889684A Granted JPS6176661A (ja) 1984-09-22 1984-09-22 薄膜形成におけるマスキング方法

Country Status (1)

Country Link
JP (1) JPS6176661A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557657A (ja) * 1991-08-28 1993-03-09 Nec Ibaraki Ltd ロボツトハンド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557657A (ja) * 1991-08-28 1993-03-09 Nec Ibaraki Ltd ロボツトハンド

Also Published As

Publication number Publication date
JPS6176661A (ja) 1986-04-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees