JPS6441244A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6441244A JPS6441244A JP19761187A JP19761187A JPS6441244A JP S6441244 A JPS6441244 A JP S6441244A JP 19761187 A JP19761187 A JP 19761187A JP 19761187 A JP19761187 A JP 19761187A JP S6441244 A JPS6441244 A JP S6441244A
- Authority
- JP
- Japan
- Prior art keywords
- connecting hole
- wiring
- layer part
- whose
- wirings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To avoid the step-out of a wiring by obtaining a connecting hole whose sectional form is smooth, and improve the reliability of a device, by performing a weak anisotropic etching to form the connecting hole to connect the part between wirings. CONSTITUTION:On a first Al wiring 10, a plasma oxide film is grown as an interlayer insulating film 11. In order to make a connecting hole to connect the part between wirings, resist 12 is applied, and alignment and exposure are performed. A connecting hole is opened by a weak anisotropic etching 13. Since the upper layer part of the insulating film 11 is porous, whose etching rate is large, and its lower layer part is dense, whose etching rate is small as compared with the upper layer part, the end surface shape of the opened connecting hole becomes smooth. Thereby, the step-cut of a wiring 14 can be avoided, and the reliability of a device can thus be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19761187A JPS6441244A (en) | 1987-08-07 | 1987-08-07 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19761187A JPS6441244A (en) | 1987-08-07 | 1987-08-07 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6441244A true JPS6441244A (en) | 1989-02-13 |
Family
ID=16377350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19761187A Pending JPS6441244A (en) | 1987-08-07 | 1987-08-07 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6441244A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01186627A (en) * | 1988-01-14 | 1989-07-26 | Rohm Co Ltd | Preparation of passivation film of semiconductor device |
JPH03105923A (en) * | 1989-09-19 | 1991-05-02 | Nec Corp | Multilayer interconnection |
JPH09223737A (en) * | 1996-02-16 | 1997-08-26 | Nec Corp | Manufacture of semiconductor device |
US5752986A (en) * | 1993-11-18 | 1998-05-19 | Nec Corporation | Method of manufacturing a solid electrolytic capacitor |
WO2011004717A1 (en) * | 2009-07-06 | 2011-01-13 | シャープ株式会社 | Contact-hole forming method |
JP2012038965A (en) * | 2010-08-09 | 2012-02-23 | Lapis Semiconductor Co Ltd | Semiconductor device and manufacturing method of the same |
-
1987
- 1987-08-07 JP JP19761187A patent/JPS6441244A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01186627A (en) * | 1988-01-14 | 1989-07-26 | Rohm Co Ltd | Preparation of passivation film of semiconductor device |
JPH03105923A (en) * | 1989-09-19 | 1991-05-02 | Nec Corp | Multilayer interconnection |
US5752986A (en) * | 1993-11-18 | 1998-05-19 | Nec Corporation | Method of manufacturing a solid electrolytic capacitor |
JPH09223737A (en) * | 1996-02-16 | 1997-08-26 | Nec Corp | Manufacture of semiconductor device |
WO2011004717A1 (en) * | 2009-07-06 | 2011-01-13 | シャープ株式会社 | Contact-hole forming method |
JP2012038965A (en) * | 2010-08-09 | 2012-02-23 | Lapis Semiconductor Co Ltd | Semiconductor device and manufacturing method of the same |
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