JPS644093A - Manufacture of wiring substrate - Google Patents

Manufacture of wiring substrate

Info

Publication number
JPS644093A
JPS644093A JP15910287A JP15910287A JPS644093A JP S644093 A JPS644093 A JP S644093A JP 15910287 A JP15910287 A JP 15910287A JP 15910287 A JP15910287 A JP 15910287A JP S644093 A JPS644093 A JP S644093A
Authority
JP
Japan
Prior art keywords
pattern
coil section
plating
spacing
periphery side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15910287A
Other languages
Japanese (ja)
Other versions
JP2526586B2 (en
Inventor
Yoshio Watanabe
Kenji Osawa
Kunihiko Tokura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62159102A priority Critical patent/JP2526586B2/en
Publication of JPS644093A publication Critical patent/JPS644093A/en
Application granted granted Critical
Publication of JP2526586B2 publication Critical patent/JP2526586B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To improve the space factor and the yield of a pattern wiring by forming a plating layer of high uniformity thereon, by providing on the outer peripheral part of the pattern wiring a dummy pattern adjacent thereto with a spacing substantially equal to the pattern spacing, and thereafter performing an electric plating, thereby preventing abnormal growth of the outer peripheral plating layer. CONSTITUTION:A pattern wiring 4 is formed of a coil section 6 as the effective product part and a dummy pattern 7 which adjoins externally of the coil section 6 with a spacing equal to the spacing a1 of the pattern wiring 4 constituting the coil section 6. The dummy pattern 7 may be formed as a pattern of a width similar to the pattern wiring 4 or it may be formed as a wide pattern. By forming the dummy pattern 7 as this, electric plating work conditions such as the circulation of the plating solution, etc., in the neighborhood of the pattern wiring 4 positioned at the outermost peripheral part of the coil 6 can be made the same in the inner periphery side and the outer periphery side of the coil section 6. Accordingly, the plating work conditions in the electric plating process can be made the same conditions throughout the coil section 6, whereby the growth of the plating layer in the inner periphery side and the outer periphery side of the coil section 6 can be made uniform.
JP62159102A 1987-06-26 1987-06-26 Wiring board manufacturing method Expired - Lifetime JP2526586B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159102A JP2526586B2 (en) 1987-06-26 1987-06-26 Wiring board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159102A JP2526586B2 (en) 1987-06-26 1987-06-26 Wiring board manufacturing method

Publications (2)

Publication Number Publication Date
JPS644093A true JPS644093A (en) 1989-01-09
JP2526586B2 JP2526586B2 (en) 1996-08-21

Family

ID=15686281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159102A Expired - Lifetime JP2526586B2 (en) 1987-06-26 1987-06-26 Wiring board manufacturing method

Country Status (1)

Country Link
JP (1) JP2526586B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271023A (en) * 2001-03-12 2002-09-20 Daiwa Kogyo:Kk Method of forming columnar metal body and method of manufacturing multilayer wiring board
JP2002344117A (en) * 2001-05-14 2002-11-29 Cmk Corp Fine pattern formation method
JP2008028337A (en) * 2006-07-25 2008-02-07 Shinko Electric Ind Co Ltd Manufacturing method of electronic parts
JP2014080674A (en) * 2012-09-27 2014-05-08 Tdk Corp Anisotropic plating method and thin film coil
JP2016009854A (en) * 2014-06-26 2016-01-18 住友電工プリントサーキット株式会社 Printed wiring board, electronic component, and printed wiring board manufacturing method
JP2017095738A (en) * 2015-11-18 2017-06-01 豊田合成株式会社 Resin plated product and production method thereof
CN117406547A (en) * 2023-12-15 2024-01-16 合肥晶合集成电路股份有限公司 Pseudo-graphic structure of photomask and photomask

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101514499B1 (en) * 2012-03-15 2015-04-22 삼성전기주식회사 Method for manufacturing common mode filter and common mode filter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938068U (en) * 1982-09-01 1984-03-10 株式会社サンメイト倉持 book case
JPS62196891A (en) * 1986-02-24 1987-08-31 三菱電機株式会社 Printed wiring board manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938068U (en) * 1982-09-01 1984-03-10 株式会社サンメイト倉持 book case
JPS62196891A (en) * 1986-02-24 1987-08-31 三菱電機株式会社 Printed wiring board manufacturing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271023A (en) * 2001-03-12 2002-09-20 Daiwa Kogyo:Kk Method of forming columnar metal body and method of manufacturing multilayer wiring board
JP2002344117A (en) * 2001-05-14 2002-11-29 Cmk Corp Fine pattern formation method
JP2008028337A (en) * 2006-07-25 2008-02-07 Shinko Electric Ind Co Ltd Manufacturing method of electronic parts
JP2014080674A (en) * 2012-09-27 2014-05-08 Tdk Corp Anisotropic plating method and thin film coil
JP2016009854A (en) * 2014-06-26 2016-01-18 住友電工プリントサーキット株式会社 Printed wiring board, electronic component, and printed wiring board manufacturing method
JP2017095738A (en) * 2015-11-18 2017-06-01 豊田合成株式会社 Resin plated product and production method thereof
CN117406547A (en) * 2023-12-15 2024-01-16 合肥晶合集成电路股份有限公司 Pseudo-graphic structure of photomask and photomask
CN117406547B (en) * 2023-12-15 2024-04-05 合肥晶合集成电路股份有限公司 Pseudo-pattern structure of photomask and photomask

Also Published As

Publication number Publication date
JP2526586B2 (en) 1996-08-21

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