JPS57192268A - Dry etching apparatus - Google Patents

Dry etching apparatus

Info

Publication number
JPS57192268A
JPS57192268A JP7624381A JP7624381A JPS57192268A JP S57192268 A JPS57192268 A JP S57192268A JP 7624381 A JP7624381 A JP 7624381A JP 7624381 A JP7624381 A JP 7624381A JP S57192268 A JPS57192268 A JP S57192268A
Authority
JP
Japan
Prior art keywords
cathode
magnetic
section
sample
closed loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7624381A
Other languages
Japanese (ja)
Inventor
Masaru Sasako
Hideaki Shimoda
Juichi Edamatsu
Juro Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7624381A priority Critical patent/JPS57192268A/en
Publication of JPS57192268A publication Critical patent/JPS57192268A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To increase the dry etching speed of the titled apparatus, by tapering off the upper surface outer peripheral section of a permanent magnet provided outside a magnetic field closed loop.
CONSTITUTION: A cathode 2 (a discharge electrode) of a non-magnetic material, or stainless steel, is opposed to a wall of a stainless decompression apparatus 1, and is connected via a matching circuit 3 with a high-frequency electric source 4. A magnetic means is provided in a non-contact state to the undersurface of the cathode 2, i.e. permanent magnets 10-aWe supported by iron pole piece 9 are arranged. The upper surface outer periphery section 37, that is, part of the magnetic means, of the permanent magnet outside the orthogonal magnetic field is tapered off. As a result, the electromagnetic field normal to the electric field at the section 37 becomes almost zero, the high-frequency electric power is predominantly consumed on the gap 15 to generate a lot of ions, and an arcuate magnetic line closed loop is formed over the surface of the cathode 2. The piece 9 is reciprocated by a motor 11 for a sample 12 on the cathode 2 to etch the desired whole surface of the sample 12.
COPYRIGHT: (C)1982,JPO&Japio
JP7624381A 1981-05-19 1981-05-19 Dry etching apparatus Pending JPS57192268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7624381A JPS57192268A (en) 1981-05-19 1981-05-19 Dry etching apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7624381A JPS57192268A (en) 1981-05-19 1981-05-19 Dry etching apparatus

Publications (1)

Publication Number Publication Date
JPS57192268A true JPS57192268A (en) 1982-11-26

Family

ID=13599733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7624381A Pending JPS57192268A (en) 1981-05-19 1981-05-19 Dry etching apparatus

Country Status (1)

Country Link
JP (1) JPS57192268A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810830A (en) * 1981-07-10 1983-01-21 Seiko Epson Corp Dry etching device
JPH04137926U (en) * 1991-06-18 1992-12-22 アラコ株式会社 infant seat
JP2001508923A (en) * 1997-01-17 2001-07-03 ユナキス・バルツェルス・アクチェンゲゼルシャフト Capacitively coupled RF plasma reaction chamber
JP2005026233A (en) * 1996-10-02 2005-01-27 Tokyo Electron Ltd Plasma processing device
JP2009231692A (en) * 2008-03-25 2009-10-08 Tokyo Electron Ltd Plasma processing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810830A (en) * 1981-07-10 1983-01-21 Seiko Epson Corp Dry etching device
JPH04137926U (en) * 1991-06-18 1992-12-22 アラコ株式会社 infant seat
JP2005026233A (en) * 1996-10-02 2005-01-27 Tokyo Electron Ltd Plasma processing device
JP2001508923A (en) * 1997-01-17 2001-07-03 ユナキス・バルツェルス・アクチェンゲゼルシャフト Capacitively coupled RF plasma reaction chamber
JP2009231692A (en) * 2008-03-25 2009-10-08 Tokyo Electron Ltd Plasma processing apparatus

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