JPS6441809A - Smoothness measuring apparatus - Google Patents
Smoothness measuring apparatusInfo
- Publication number
- JPS6441809A JPS6441809A JP19750887A JP19750887A JPS6441809A JP S6441809 A JPS6441809 A JP S6441809A JP 19750887 A JP19750887 A JP 19750887A JP 19750887 A JP19750887 A JP 19750887A JP S6441809 A JPS6441809 A JP S6441809A
- Authority
- JP
- Japan
- Prior art keywords
- light
- measured
- reflected
- light source
- becomes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
PURPOSE:To judge the smoothness of a surface to be measured, by accurately separating and measuring the sizes of two kinds of irregular patterns, which are located on the surface to be measured and have the different wavelengths. CONSTITUTION:A plane-wave light beam having a beam diameter 2e from a light supplying means 18 is condensed through a lens 16 and becomes a spherical wave beam. The light beam is inputted into a light path converting means 20 and split into two beams. The light is projected on a surface to be measured 12. The split reflected beam becomes a light source 10b and the beam is reflected with a mirror 24. The beam is further reflected by a beam splitter 26 and projected toward the surface to be measured 12. Meanwhile, the transmitted beam becomes a light source 10a and the beam is transmitted through the beam splitter 26. The beam is projected on the surface to be measured 12. The light beam from the light source 10a is used for measuring irregularities for a wavelength ds. The light beam from the light source 10b is used for measuring irregularities for a wavelength dl. The reflected light beams having the Fresnel diffraction patterns of said irregularities from the surface to be measured are detected with optoelectronic transducer means 28a and 28b. The results are inputted into an operating circuit 30. The sizes of the irregularity patterns having the two kinds of the waveforms, which are located on the surface to be measured 12, are separated and operated in the operating circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19750887A JPH0715377B2 (en) | 1987-08-07 | 1987-08-07 | Smoothness measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19750887A JPH0715377B2 (en) | 1987-08-07 | 1987-08-07 | Smoothness measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6441809A true JPS6441809A (en) | 1989-02-14 |
| JPH0715377B2 JPH0715377B2 (en) | 1995-02-22 |
Family
ID=16375639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19750887A Expired - Lifetime JPH0715377B2 (en) | 1987-08-07 | 1987-08-07 | Smoothness measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0715377B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109781037A (en) * | 2019-03-05 | 2019-05-21 | 华南农业大学 | A kind of high-precision laser sensor and laser control system with distance measurement function |
| CN113175875A (en) * | 2021-06-02 | 2021-07-27 | 厦门大学 | Device and method for measuring abrasion of cutting edge of male die based on linear laser extrusion molding |
-
1987
- 1987-08-07 JP JP19750887A patent/JPH0715377B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109781037A (en) * | 2019-03-05 | 2019-05-21 | 华南农业大学 | A kind of high-precision laser sensor and laser control system with distance measurement function |
| CN113175875A (en) * | 2021-06-02 | 2021-07-27 | 厦门大学 | Device and method for measuring abrasion of cutting edge of male die based on linear laser extrusion molding |
| CN113175875B (en) * | 2021-06-02 | 2023-01-24 | 厦门大学 | Device and method for measuring abrasion of cutting edge of male die based on linear laser extrusion molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0715377B2 (en) | 1995-02-22 |
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