JPS644584B2 - - Google Patents
Info
- Publication number
- JPS644584B2 JPS644584B2 JP19889684A JP19889684A JPS644584B2 JP S644584 B2 JPS644584 B2 JP S644584B2 JP 19889684 A JP19889684 A JP 19889684A JP 19889684 A JP19889684 A JP 19889684A JP S644584 B2 JPS644584 B2 JP S644584B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- mask
- substrate
- substrate holder
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 239000010409 thin film Substances 0.000 claims description 14
- 230000000873 masking effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
この発明は、特にスパツタリングにて基板に薄
膜を形成させる場合に使用するマスキング治具の
マスキング方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a masking method using a masking jig used particularly when forming a thin film on a substrate by sputtering.
(ロ) 従来技術
従来からの薄膜形成におけるマスキング方法で
は、所定形状の基板ホルダーに所定個数の基板を
並置し、薄膜を形成すべき部分が板状マスクの相
互の間〓となるように板状マスクを手作業により
前記基板の所定位置に合わせ、前記板状マスクの
各端部を基板ホルダーに螺子止めすることにより
前記基板ホルダーと板状マスクとを固定させてい
た。そして、上述したように板状マスクで覆つた
基板を何枚かセツトにして薄膜形成装置に装着
し、工程終了後には基板ホルダーから板状マスク
及び基板を取り外して、次の基板を取り付ける作
業を繰り返す方法を行つていた。(b) Prior art In the conventional masking method for thin film formation, a predetermined number of substrates are placed side by side on a substrate holder with a predetermined shape, and a plate-shaped mask is placed so that the area on which the thin film is to be formed is between the plate-shaped masks. The substrate holder and the plate mask were fixed by manually aligning the mask to a predetermined position on the substrate and screwing each end of the plate mask to the substrate holder. Then, as described above, several substrates covered with plate-shaped masks are set and mounted on the thin film forming apparatus, and after the process is completed, the plate-shaped masks and substrates are removed from the substrate holder, and the next substrate is attached. I was using the iterative method.
この方法によれば、前記螺子止め作業に時間を
要すると共にその作業が非常に煩わしい。そのた
め、作業能率の低下を招いていた。また、薄膜を
形成しない部分に合致した板状マスクの選択及び
板状マスクと基板との位置合わせは目視によつて
行つていたため煩雑で困難な作業となつていた。 According to this method, the screwing operation takes time and is very troublesome. This resulted in a decrease in work efficiency. Furthermore, the selection of a plate-shaped mask that matches the area where the thin film is not formed and the alignment of the plate-shaped mask and the substrate are performed by visual inspection, which is a complicated and difficult task.
(ハ) 目的
この発明は、板状マスクの取り付け作業を機械
化してこの作業の能率の向上を図ることを目的と
している。(c) Purpose This invention aims to improve the efficiency of this work by mechanizing the work of attaching a plate mask.
(ニ) 構成
この発明の特徴とする処は、基板ホルダーに複
数の基板を並置し、その上に複数の板状マスクを
所定間隔を隔てて配置せしめる薄膜形成における
マスキング方法において、板状マスクを該板状マ
スクの外形形成に対応した凹溝が所定の間隔で形
成されたアラインメント治具に保持させたまま、
前記基板上に配置せしめ、前記板状マスクを前記
基板ホルダーに固定した後、前記アラインメント
治具の前記板状マスクの保持を解除せしめること
にある。(D) Structure The feature of the present invention is that in a masking method for thin film formation in which a plurality of substrates are arranged side by side on a substrate holder and a plurality of plate masks are arranged on the substrates at predetermined intervals, While holding it in an alignment jig in which concave grooves corresponding to the outer shape of the plate mask are formed at predetermined intervals,
After the plate mask is placed on the substrate and fixed to the substrate holder, the plate mask is released from being held by the alignment jig.
(ホ) 実施例
第１図は、この発明に係る薄膜形成におけるマ
スキング方法に用いるマスキング治具の一実施例
を示す説明図である。(E) Embodiment FIG. 1 is an explanatory diagram showing an embodiment of a masking jig used in the masking method for forming a thin film according to the present invention.
同図において、１は、薄膜を形成すべき基板２
が載置される略矩形板状の基板ホルダーであり、
その短辺端部には短辺に沿つて突脈１１が形成さ
れている。前記基板２は、例えば、セラミツクか
らなるサーマルプリントヘツドとする。 In the figure, 1 is a substrate 2 on which a thin film is to be formed.
It is a substantially rectangular plate-shaped substrate holder on which the
A protrusion 11 is formed along the short side at the end of the short side. The substrate 2 is, for example, a thermal print head made of ceramic.
３は板状マスクであり、基板２の膨張率と同一
の材質で、かつ薄膜を形成しない部分に対応した
形状に形成されている。なお、本実施例ではセラ
ミツクからなる。 Reference numeral 3 denotes a plate-shaped mask, which is made of the same material as the expansion coefficient of the substrate 2 and is formed in a shape corresponding to the portion where the thin film is not formed. In this embodiment, it is made of ceramic.
４はアラインメント治具であり、本実施例では
真空チヤツクを用いている。このアラインメント
治具４には、前記板状マスク３の外形形状に対応
した凹溝４１が、所定間隔で板状マスク３の個数
分形成されており、図外の真空装置によつて前記
マスク３を吸着させて保持させるものである。 4 is an alignment jig, and in this embodiment a vacuum chuck is used. In this alignment jig 4, grooves 41 corresponding to the external shape of the plate-shaped masks 3 are formed at predetermined intervals for the number of plate-shaped masks 3. It adsorbs and retains.
５は挟持具としての挟持スプリングであり、そ
の開口部分を基板ホルダー１とマスク３とに圧入
することによりそれらを挟持固定するように構成
している。そして、この挟持スプリング５が、基
板ホルダー１と板状マスク３とを挟持した状態に
おいて、基板ホルダー１、基板２及び板状マスク
３が圧接されているだけであり、膨張率の違いに
よる相対的変位が許容されるから、板状マスク３
と基板２の間に〓間が生じることはない。 Reference numeral 5 denotes a clamping spring as a clamping tool, and the opening portion thereof is press-fitted into the substrate holder 1 and the mask 3 to clamp and fix them. When the holding spring 5 holds the substrate holder 1 and the plate-shaped mask 3, the substrate holder 1, the substrate 2, and the plate-shaped mask 3 are only pressed against each other, and there is a relative difference due to the difference in expansion coefficient. Since displacement is allowed, the plate mask 3
There is no space between the substrate 2 and the substrate 2.
次に、上記構成のマスキング治具を用いるマス
キング方法を第１図と共に説明する。 Next, a masking method using the masking jig having the above configuration will be explained with reference to FIG.
基板ホルダー１の突脈１１でもつて所定枚数
（本実施例では４枚とする）の基板２を位置決
めして基板ホルダー１上にセツトする。（矢印
Ａ）
各板状マスク３をアラインメント治具４の各
凹溝に嵌合して、チヤツキングさせる。（矢印
Ｂ）
板状マスク３と前記基板２とが当接するよう
にアラインメント治具４を基板ホルダー１に適
宜圧力でもつて圧接させる。（矢印Ｃ）
この状態にて基板ホルダー１と板状マスク３
とを挟持スプリング５で挟持固定する。（矢印
Ｄ）
全ての板状マスク３を基板ホルダー１に固定
した後、アラインメント治具４のチヤツキング
を解除する。 A predetermined number of substrates 2 (four in this embodiment) are positioned on the protrusions 11 of the substrate holder 1 and set on the substrate holder 1. (Arrow A) Each plate-shaped mask 3 is fitted into each groove of the alignment jig 4 and chucked. (Arrow B) The alignment jig 4 is pressed against the substrate holder 1 with appropriate pressure so that the plate-shaped mask 3 and the substrate 2 come into contact with each other. (Arrow C) In this state, the substrate holder 1 and the plate mask 3
and are clamped and fixed by a clamping spring 5. (Arrow D) After all the plate masks 3 are fixed to the substrate holder 1, the tracking of the alignment jig 4 is released.
以下、所望の薄膜形成を行う装置に上記のよう
にセツトされたマスキング治具を装着して基板２
に薄膜を形成させる。 Thereafter, the masking jig set as described above is attached to an apparatus for forming a desired thin film, and the substrate 2 is
to form a thin film.
(ヘ) 効果
この発明によれば、マスクをアラインメント治
具に保持させたまま、基板上に配置せしめ、マス
クを基板ホルダーに固定して後、アラインメント
治具のマスクの保持を解除するので、板状マスク
の取り付け作業を機械化してこの作業の能率の向
上を図ることができる利点を有する。(f) Effects According to the present invention, the mask is placed on the substrate while being held in the alignment jig, and after the mask is fixed to the substrate holder, the holding of the mask by the alignment jig is released. This has the advantage that the work of attaching the shaped mask can be mechanized and the efficiency of this work can be improved.
第１図はこの発明に係る薄膜形成におけるマス
キング方法に使用するマスキング治具の一実施例
を示す説明図である。
１…基板ホルダー、２…基板、３…板状マス
ク、４…アライメント治具、５…挟持スプリン
グ、４１…凹溝。
FIG. 1 is an explanatory diagram showing an embodiment of a masking jig used in the masking method for forming a thin film according to the present invention. DESCRIPTION OF SYMBOLS 1... Substrate holder, 2... Substrate, 3... Plate mask, 4... Alignment jig, 5... Holding spring, 41... Concave groove.
Claims (1)
に複数の板状マスクを所定間隔を隔てて配置せし
める薄膜形成におけるマスキング方法において、
板状マスクを該板状マスクの外形形状に対応した
凹溝が所定の間隔で形成されたアラインメント治
具に保持させたまま、前記基板上に配置せしめ、
前記板状マスクを前記基板ホルダーに固定した
後、前記アラインメント治具の前記板状マスクの
保持を解除せしめること特徴とする薄膜形成にお
けるマスキング方法。1. In a masking method for thin film formation, in which a plurality of substrates are arranged side by side on a substrate holder, and a plurality of plate-shaped masks are arranged on the substrates at predetermined intervals,
placing the plate-shaped mask on the substrate while being held in an alignment jig in which grooves corresponding to the external shape of the plate-shaped mask are formed at predetermined intervals;
A masking method for forming a thin film, characterized in that after fixing the plate mask to the substrate holder, the holding of the plate mask by the alignment jig is released.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19889684A JPS6176661A (en) | 1984-09-22 | 1984-09-22 | Masking method in thin film formation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19889684A JPS6176661A (en) | 1984-09-22 | 1984-09-22 | Masking method in thin film formation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6176661A JPS6176661A (en) | 1986-04-19 |
| JPS644584B2 true JPS644584B2 (en) | 1989-01-26 |
Family
ID=16398738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19889684A Granted JPS6176661A (en) | 1984-09-22 | 1984-09-22 | Masking method in thin film formation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176661A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557657A (en) * | 1991-08-28 | 1993-03-09 | Nec Ibaraki Ltd | Robot hand |
-
1984
- 1984-09-22 JP JP19889684A patent/JPS6176661A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557657A (en) * | 1991-08-28 | 1993-03-09 | Nec Ibaraki Ltd | Robot hand |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6176661A (en) | 1986-04-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |