JPS62196891A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS62196891A JPS62196891A JP3858886A JP3858886A JPS62196891A JP S62196891 A JPS62196891 A JP S62196891A JP 3858886 A JP3858886 A JP 3858886A JP 3858886 A JP3858886 A JP 3858886A JP S62196891 A JPS62196891 A JP S62196891A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- electroplating
- conductor
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004020 conductor Substances 0.000 claims description 29
- 238000009713 electroplating Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000012141 concentrate Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野Ｊ この発明は接栓部を有する印刷配線板にお（ハて。[Detailed description of the invention] [Industrial Application Field J This invention relates to a printed wiring board having a plug part.
接栓部のめつき厚を均一化することにより、−品質な接
栓部とする印刷配線板の製造方法に関するものである。The present invention relates to a method of manufacturing a printed wiring board that provides a high-quality plug by making the plating thickness of the plug uniform.
〔従来の技術」
第４図は接栓部を有する印刷配線板の従来の製造方法を
示し１図において、（１）は端部に複数１例えば３１ケ
所の接栓（２）で構成される接栓部を有する印刷配線板
本体、（３）はこの印刷配線板本体（１１に破線部で連
なシ接栓（２）の電気めっき用の導体（４）が設けられ
た印刷配線板付加部である。（５）は印刷配線板付加部
（３）にあり上記接栓（２）と導体（４）とを結んだリ
ード線である。上記接栓（２＋、 電気めつき用導体
（４）およびリード線（５）は銅箔パターンとしてガラ
スエポキシ等の絶縁基材上に設けられている。[Prior art] Figure 4 shows a conventional manufacturing method for a printed wiring board having connectors. In Figure 1, (1) is composed of connectors (2) at a plurality of locations, for example, 31 locations, at the end. A printed wiring board main body having a plug part, (3) is a printed wiring board addition provided with a conductor (4) for electroplating of a plug (2) connected to the printed wiring board main body (11 by the broken line part) (5) is a lead wire that is located in the printed wiring board addition section (3) and connects the above-mentioned plug (2) and the conductor (4). 4) and lead wires (5) are provided as copper foil patterns on an insulating base material such as glass epoxy.
従来は以上のように、接栓部を有する印刷配線板本体（
１）に近接した印刷配線板付加部（３）に電気めっき用
の導体（４）を設け、この導体（４）から各接栓（２）
にリード線（５）を設けて電気的接続可能にした後。Conventionally, as described above, a printed wiring board body (
A conductor (4) for electroplating is provided on the printed wiring board attachment part (3) close to 1), and a conductor (4) is connected to each plug (2) from this conductor (4).
After providing a lead wire (5) to enable electrical connection.
電解液に浸し導体（４）からリード＠ Ｌ５１を経由し
て接栓（２）に通電して電気めっきした後、破線部から
印刷配線板付〃口部（３）を切断し、所定の形状の印刷
配線板に仕上げていた。第５図は従来の方法で金めつき
した接栓部のめつき厚の分布図である。横軸は接栓の番
号で３１ケ所の接栓（２）の位置を示し。After immersing it in an electrolytic solution and electroplating by applying electricity from the conductor (4) to the plug (2) via the lead @ L51, cut the opening (3) with the printed wiring board from the broken line part and cut it into a predetermined shape. It was finished on a printed wiring board. FIG. 5 is a distribution diagram of the plating thickness of a plug portion plated with gold using a conventional method. The horizontal axis shows the positions of the 31 plugs (2) with the plug numbers.
縦軸はメッキ厚を示す。図中のＯ印は６面（部品実装面
）、Ｘ印は８面（ハンダ面）であり、平均厚さ１．８３
μｍ、標準偏差０．１２７でメッキされている。The vertical axis indicates plating thickness. The O mark in the figure is the 6th side (component mounting side), the X mark is the 8th side (solder side), and the average thickness is 1.83
Plated with a standard deviation of 0.127 μm.
この時、めっき電流密度はｔ２ｘ／ａゴ、めっき時間は
１５分で比重７〜１０″Ｂｅ（ボーメ） 、 ＰＨ３，
５〜４．０．余分６〜１ｏ ｇ／ｅの金めつき液中で電
気めっきしたものである。At this time, the plating current density was t2x/a, the plating time was 15 minutes, and the specific gravity was 7 to 10''Be (Baume), PH3,
5-4.0. It was electroplated in a gold plating solution with an excess of 6 to 1 og/e.
〔発明が解決しようとする問題点」
従来の印刷配線板の製造方法は以上のように実施されて
いたため１例えば第５図に示すＡ１またはＡ３１ の
両端の接栓（２）では、１１Ｅ気めっき時に電流が集中
し、電流密度が高くなるため、他の接栓に比べてめっき
厚が必要以上に厚くなるという問題点があった。またこ
の高′電流密度状態でめっきされた接栓にはピット（め
っき部のへこみ）が発生し１品質が低下するという問題
点もあった。[Problems to be Solved by the Invention] Since the conventional printed wiring board manufacturing method was carried out as described above, 1. For example, in the connectors (2) at both ends of A1 or A31 shown in FIG. 5, 11E plating was applied. At times, the current concentrates and the current density becomes high, which causes the problem that the plating becomes thicker than necessary compared to other plugs. There is also the problem that pits (dents in the plated area) occur in plugs plated under this high current density condition, resulting in a decrease in quality.
Ｃの発明による方法は上記のような問題点を解決するた
めになされたもので、電気めっき時における印刷配線板
の各接栓に流れる゛［を流密度を均一化することにより
めっき厚を均一にし１合わせてピットの発生を押えた印
刷配線板の製造方法を得ることを目的とする。The method according to the invention of C was made to solve the above-mentioned problems, and it is possible to make the plating thickness uniform by equalizing the flow density of the flow to each connector of the printed wiring board during electroplating. An object of the present invention is to obtain a method for manufacturing a printed wiring board that suppresses the occurrence of pits.
この発明による製造方法は端部に多数の接栓部を有する
印刷配線板本体と、この本体の外側に一体成形され、接
栓部の電気めっき用導体路が設けられた印刷配線板付加
部とからなる基材を設け。The manufacturing method according to the present invention includes a printed wiring board main body having a large number of plugs at the end thereof, a printed wiring board additional part integrally molded on the outside of this main body, and provided with conductor paths for electroplating of the plugs. A base material consisting of is provided.
印刷配線板付加部に電気めっき用導体と電気的に接続し
、最外側に位置する′ｉｌＥ流来中用の付加導体路を備
えて電気めっき後、印刷配線板付加部を取り除く製造方
法である。This is a manufacturing method in which the added part of the printed wiring board is electrically connected to the conductor for electroplating, and an additional conductor path for flowing 'ILE located at the outermost side is provided, and the added part of the printed wiring board is removed after electroplating. .
この発明に係る製造方法は、電解液に浸し電気めっき時
、電気密度が高くなる付加導体路を最外側接栓部の外側
に近接し印刷配線板付加部における導体に連続して設け
、電気めっき時の高電流密度発生部を付加導体路に集中
させることにより接栓部の電流誓度上昇を防止し、均一
なめつき厚の接栓を持つ印刷配線板を製造する。The manufacturing method according to the present invention provides an additional conductor path that increases the electrical density during electroplating by immersing it in an electrolytic solution and providing it in close proximity to the outside of the outermost plug part and continuous with the conductor in the additional part of the printed wiring board. By concentrating the high current density generation portion on the additional conductor path, an increase in current density at the plug portion is prevented, and a printed wiring board having a plug with a uniform plating thickness is manufactured.
第１図はこの発明の一実施例による方法で接栓部を有す
る印刷配線板を製造する方法を示し、（ｌ）〜（５）は
従来例において説明したものと同一である。FIG. 1 shows a method of manufacturing a printed wiring board having a plug according to an embodiment of the present invention, and (l) to (5) are the same as those described in the conventional example.
（６）は電気めっき後に取シ除かれる印刷配線板付加部
（３）の電気めっき用導体（４）と電気的に接続され。(6) is electrically connected to the electroplating conductor (4) of the printed wiring board attachment part (3) which is removed after electroplating.
かつ最外側に位置する接栓（２）の外側にそれと並行し
て位置するように設けられた電流集中用の付加導体路で
、銅箔パターンで構成される。An additional conductor path for current concentration is provided outside and parallel to the outermost connector (2), and is made of a copper foil pattern.
この発明の一実施例による製造方法は以上のように従来
と同様な導体（４）、リード線（５）を設けた後。The manufacturing method according to an embodiment of the present invention is as described above, after providing the conductor (4) and lead wire (5) as in the conventional case.
印刷配線板付加部（３）に電流集中用の付加導体路（６
）を設け、電Ｓ液に浸し全電気めっきする。導体（４）
から通電し電気めっきすると、付加導体路（６）には電
気めっき時に電流が集中し、電流密度が高くなり、めっ
き厚が厚くなる。接栓部においては１例えば第２図に示
す接栓位置と金めっき厚６を示すグラフのように、従来
に比べ均一化された厚きでめっきされている。第２図は
３１ケ所の谷接栓のめつき後の厚さを示すグラフであり
、Ｏ印は６面（部品実装面）、Ｘ印は３面（ハンダ面）
における金めつき厚である。この例では従来と同じ電流
密匿１．２人／ｄフイ、めっき時間１５分で、比重７〜
１Ｇ”Ｂｅ（ボーメ） 、 ＰＩ（３，５〜４． Ｏ
、余分６〜１０ｙ、Ｑ の金めつき液中で金めつきし
たものであυ。An additional conductor path (6) for current concentration is attached to the printed wiring board additional part (3).
), immerse it in an electrolytic S solution, and perform full electroplating. Conductor (4)
When electroplating is performed by applying current to the additional conductor path (6), current concentrates on the additional conductor path (6) during electroplating, the current density increases, and the plating thickness increases. The plug portion is plated with a more uniform thickness than the conventional one, as shown in the graph showing the plug position and gold plating thickness 6 shown in FIG. 2, for example. Figure 2 is a graph showing the thickness of 31 valley plugs after plating, with O marks on 6 sides (component mounting side) and X marks on 3 sides (solder side).
The gold plating thickness is . In this example, the current density is 1.2 people/d, the same as before, the plating time is 15 minutes, and the specific gravity is 7 to 7.
1G”Be (Baume), PI (3,5~4.O
, extra 6~10y, gold plated in Q gold plating solution υ.
平均厚さ１．７５μｍＴ ＊準偏差０．０５４で金め
つきされている。これにより、従来に比べ少ない標準偏
差値、すなわち、より安定して金めつきできることがわ
かる。また、ピットの発生も防止され、印刷配線板付加
部（３）ｔ″取り除くことにより、所定の印刷配線板が
得られる。Gold plated with average thickness 1.75μmT * standard deviation 0.054. It can be seen that this results in a smaller standard deviation value than in the past, that is, more stable gold plating. In addition, the occurrence of pits is also prevented, and by removing the printed wiring board additional portion (3) t'', a desired printed wiring board can be obtained.
また、第３図に示すように電気めっき後に取り除かれる
印刷配線板付加部（３）において、最外側に位置する接
栓（２）の外側近傍で、かつそれと並行して位置する部
分に設けられた電気めっき用導体（４）の両１１１１１
を脹らませて電流集中用の付加導体路（６）を設けても
、電気めっき時、この何カ０４体路（６）部に゛電流が
集中し、接栓は安定した状態で金めつきてれ、印刷配線
板付加部（３）ヲ取り除くことにより。In addition, as shown in Fig. 3, in the printed wiring board attachment part (3) that is removed after electroplating, it is provided near the outside of and parallel to the outermost plug (2). Both 11111 of electroplating conductor (4)
Even if an additional conductor path (6) is provided for current concentration by expanding the 04, the current will concentrate on this body path (6) during electroplating, and the connector will remain gold-plated in a stable state. By removing the printed wiring board attachment part (3).
所定の印刷配線板が得られる。A predetermined printed wiring board is obtained.
この発明は以上説明したように、端部に多数の接栓部を
有する印刷配線板本体と、この本体の外側に一体成形ぢ
れ接栓部の電気めっき用導体路が設けられた印刷配線板
付加部とからなる基材を設け、印刷配線板付加部に電気
めつき用導体と電気的に接続し、最外側に位置する電流
集中用の付加導体路を備えて電気めつき後、印刷配線板
付加部を取り除く製造方法としたので、各接栓の金めつ
き時における電流密度が一定となシ、めっき厚が平均化
され、安定した品質の印刷配線板が得られる効果がある
。また、％接栓におけるビットの発生が減少し、安定し
た品質の印刷配線板が得られる効果がある。As explained above, the present invention comprises a printed wiring board main body having a large number of plugs at the end thereof, and a printed wiring board provided with conductor paths for electroplating of the plugs formed integrally on the outside of the main body. A base material consisting of an additional part is provided, the conductor for electroplating is electrically connected to the additional part of the printed wiring board, and an additional conductor path for current concentration is provided on the outermost side. After electroplating, the printed wiring is Since the manufacturing method removes the additional plate portion, the current density during gold plating of each connector is constant, the plating thickness is averaged, and a printed wiring board of stable quality can be obtained. In addition, the occurrence of bits in the plugs is reduced, and a printed wiring board of stable quality can be obtained.
第１図はこの発明の一実施例による印刷配線板の製造過
程を示す部分拡大図、第２図はこの発明の一実施例によ
る印刷配線板の製造方法で製造した印刷配線板の接栓の
めつき厚分布を示す図、第３図はこの発明の他の実施例
による印刷配線板の製造過程を示す部分拡大図である。
第４図は従来例による印刷配線板の製造過程を示す部分
拡大図。
第５図は従来の例による印刷配線板の製造方法で製造し
た印刷配線板の接栓のめっき厚分布を示す図である。
図において、（１）は印刷配線板本体、（２）は接栓。
（３）は印刷配線板付加部、（４）は導体、（５）はリ
ード線。
（６）は付加導体路である。
各図中、同一符号は同一または相当部分を示す。FIG. 1 is a partially enlarged view showing the manufacturing process of a printed wiring board according to an embodiment of the invention, and FIG. FIG. 3, which shows the plating thickness distribution, is a partially enlarged view showing the manufacturing process of a printed wiring board according to another embodiment of the present invention. FIG. 4 is a partially enlarged view showing the manufacturing process of a conventional printed wiring board. FIG. 5 is a diagram showing the plating thickness distribution of a plug on a printed wiring board manufactured by a conventional method for manufacturing a printed wiring board. In the figure, (1) is the printed wiring board body, and (2) is the plug. (3) is a printed wiring board attachment part, (4) is a conductor, and (5) is a lead wire. (6) is an additional conductor path. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
本体の外側に一体成形され、接栓部の電気めつき用導体
路が設けられた印刷配線板付加部とからなる基材を備え
、上記接栓部の電気めつき後、上記印刷配線板付加部を
取り除くようにした印刷配線板の製造方法において、印
刷配線板付加部に電気めつき用導体と電気的に接続して
設けられ、かつ最外側に位置する接栓部の外側に近接し
て位置する電流集中用の付加導体路を備えたことを特徴
とする印刷配線板の製造方法。A base material consisting of a printed wiring board main body having a large number of plugs at the end, and a printed wiring board additional part integrally molded on the outside of this main body and provided with conductor paths for electroplating of the plugs. In the method for manufacturing a printed wiring board, in which the printed wiring board attachment part is removed after electroplating the plugging part, the printed wiring board attachment part is electrically connected to a conductor for electroplating. 1. A method for manufacturing a printed wiring board, comprising: an additional conductor path for current concentration located close to the outside of the outermost plug portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3858886A JPS62196891A (en) | 1986-02-24 | 1986-02-24 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3858886A JPS62196891A (en) | 1986-02-24 | 1986-02-24 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62196891A true JPS62196891A (en) | 1987-08-31 |
Family
ID=12529457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3858886A Pending JPS62196891A (en) | 1986-02-24 | 1986-02-24 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62196891A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS644093A (en) * | 1987-06-26 | 1989-01-09 | Sony Corp | Manufacture of wiring substrate |
| JPH0380592A (en) * | 1989-08-24 | 1991-04-05 | Ibiden Co Ltd | Manufacture of printed wiring board |
-
1986
- 1986-02-24 JP JP3858886A patent/JPS62196891A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS644093A (en) * | 1987-06-26 | 1989-01-09 | Sony Corp | Manufacture of wiring substrate |
| JPH0380592A (en) * | 1989-08-24 | 1991-04-05 | Ibiden Co Ltd | Manufacture of printed wiring board |
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