JPS6444020A - Separate discharge chamber type dry etching apparatus - Google Patents
Separate discharge chamber type dry etching apparatusInfo
- Publication number
- JPS6444020A JPS6444020A JP20111787A JP20111787A JPS6444020A JP S6444020 A JPS6444020 A JP S6444020A JP 20111787 A JP20111787 A JP 20111787A JP 20111787 A JP20111787 A JP 20111787A JP S6444020 A JPS6444020 A JP S6444020A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- electrodes
- discharge chamber
- pair
- dry etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To obtain a dry etching apparatus which can arbitrarily vary the type and density of an active species by disposing a pair of high frequency applying electrodes in a discharge chamber, and providing the electrodes so that one of a pair of electrodes can be relatively displaced with respect to the other. CONSTITUTION:A reactive gas inlet tube 5 is provided to a discharge chamber 1, a wafer table 9 is mounted in an etching chamber 7, and the chamber 1 is connected through an active species transport tube 6 to the chamber 7. A pair of electrodes 3, 3 are disposed oppositely in parallel in the chamber 1, one electrode 3 is so supported to an electrode interval varying mechanism 4 that one of the electrodes 2 can be relatively displaced with respect to the other, one electrode 3 is connected to an earth, and the other is connected to a high frequency oscillator 2. Accordingly, according to this construction, since the interval of the parallel electrodes 3 and 3 can be adjusted to generate the active species for causing an etching reaction in the chamber 1, the universality is increased by arbitrarily varying the type and density of the species.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201117A JPH06101451B2 (en) | 1987-08-12 | 1987-08-12 | Discharge chamber separated dry etching system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201117A JPH06101451B2 (en) | 1987-08-12 | 1987-08-12 | Discharge chamber separated dry etching system |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6444020A true JPS6444020A (en) | 1989-02-16 |
JPH06101451B2 JPH06101451B2 (en) | 1994-12-12 |
Family
ID=16435684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62201117A Expired - Lifetime JPH06101451B2 (en) | 1987-08-12 | 1987-08-12 | Discharge chamber separated dry etching system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06101451B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5663817A (en) * | 1992-12-22 | 1997-09-02 | Thomson-Csf | Projector of narrow field moving images |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119684A (en) * | 1984-11-14 | 1986-06-06 | Ulvac Corp | Sputter etching device |
JPS61272933A (en) * | 1985-05-29 | 1986-12-03 | Hitachi Ltd | Photo process device |
-
1987
- 1987-08-12 JP JP62201117A patent/JPH06101451B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119684A (en) * | 1984-11-14 | 1986-06-06 | Ulvac Corp | Sputter etching device |
JPS61272933A (en) * | 1985-05-29 | 1986-12-03 | Hitachi Ltd | Photo process device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5663817A (en) * | 1992-12-22 | 1997-09-02 | Thomson-Csf | Projector of narrow field moving images |
Also Published As
Publication number | Publication date |
---|---|
JPH06101451B2 (en) | 1994-12-12 |
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