JPS644093A - Manufacture of wiring substrate - Google Patents
Manufacture of wiring substrateInfo
- Publication number
- JPS644093A JPS644093A JP15910287A JP15910287A JPS644093A JP S644093 A JPS644093 A JP S644093A JP 15910287 A JP15910287 A JP 15910287A JP 15910287 A JP15910287 A JP 15910287A JP S644093 A JPS644093 A JP S644093A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- coil section
- plating
- spacing
- periphery side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To improve the space factor and the yield of a pattern wiring by forming a plating layer of high uniformity thereon, by providing on the outer peripheral part of the pattern wiring a dummy pattern adjacent thereto with a spacing substantially equal to the pattern spacing, and thereafter performing an electric plating, thereby preventing abnormal growth of the outer peripheral plating layer. CONSTITUTION:A pattern wiring 4 is formed of a coil section 6 as the effective product part and a dummy pattern 7 which adjoins externally of the coil section 6 with a spacing equal to the spacing a1 of the pattern wiring 4 constituting the coil section 6. The dummy pattern 7 may be formed as a pattern of a width similar to the pattern wiring 4 or it may be formed as a wide pattern. By forming the dummy pattern 7 as this, electric plating work conditions such as the circulation of the plating solution, etc., in the neighborhood of the pattern wiring 4 positioned at the outermost peripheral part of the coil 6 can be made the same in the inner periphery side and the outer periphery side of the coil section 6. Accordingly, the plating work conditions in the electric plating process can be made the same conditions throughout the coil section 6, whereby the growth of the plating layer in the inner periphery side and the outer periphery side of the coil section 6 can be made uniform.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62159102A JP2526586B2 (en) | 1987-06-26 | 1987-06-26 | Wiring board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62159102A JP2526586B2 (en) | 1987-06-26 | 1987-06-26 | Wiring board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS644093A true JPS644093A (en) | 1989-01-09 |
JP2526586B2 JP2526586B2 (en) | 1996-08-21 |
Family
ID=15686281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62159102A Expired - Lifetime JP2526586B2 (en) | 1987-06-26 | 1987-06-26 | Wiring board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2526586B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002271023A (en) * | 2001-03-12 | 2002-09-20 | Daiwa Kogyo:Kk | Method for forming columnar metal body and manufacturing method for multi-layer wiring board |
JP2002344117A (en) * | 2001-05-14 | 2002-11-29 | Cmk Corp | Method of forming fine pattern |
JP2008028337A (en) * | 2006-07-25 | 2008-02-07 | Shinko Electric Ind Co Ltd | Method of manufacturing electronic component |
JP2014080674A (en) * | 2012-09-27 | 2014-05-08 | Tdk Corp | Anisotropic plating method and thin film coil |
JP2016009854A (en) * | 2014-06-26 | 2016-01-18 | 住友電工プリントサーキット株式会社 | Printed wiring board, electronic component, and method for manufacturing printed wiring board |
JP2017095738A (en) * | 2015-11-18 | 2017-06-01 | 豊田合成株式会社 | Resin plated product and production method thereof |
CN117406547A (en) * | 2023-12-15 | 2024-01-16 | 合肥晶合集成电路股份有限公司 | Pseudo-pattern structure of photomask and photomask |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101514499B1 (en) * | 2012-03-15 | 2015-04-22 | 삼성전기주식회사 | Method for manufacturing common mode filter and common mode filter |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5938068U (en) * | 1982-09-01 | 1984-03-10 | 株式会社サンメイト倉持 | book case |
JPS62196891A (en) * | 1986-02-24 | 1987-08-31 | 三菱電機株式会社 | Manufacture of printed wiring board |
-
1987
- 1987-06-26 JP JP62159102A patent/JP2526586B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5938068U (en) * | 1982-09-01 | 1984-03-10 | 株式会社サンメイト倉持 | book case |
JPS62196891A (en) * | 1986-02-24 | 1987-08-31 | 三菱電機株式会社 | Manufacture of printed wiring board |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002271023A (en) * | 2001-03-12 | 2002-09-20 | Daiwa Kogyo:Kk | Method for forming columnar metal body and manufacturing method for multi-layer wiring board |
JP2002344117A (en) * | 2001-05-14 | 2002-11-29 | Cmk Corp | Method of forming fine pattern |
JP2008028337A (en) * | 2006-07-25 | 2008-02-07 | Shinko Electric Ind Co Ltd | Method of manufacturing electronic component |
JP2014080674A (en) * | 2012-09-27 | 2014-05-08 | Tdk Corp | Anisotropic plating method and thin film coil |
JP2016009854A (en) * | 2014-06-26 | 2016-01-18 | 住友電工プリントサーキット株式会社 | Printed wiring board, electronic component, and method for manufacturing printed wiring board |
JP2017095738A (en) * | 2015-11-18 | 2017-06-01 | 豊田合成株式会社 | Resin plated product and production method thereof |
CN117406547A (en) * | 2023-12-15 | 2024-01-16 | 合肥晶合集成电路股份有限公司 | Pseudo-pattern structure of photomask and photomask |
CN117406547B (en) * | 2023-12-15 | 2024-04-05 | 合肥晶合集成电路股份有限公司 | Pseudo-pattern structure of photomask and photomask |
Also Published As
Publication number | Publication date |
---|---|
JP2526586B2 (en) | 1996-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080614 Year of fee payment: 12 |