JPS6442130A - Sputter etching device - Google Patents
Sputter etching deviceInfo
- Publication number
- JPS6442130A JPS6442130A JP62198200A JP19820087A JPS6442130A JP S6442130 A JPS6442130 A JP S6442130A JP 62198200 A JP62198200 A JP 62198200A JP 19820087 A JP19820087 A JP 19820087A JP S6442130 A JPS6442130 A JP S6442130A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- substrate
- microwaves
- cavity
- generated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To realize a high-speed etching operation and to reduce the damage to a substrate by a method wherein a high-density plasma is generated by a plasma generation means using microwaves, a cavity is used as a cavity resonator of the microwaves and the diffusion of the generated plasma to its circumference is prevented by a magnetic field. CONSTITUTION:A plasma generation means 2 is installed in a vacuum tank 1 to be face to face with an etching electrode 6 to mount a substrate 5; microwaves are used to generate this plasma; a highdensity plasma is generated on the substrate 5; the diffusion of the plasma to its circumference is prevented by a magnetic-field generation means 16; ions in the plasma collide with the substrate 5 by using a voltage generated by the electric power which has been impressed on the etching electrode 6. During this process, a matching means 13 is installed at a cavity 12, the cavity 12 is used as a cavity resonator of the microwaves. By this setup, it is possible to obtain a sputter etching device whose etching speed is fast and which does not damage the substrate.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19820087A JPH0831443B2 (en) | 1987-08-10 | 1987-08-10 | Plasma processing device |
KR1019880008942A KR920002864B1 (en) | 1987-07-20 | 1988-07-18 | Apparatus for treating matrial by using plasma |
US07/221,272 US5021114A (en) | 1987-07-20 | 1988-07-19 | Apparatus for treating material by using plasma |
DE3854541T DE3854541T2 (en) | 1987-07-20 | 1988-07-20 | Method and device for treating a material by plasma. |
EP88111684A EP0300447B1 (en) | 1987-07-20 | 1988-07-20 | Method and apparatus for treating material by using plasma |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19820087A JPH0831443B2 (en) | 1987-08-10 | 1987-08-10 | Plasma processing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6442130A true JPS6442130A (en) | 1989-02-14 |
JPH0831443B2 JPH0831443B2 (en) | 1996-03-27 |
Family
ID=16387142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19820087A Expired - Lifetime JPH0831443B2 (en) | 1987-07-20 | 1987-08-10 | Plasma processing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0831443B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5762814A (en) * | 1990-09-28 | 1998-06-09 | Hitachi, Ltd. | Plasma processing method and apparatus using plasma produced by microwaves |
WO2003052807A1 (en) * | 2001-12-14 | 2003-06-26 | Tokyo Electron Limited | Plasma processor |
WO2024018960A1 (en) * | 2022-07-20 | 2024-01-25 | 東京エレクトロン株式会社 | Plasma processing device and plasma processing method |
-
1987
- 1987-08-10 JP JP19820087A patent/JPH0831443B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5762814A (en) * | 1990-09-28 | 1998-06-09 | Hitachi, Ltd. | Plasma processing method and apparatus using plasma produced by microwaves |
WO2003052807A1 (en) * | 2001-12-14 | 2003-06-26 | Tokyo Electron Limited | Plasma processor |
WO2024018960A1 (en) * | 2022-07-20 | 2024-01-25 | 東京エレクトロン株式会社 | Plasma processing device and plasma processing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0831443B2 (en) | 1996-03-27 |
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